公开(公告)号：US20140329392A1

公开(公告)日：2014-11-06

申请号：US14333829

申请日：2014-07-17

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： William Robert MORRISON ,  Mark Christopher FISHER ,  Murali HANABE ,  Ganapathy Subramaniam SIVAKUMAR ,  Simon Joshua JACOBS

IPC: B81C1/00 ,  H01L21/02

CPC classification number: B81C1/00984 ,  B81B3/0005 ,  B81B7/0032 ,  B81C1/00261 ,  B81C1/0096 ,  B81C2201/112 ,  H01L21/02112 ,  H04W4/02 ,  Y10S257/914

Abstract: A device has a microelectromechanical system (MEMS) component with at least one surface and a coating disposed on at least a portion of the surface. The coating has a compound of the formula M(CnF2n+1Or), wherein M is a polar head group and wherein n≧2r. The value of n may range from 2 to about 20, and the value of r may range from 1 to about 10. The value of n plus r may range from 3 to about 30, and a ratio of n:r may have a value of about 2:1 to about 20:1.

Abstract translation: 器件具有微机电系统（MEMS）部件，其中至少一个表面和涂层设置在表面的至少一部分上。 该涂层具有式M（C n F 2n + 10）的化合物，其中M是极性头基，其中n≥2r。 n的值可以在2至约20的范围内，并且r的值可以在1至约10的范围内.n加r的值可以在3至约30的范围内，并且n：r的比可以具有值 为约2：1至约20：1。

公开(公告)号：US20130098675A1

公开(公告)日：2013-04-25

申请号：US13279132

申请日：2011-10-21

Applicant: Jan Bos ,  David Heald ,  Yen Hua Lin ,  Yung-Wei Lai ,  Jui-Chih Liao ,  Yoke-Hou Tan ,  Nageswara Tadepalli ,  Yan Du ,  Jianwei Liu ,  Richard Pietri

Inventor： Jan Bos ,  David Heald ,  Yen Hua Lin ,  Yung-Wei Lai ,  Jui-Chih Liao ,  Yoke-Hou Tan ,  Nageswara Tadepalli ,  Yan Du ,  Jianwei Liu ,  Richard Pietri

IPC: H05K7/00 ,  B05D5/12

CPC classification number: G02B26/001 ,  B81B3/0005 ,  B81C1/00285 ,  B81C2201/112

Abstract: This disclosure provides apparatus, systems and methods for manufacturing electromechanical systems (EMS) packages. One method includes making an EMS package that includes an out-gassable anti-stiction coating. The anti-stiction coating may be a solvent that is included within part of a desiccant mixture. In some implementations, the method includes sealing an EMS device into a package and then heating the package using a temperature profile that out-gasses at least a portion of a residual solvent. The method may include an incubation bake cycle to distribute anti stiction material to display elements within the EMS package. The incubation bake cycle may also more evenly distribute contaminants within the EMS package so as to reduce their effects.

Abstract translation: 本公开提供了用于制造机电系统（EMS）封装的装置，系统和方法。 一种方法包括制造包含无气体防粘涂层的EMS包装。 抗静电涂层可以是包含在干燥剂混合物的一部分内的溶剂。 在一些实施方式中，该方法包括将EMS装置密封到包装中，然后使用排出至少一部分残留溶剂的温度分布来加热包装。 该方法可以包括孵育烘烤循环，以将抗静电材料分配到EMS包装内的显示元件。 温育烘烤循环还可以更均匀地分布EMS包装内的污染物，以减少其影响。

公开(公告)号：US08410690B2

公开(公告)日：2013-04-02

申请号：US12371302

申请日：2009-02-13

Applicant: Bangalore R. Natarajan ,  Evgeni Gousev ,  Kristopher A. Lavery

Inventor： Bangalore R. Natarajan ,  Evgeni Gousev ,  Kristopher A. Lavery

IPC: B01J20/00

CPC classification number: B01J20/2808 ,  B01D53/261 ,  B01D53/28 ,  B01D2253/108 ,  B01J20/18 ,  B01J20/183 ,  B01J20/2803 ,  B01J2220/42 ,  B81B2201/047 ,  B81C1/00285 ,  B81C2201/112 ,  H01L23/26 ,  H01L51/5259 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1433 ,  Y10T156/10 ,  H01L2924/00

Abstract: Systems and methods for providing MEMS devices with integrated desiccant are provided. In one embodiment, a dry composition comprising desiccant is impact sprayed onto the backplate or substrate of a MEMS device, and becomes fused with the substrate. In another embodiment, the desiccant is impact sprayed such that the desiccant adheres to the impact sprayed surface. In yet another embodiment, the impact-sprayed surface is impregnated with the desiccant. In still another embodiment, the desiccant is combined with a suitable inorganic binder, then impact sprayed such that the desiccant adheres to the impact sprayed surface. In yet a further embodiment, the desiccant is micronized or pulverized into a powder of desired particle size, and then impact sprayed onto a surface. Thus, the desiccant particles or powder are fused onto the target surface through the impact spraying process.

