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68 条记录 (耗时 0.018 秒)

    ELASTIC COMPOSITE FILTER
    51.
    发明申请
    ELASTIC COMPOSITE FILTER 审中-公开
    弹性复合过滤器

    公开(公告)号：US20170077891A1

    公开(公告)日：2017-03-16

    申请号：US15260681

    申请日：2016-09-09

    申请人： JOINSET CO., LTD.

    发明人： Sun-Ki Kim ,  Byung-Sun Jung ,  Jung-Sup Choi ,  Seong-Jin Lee ,  Kwang-Hwi Choi

    IPC分类号： H04B3/28 ,  H03H7/06 ,  H05K1/02

    CPC分类号： H03H7/06 ,  H01G2/22 ,  H01G4/232 ,  H01G4/255 ,  H01G4/35 ,  H01G4/40 ,  H03H2001/0021 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0234 ,  H05K1/0237 ,  H05K1/0259 ,  H05K1/0296 ,  H05K2201/1006

    摘要： Disclosed is a technology that enables an elastic composite filter to have a capacitor to remove noise. The elastic composite includes a functional material layer; electrode patterns disposed on top and bottom surfaces of the material layer, respectively; and a conductive elastic member adhered onto the top electrode pattern, wherein the elastic member is coupled electrically and mechanically to the top electrode pattern to be used as an electrode, and the elastic member is in direct contact with a conductive object to provide elasticity.

    摘要翻译： 公开了一种使弹性复合滤波器具有消除噪声的电容器的技术。 弹性复合材料包括功能材料层; 电极图案分别设置在材料层的顶表面和底表面上; 以及粘接到顶部电极图案上的导电弹性构件，其中弹性构件电连接和机械地与顶部电极图案耦合以用作电极，并且弹性构件与导电物体直接接触以提供弹性。

    Capacitor assemblies for coupling radio frequency (RF) and direct current (DC) energy to one or more common electrodes
    54.
    发明授权
    Capacitor assemblies for coupling radio frequency (RF) and direct current (DC) energy to one or more common electrodes 有权
    用于将射频（RF）和直流（DC）能量耦合到一个或多个公共电极的电容器组件

    公开(公告)号：US09355776B2

    公开(公告)日：2016-05-31

    申请号：US14249327

    申请日：2014-04-09

    申请人： APPLIED MATERIALS, INC.

    发明人： Carl Johnson ,  Les Wojnowski ,  Lawrence A. Ringor ,  Jeffrey Ludwig

    IPC分类号： H01G2/24 ,  H01G2/22 ,  H02N13/00 ,  H01G4/28

    CPC分类号： H01G2/22 ,  H01G4/28 ,  H02N13/00

    摘要： Embodiments of a capacitor assembly for coupling radio frequency (RF) and direct current (DC) power to an electrode and substrate support incorporating same are provided herein. In some embodiments, the capacitor assembly includes a first conductive plate to receive RF power from an RF power source, the first conductive plate including a central bore; at least one capacitor coupled to the first conductive plate and surrounding the central bore; and a second conductive plate electrically coupled to the first conductive plate via the at least one capacitor, the second conductive plate including an input tap to receive DC power from a DC power source and at least one output tap to couple the RF and DC power to an electrode.

    摘要翻译： 本文提供了一种用于将射频（RF）和直流（DC）功率耦合到电极的基座支架的结合实施例。 在一些实施例中，电容器组件包括用于从RF电源接收RF功率的第一导电板，第一导电板包括中心孔; 耦合到所述第一导电板并围绕所述中心孔的至少一个电容器; 以及第二导电板，其经由所述至少一个电容器电耦合到所述第一导电板，所述第二导电板包括输入抽头，以从DC电源接收DC电力，以及至少一个输出抽头将所述RF和DC功率耦合到 电极。

    Solid Electrolytic Capacitor
    56.
    发明申请
    Solid Electrolytic Capacitor 审中-公开
    固体电解电容器

    公开(公告)号：US20080094780A1

    公开(公告)日：2008-04-24

    申请号：US11792576

    申请日：2005-12-01

    申请人： Chojiro Kuriyama

    发明人： Chojiro Kuriyama

    IPC分类号： H01G9/00

    CPC分类号： H01G9/012 ,  H01G2/22 ,  H01G9/08

    摘要： A solid electrolytic capacitor (A1) includes a porous sintered body (1), anode conduction members (21A, 21B), surface-mounting anode terminals (3A, 3B), and a surface-mounting cathode terminal. The porous sintered body (1) is made of valve metal. The anode conduction members (21A, 21B) are electrically connected to the porous sintered body (1). The anode terminals (3A, 3B) are electrically connected to the anode conduction members (21A, 21B). At least part of the porous sintered body (1) or at least part of the anode conduction members (21A, 21B) is covered with a ferromagnetic member (8).

    摘要翻译： 固体电解电容器（A 1）包括多孔烧结体（1），阳极传导部件（21A，21B），表面安装阳极端子（3A，3B）和表面安装阴极端子。 多孔烧结体（1）由阀金属制成。 阳极传导构件（21A，21B）与多孔烧结体（1）电连接。 阳极端子（3A，3B）电连接到阳极传导部件（21A，21B）。 多孔烧结体（1）的至少一部分或阳极传导部件（21A，21B）的至少一部分被铁磁部件（8）覆盖。

    Fully shielded capacitor cell structure
    58.
    发明授权
    Fully shielded capacitor cell structure 有权
    全屏蔽电容电池结构

    公开(公告)号：US07154734B2

    公开(公告)日：2006-12-26

    申请号：US10945177

    申请日：2004-09-20

    申请人： Richard Schultz ,  Jeffrey Burleson ,  Steven Howard

    发明人： Richard Schultz ,  Jeffrey Burleson ,  Steven Howard

    IPC分类号： H01G4/228

    CPC分类号： H01G2/22

    摘要： A linear capacitor design providing shielding on all sides of the linear capacitor. In one aspect the capacitor provides a signal side metal layer substantially enclosed by a dielectric material which is, in turn, substantially enclosed by an upper and lower metal shield layer. in another aspect, the upper and lower shield metal layers may be coupled by a plurality of vias. In another aspect, a plurality of alternating intermediate layers provide signal side metal and shield metal separated by dielectric material such that each signal side layer is substantially enclosed by one or more shield metal layers. In another aspect, multiple intermediate signal side metal layers are conductively coupled to one another by a plurality of vias and multiple shield metal layers are conductively coupled to one another by a plurality of vias.

