摘要:
Provided is a substrate processing system and a substrate processing method. The substrate processing system includes a polishing part for performing a Chemical Mechanical Polishing (CMP) process on a substrate, a cleaning part for cleaning the substrate on which the polishing process is performed, and a substrate transferring part for transferring the substrate to the cleaning part before polishing the substrate in the polishing part. The substrate may be preparatorily cleaned in the cleaning part before the polishing process, and then enters the polishing part.
摘要:
The upper wall is provided with a recess indented from the outside toward the inside of the container main body, and a protrusion projecting outward on the inside of the recess. The top flange is provided with an insertion part which can be inserted into the recess from the outside of the upper wall. The insertion part is provided with a through-hole capable of penetrating from the side further from the upper wall to the side nearer the upper wall. With the recess in the upper wall opening upward and the insertion part of the top flange inserted into the recess, a molten resin poured into the through-hole of the insertion part from above fills the recess from the bottom surface thereof up to the outer peripheral surface of the protrusion and the inner peripheral surface of the through-hole.
摘要:
In some embodiments, an inline substrate processing tool may include a substrate carrier having a plurality of slots configured to retain a plurality of substrates parallel to each other when disposed in the slots, a first substrate processing module and a second substrate processing module disposed in a linear arrangement, wherein each substrate processing module includes an enclosure and a track that supports the substrate carrier and provides a path for the substrate carrier to move linearly through the first and second substrate processing modules, and a first gas cap disposed between the first and second substrate processing modules, wherein the first gas cap includes a first process gas conduit to provide a first process gas to the first substrate processing module, and a second process gas conduit to provide a second process gas to the second substrate processing module.
摘要:
Methods and apparatus for forming porous silicon layers are provided. In some embodiments, an anodizing bath includes: a housing having a first volume to hold a chemical solution; a cathode disposed within the first volume at a first side of the housing; an anode disposed within the first volume at a second side of the housing, opposite the first side, wherein a face of each of the cathode and the anode have a given surface area; a substrate holder configured to retain a plurality of substrates along a perimeter thereof within the first volume in a plurality of substrate holding positions, a plurality of vent openings fluidly coupled to the first volume to release process gases, wherein a top of each of the plurality of vent openings are disposed above a chemical solution fill level in the first volume.
摘要:
A mounting system includes retaining bars which are structurally independent of one another, which can be optionally directly disconnected and directly connected relative to a support device through coupling devices that are activatable and deactivatable without tools. Using the mounting system, a method for charging a treatment device can also be carried out, with which the retaining bars are directly connected to a first support device, and following this, the retaining bars are directly connected to a second support device, in particular a rotor that is arranged in the treatment device. Following that, the mechanical connection between the first support device and the retaining bars is directly disconnected.
摘要:
A wafer rotating apparatus includes a base, a carrying device, a first shaft gear, a power unit, a roller, a second shaft gear and a driving assembly. The base has an accommodating space which the carrying device is disposed in to accommodate the wafer. The first shaft gear is disposed on a side surface of the base. The power unit is assembled to a top of the base and connected to the first shaft gear. The roller is located under the carrying device and supports an edge of the wafer. The second shaft gear is disposed on the side surface of the base and connected to the roller. The driving assembly is connected between the first shaft gear and the second shaft gear. The power unit provides a power through the first gear, the driving unit and the second shaft gear to drive the roller to rotate the wafer.
摘要:
A wafer rotating apparatus includes a base, a carrying device, a first shaft gear, a power unit, a roller, a second shaft gear and a driving assembly. The base has an accommodating space which the carrying device is disposed in to accommodate the wafer. The first shaft gear is disposed on a side surface of the base. The power unit is assembled to a top of the base and connected to the first shaft gear. The roller is located under the carrying device and supports an edge of the wafer. The second shaft gear is disposed on the side surface of the base and connected to the roller. The driving assembly is connected between the first shaft gear and the second shaft gear. The power unit provides a power through the first gear, the driving unit and the second shaft gear to drive the roller to rotate the wafer.
摘要:
The present disclosure relates to a substrate storage rack, including a hollow rack body with a first, a second, a third, and a fourth lateral surfaces, wherein at least one substrate laying layer is arranged in the rack body along a vertical direction. The substrate laying layer includes: a first support connected with the rack body and arranged at the second lateral surface; first supporting bars transversely arranged on the first support and extending to the interior of the rack body; a second support connected with the rack body and arranged at the fourth lateral surface; and second supporting bars transversely arranged on the second support and extending to the interior of the rack body. Since the first and the second supporting bars are arranged on the second and the fourth lateral surfaces of the rack body respectively, storing substrates in the rack body can be ensured. Then, the first lateral surface can be used as a fetching and feeding port for an automatic manipulator arm and the fourth lateral surface can be used as a manual fetching and feeding port, so that bidirectional fetching and feeding of the substrates in the substrate storage rack can be realized, and thus the production efficiency can be effectively improved.
摘要:
A rack includes: a rack main body including a storage space configured to store a plurality of plate-shaped members and a carry-in opening; a plurality of upper supporting portions configured to respectively support upper edge portions of the plurality of plate-shaped members; lower supporting portions respectively provided under the plurality of upper supporting portions and configured to respectively support lower edge portions of the plurality of standing plate-shaped members; and lower edge portion storage portions provided to be each located at an outer side of an end of the upper supporting portion and an end of the lower supporting portion in the arrangement direction and configured to store the lower edge portions of the plate-shaped members, and at least one of the upper supporting portions is configured to be able to support the upper edge portion of the plate-shaped member.
摘要:
In one embodiment, a susceptor for thermal processing is provided. The susceptor includes an outer rim surrounding and coupled to an inner dish, the outer rim having an inner edge and an outer edge. The susceptor further includes one or more structures for reducing a contacting surface area between a substrate and the susceptor when the substrate is supported by the susceptor. At least one of the one or more structures is coupled to the inner dish proximate the inner edge of the outer rim.