Abstract translation: 提供了提供MEMS器件集成干燥剂的系统和方法。 在一个实施方案中，将包含干燥剂的干组合物冲击喷射到MEMS装置的背板或基板上，并与基底熔合。 在另一个实施方案中，干燥剂被冲击喷雾，使得干燥剂粘附到冲击喷涂表面上。 在另一个实施例中，冲击喷射表面用干燥剂浸渍。 在另一个实施方案中，将干燥剂与合适的无机粘合剂组合，然后冲洗喷雾，使得干燥剂粘附到冲击喷涂表面。 在又一个实施方案中，干燥剂被微粉化或粉碎成所需粒度的粉末，然后冲击喷涂到表面上。 因此，干燥剂颗粒或粉末通过冲击喷涂工艺熔合到目标表面上。

公开(公告)号：US20120141800A1

公开(公告)日：2012-06-07

申请号：US13377320

申请日：2010-06-03

Applicant: Detlef Steinmüller ,  Doris Steinmüller ,  Herwig Drexel ,  Slimane Ghodbane ,  David Richard ,  Pierre Cusin

Inventor： Detlef Steinmüller ,  Doris Steinmüller ,  Herwig Drexel ,  Slimane Ghodbane ,  David Richard ,  Pierre Cusin

IPC: B32B9/00 ,  H01B1/04 ,  C23C14/48 ,  B05D5/12 ,  C23C16/27

CPC classification number: C23C16/277 ,  B81B3/0008 ,  B81B2201/035 ,  B81C2201/112 ,  C23C16/27 ,  C23C16/56 ,  G04D3/0074 ,  Y10T428/30

Abstract: Method for coating micromechanical components of a micromechanical system, in particular a watch movement, comprising: providing a substrate component to be coated; providing said component with a diamond coating; wherein said diamond coating conductivity is increased in order to reduce dust attraction by the coated component when used in said micromechanical system. Corresponding micromechanical components and systems are also provided.

Abstract translation: 用于涂覆微机械系统的微机械部件的方法，特别是手表机芯，包括：提供待涂覆的基底部件; 向所述部件提供金刚石涂层; 其中所述金刚石涂层的导电性增加，以便在所述微机械系统中使用时减少所涂覆的部件的吸尘。 还提供了相应的微机械部件和系统。

公开(公告)号：US08193069B2

公开(公告)日：2012-06-05

申请号：US10565621

申请日：2004-07-15

Applicant: Hubert Moriceau ,  Bernard Aspar ,  Jacques Margail

Inventor： Hubert Moriceau ,  Bernard Aspar ,  Jacques Margail

IPC: H01L21/76

CPC classification number: B81B3/001 ,  B81C2201/112 ,  H01L21/76251 ,  H01L21/76256

Abstract: The invention relates to a method of producing a stacked structure. The inventive method comprises the following steps consisting in: a) using a first plate (1) which is, for example, made from silicon, and a second plate (5) which is also, for example, made from silicon, such that at least one of said first (1) and second (5) plates has, at least in part, a surface (2; 7) that cannot bond to the other plate; b) providing a surface layer (3; 8), which is, for example, made from silicon oxide, on at least one part of the surface (2) of the first plate and/or the surface (7) of the second plate (5); and c) bonding the two plates (1; 5) to one another. The aforementioned bonding incompatibility can, for example, result from the physicochemical nature of the surface or of a coating applied thereto, or from a roughness value (r′2, r′7) which is greater than a predetermined threshold. The invention also relates to a stacked structure produced using the inventive method.