    摘要翻译： 线性电容器设计，提供线性电容器各侧的屏蔽。 在一个方面，电容器提供基本上被电介质材料包围的信号侧金属层，电介质材料又由上下金属屏蔽层基本包围。 在另一方面，上和下屏蔽金属层可以通过多个通孔耦合。 在另一方面，多个交替的中间层提供由电介质材料分离的信号侧金属和屏蔽金属，使得每个信号侧层基本上由一个或多个屏蔽金属层包围。 在另一方面，多个中间信号侧金属层通过多个通孔彼此导电耦合，并且多个屏蔽金属层通过多个通孔彼此导电耦合。

    Fully shielded capacitor cell structure
    59.
    发明申请
    Fully shielded capacitor cell structure 有权

    公开(公告)号：US20060061935A1

    公开(公告)日：2006-03-23

    申请号：US10945177

    申请日：2004-09-20

    申请人： Richard Schultz ,  Jeffrey Burleson ,  Steven Howard

    发明人： Richard Schultz ,  Jeffrey Burleson ,  Steven Howard

    IPC分类号： H01G4/228

    CPC分类号： H01G2/22

    摘要： A linear capacitor design providing shielding on all sides of the linear capacitor. In one aspect the capacitor provides a signal side metal layer substantially enclosed by a dielectric material which is, in turn, substantially enclosed by an upper and lower metal shield layer. in another aspect, the upper and lower shield metal layers may be coupled by a plurality of vias. In another aspect, a plurality of alternating intermediate layers provide signal side metal and shield metal separated by dielectric material such that each signal side layer is substantially enclosed by one or more shield metal layers. In another aspect, multiple intermediate signal side metal layers are conductively coupled to one another by a plurality of vias and multiple shield metal layers are conductively coupled to one another by a plurality of vias.

    Chip capacitors and chip capacitor electromagnetic interference filters
    60.
    发明授权
    Chip capacitors and chip capacitor electromagnetic interference filters 失效
    片式电容器和片式电容电磁干扰滤波器

    公开(公告)号：US5973906A

    公开(公告)日：1999-10-26

    申请号：US40222

    申请日：1998-03-17

    申请人： Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel ,  Jason Woods ,  Mike Louder

    发明人： Robert A. Stevenson ,  Donald K. Haskell ,  Richard L. Brendel ,  Jason Woods ,  Mike Louder

    IPC分类号： A61N1/375 ,  H01G2/22 ,  H01G4/232 ,  H01G4/35 ,  H03H1/00

    CPC分类号： H01G4/232 ,  A61N1/3754 ,  H01G2/22 ,  H01G4/35 ,  H03H1/0007

    摘要： An electromagnetic interference (EMI) filter capacitor assembly is provided for shielding and decoupling a conductive terminal pin or lead of the type used, for example, in an implantable medical device against passage of external interference signals. The EMI filter is constructed of relatively inexpensive ceramic chip capacitors which replace relatively expensive feedthrough capacitors as found in the prior art. The chip capacitors are mounted directly onto a hermetic feedthrough terminal in groups of two or more which vary in physical size, dielectric material and capacitance value so that they self-resonate at different frequencies. This "staggering" of resonant frequencies and direct installation at the hermetic terminal provides the EMI filter with sufficient broadband frequency attenuation. In one preferred form, multiple chip capacitor groupings are mounted onto a common base structure, with each capacitor grouping associated with a respective terminal pin. In another preferred form, a non-conductive substrate is provided with metalized circuit traces to better accommodate the mounting of the chip capacitors. Additionally, novel chip capacitor geometry/termination-metallization is provided which significantly reduces the internal inductance of the capacitor to improve its high frequency performance as an EMI filter. Such reduced inductance chip capacitor designs are readily adaptable to incorporate multiple electrically isolated active plate sets within a single monolithic casing.

    摘要翻译： 提供电磁干扰（EMI）滤波电容器组件，用于屏蔽和解耦用于例如在可植入医疗装置中的类型的导电端子引脚或引线，以抵抗外部干扰信号的通过。 EMI滤波器由相对廉价的陶瓷芯片电容器构成，其代替现有技术中发现的相对昂贵的馈通电容器。 芯片电容器直接安装在两个或更多个组合的密封馈通端子上，其在物理尺寸，电介质材料和电容值上变化，使得它们在不同频率下自谐振。 谐振频率的“惊人”和密封端的直接安装为EMI滤波器提供了足够的宽带频率衰减。 在一个优选形式中，多个片式电容器组被安装在公共基座结构上，每个电容器分组与相应的端子引脚相关联。 在另一优选形式中，非导电衬底设置有金属化电路迹线，以更好地适应片式电容器的安装。 另外，提供了新颖的芯片电容器几何/端接金属化，这显着降低了电容器的内部电感，以提高其作为EMI滤波器的高频性能。 这种减小的电感芯片电容器设计容易适用于在单个整体式壳体内并入多个电隔离的有源板组。