Abstract translation: 本发明涉及一种堆叠结构的制造方法。 本发明的方法包括以下步骤：a）使用例如由硅制成的第一板（1）和例如由硅制成的第二板（5），使得在 至少部分地，所述第一（1）和第二（5）板中的至少一个具有不能结合到另一个板的表面（2; 7） b）在第一板的表面（2）和/或第二板的表面（7）的至少一部分上提供例如由氧化硅制成的表面层（3; 8） （5）; 和c）将两个板（1; 5）彼此粘合。 上述粘合不相容性例如可以由表面或施加于其上的涂层的物理化学性质或者大于预定阈值的粗糙度值（r'2，r'7）产生。 本发明还涉及使用本发明方法制造的堆叠结构。

公开(公告)号：US08137569B2

公开(公告)日：2012-03-20

申请号：US12409007

申请日：2009-03-23

Applicant: Oliver Harnack ,  Jurina Wessels ,  Akio Yasuda ,  James Clarke ,  Terry Reid

Inventor： Oliver Harnack ,  Jurina Wessels ,  Akio Yasuda ,  James Clarke ,  Terry Reid

IPC: B81C1/00 ,  B01D67/00

CPC classification number: B01D69/10 ,  B01D69/105 ,  B01D69/144 ,  B81B2201/058 ,  B81B2203/0127 ,  B81C1/00087 ,  B81C2201/112 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24967 ,  Y10T428/24975 ,  Y10T428/249961

Abstract: A method of fabricating a membrane having a tapered pore, a polymeric membrane having a tapered pore, and uses of such polymeric membrane are disclosed. The membrane includes apertures of increasing diameter which are aligned with each other to form the tapered pore.

Abstract translation: 公开了制造具有锥形孔的膜的方法，具有锥形孔的聚合物膜和这种聚合物膜的用途。 膜包括直径增加的孔，其彼此对准以形成锥形孔。

公开(公告)号：US20110188104A1

公开(公告)日：2011-08-04

申请号：US13001197

申请日：2009-06-25

Applicant: Hiroaki Tachibana ,  Hiroshi Noge ,  Kiyohiko Kawano ,  Hideki Ueda

Inventor： Hiroaki Tachibana ,  Hiroshi Noge ,  Kiyohiko Kawano ,  Hideki Ueda

IPC: G02B26/10 ,  H02N1/00 ,  F16C11/04

CPC classification number: B81B3/0051 ,  B81B2201/042 ,  B81C2201/112 ,  B81C2203/0118 ,  B81C2203/031 ,  G02B26/0841 ,  H02N1/006 ,  Y10T403/32557

Abstract: In a semiconductor mechanical structure, hinges may not be broken even when a mechanical shock is applied from outside, and thus, crashworthy is enhanced. A light scanning mirror includes a moving plate, a twin hinges constituting an axis of swing motion of the moving plate wherein an end of each hinge is connected to both ends of the moving plate, a stationary frame which is disposed to surround peripheries of the moving plate and supports another end of each of the twin hinges, and stoppers formed on the stationary frame. When the moving plate displaces in a lateral direction, the stopper contacts a side end portion of a recess of the moving plate, so that the displacement of the moving plate in the lateral direction is restrained. Thereby, the breakage of the hinges is prevented even when the mechanical shock is applied from outside.

Abstract translation: 在半导体机械结构中，即使当从外部施加机械冲击时，铰链也不会断裂，因此提高了耐撞击性。 光扫描镜包括移动板，构成移动板的摆动轴线的双铰链，其中每个铰链的端部连接到移动板的两端;固定框架，设置成围绕移动板的周边 并且支撑每个双铰链的另一端，以及形成在固定框架上的止动件。 当移动板在横向方向上移动时，止动件接触移动板的凹部的侧端部，从而抑制移动板在横向方向上的位移。 因此，即使从外部施加机械冲击，也能够防止铰链的破损。

公开(公告)号：US20110063712A1

公开(公告)日：2011-03-17

申请号：US12562093

申请日：2009-09-17

Applicant: Manish Kothari ,  Sauri Gudlavalleti ,  Stephen Zee

Inventor： Manish Kothari ,  Sauri Gudlavalleti ,  Stephen Zee

IPC: G02B26/00

CPC classification number: B81B3/0008 ,  B81B2201/042 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  G02B26/0841

Abstract: In certain embodiments, a device is provided including a substrate and a plurality of supports over the substrate. The device may further include a mechanical layer having a movable portion and a stationary portion. The stationary portion may disposed over the supports. In certain embodiments, the device further includes a reflective surface positioned over the substrate and mechanically coupled to the movable portion. The device of certain embodiments further includes at least one movable stop element displaced from and mechanically coupled to the movable portion. In certain embodiments, the at least a portion of the stop element may be positioned over the stationary portion.

Abstract translation: 在某些实施例中，提供了一种包括衬底和在衬底上的多个支撑体的装置。 该装置还可以包括具有可移动部分和固定部分的机械层。 固定部分可以设置在支撑件上方。 在某些实施例中，所述装置还包括位于所述基板上并且机械地联接到所述可移动部分的反射表面。 某些实施例的装置还包括至少一个可动止动元件，该可移动止动元件从可移动部分移动并机械联接到可动部分。 在某些实施例中，止动元件的至少一部分可以定位在固定部分上方。

公开(公告)号：US07851244B2

公开(公告)日：2010-12-14

申请号：US12029433

申请日：2008-02-11

Applicant: Jeff A. Ridley

Inventor： Jeff A. Ridley

IPC: H01L21/00 ,  H01L21/44

CPC classification number: B81C1/0096 ,  B81B3/001 ,  B81B2203/0361 ,  B81C2201/112 ,  Y10S438/951

Abstract: Systems and methods for MEMS device fabrication. A layer of photoresist is formed on a substrate. A first region of the substrate is exposed to a radiation source through a photomask. The first region of exposed photoresist is developed with a developer solution in order to etch the exposed regions to a first depth. A second region is exposed to radiation through a second photomask. The second photomask defines areas in which a bump feature is intended on the substrate. The second region is developed with the developer solution, preparing the first and second exposed regions for a layer of metal. A layer of metal is deposited on the substrate, such that the metal attaches to both the substrate and any remaining photoresist on the substrate. The remaining photoresist and its attached metal is dissolved away leaving an interconnect pattern and at least one bump feature.

Abstract translation: 用于MEMS器件制造的系统和方法。 在基板上形成一层光致抗蚀剂。 衬底的第一区域通过光掩模暴露于辐射源。 暴露的光致抗蚀剂的第一区域用显影剂溶液显影，以便将暴露的区域蚀刻到第一深度。 通过第二光掩模将第二区域暴露于辐射。 第二光掩模定义了在基板上预期凸起特征的区域。 用显影剂溶液显影第二区域，制备用于一层金属的第一和第二暴露区域。 金属层沉积在基板上，使得金属附着到基板和基板上的任何剩余的光致抗蚀剂。 剩余的光致抗蚀剂及其附着的金属被溶解掉，留下互连图案和至少一个凹凸特征。

公开(公告)号：US07829365B2

公开(公告)日：2010-11-09

申请号：US11976678

申请日：2007-10-26

Applicant: Makiko Nakamura

Inventor： Makiko Nakamura

IPC: H01L21/00

CPC classification number: B81C1/00944 ,  B81B2201/0271 ,  B81B2203/0118 ,  B81B2203/04 ,  B81C2201/112 ,  H01L28/40 ,  H03H3/0077 ,  H03H9/2457 ,  H03H2009/02496

Abstract: A micro electro-mechanical system, which can be stably formed so as to prevent sticking of a movable part and which has a narrow gap, and a method of manufacturing the same are provided. The micro electro-mechanical system includes at least one fixed electrode formed above a principal surface of a semiconductor substrate and at least one movable electrode formed on the principal surface. The at least one movable electrode includes the movable part separated from the principal surface and the at least one fixed electrode. The movable part is movable with respect to the principal surface and the at least one fixed electrode. The method of manufacturing the micro electro-mechanical system includes a sacrifical film formation step for forming a sacrifical film above the principal surface, an electrode layer formation step for forming an electrode layer above the principal surface so as to cover over the sacrifical film, an etching step for partially etching the electrode layer via a pattern so as to form the at least one electrode and the at least one fixed electrode, a sacrifical film removal step for removing the sacrifical film, and a conducting film formation step for forming a conducting film on surfaces of the at least one electrode and the at least one fixed electrode.

Abstract translation: 提供一种可以稳定地形成以防止可动部分的粘附并且具有窄间隙的微机电系统及其制造方法。 微电子机械系统包括形成在半导体衬底的主表面上的至少一个固定电极和形成在主表面上的至少一个可移动电极。 所述至少一个可移动电极包括从所述主表面和所述至少一个固定电极分离的可移动部件。 可移动部分可相对于主表面和至少一个固定电极移动。 微机电系统的制造方法包括在主表面上形成牺牲膜的牺牲膜形成工序，在主表面上形成覆盖牺牲膜的电极层的电极层形成工序， 用于通过图案部分地蚀刻电极层以形成至少一个电极和至少一个固定电极的蚀刻步骤，用于去除牺牲膜的牺牲膜去除步骤以及用于形成导电膜的导电膜形成步骤 在所述至少一个电极和所述至少一个固定电极的表面上。