公开(公告)号：US5566051A

公开(公告)日：1996-10-15

申请号：US298544

申请日：1994-08-30

Applicant: Carmen D. Burns

Inventor： Carmen D. Burns

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/433 ,  H01L25/10 ,  H05K7/02 ,  H05K7/20

CPC classification number: H05K7/023 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/564 ,  H01L25/10 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/49126 ,  Y10T29/49172

Abstract: An ultra-thin level-one integrated circuit package with improved moisture penetration characteristics manufactured using a transfer molded casing with metallic lamination layers is provided. Additionally, a method and apparatus for providing a multiple-element modular package including a plurality of such level-one packages in horizontal or vertical stack configuration is provided.

Abstract translation: 提供了一种使用具有金属层压层的转移模制壳体制造的具有改进的水分渗透特性的超薄一级集成电路封装。 另外，提供了一种用于提供包括水平或垂直堆叠配置中的多个这样的一级封装的多元件模块化封装的方法和装置。

公开(公告)号：US5539550A

公开(公告)日：1996-07-23

申请号：US119292

申请日：1993-09-09

Applicant: Mark B. Spitzer ,  Jack P. Salerno ,  Jeffrey Jacobsen ,  Brenda Dingle ,  Duy-Phach Vu ,  Paul M. Zavracky

Inventor： Mark B. Spitzer ,  Jack P. Salerno ,  Jeffrey Jacobsen ,  Brenda Dingle ,  Duy-Phach Vu ,  Paul M. Zavracky

IPC: A61B3/113 ,  G02B5/30 ,  G02B27/00 ,  G02B27/01 ,  G02F1/1333 ,  G02F1/1335 ,  G02F1/1347 ,  G02F1/136 ,  G02F1/1362 ,  G09G3/30 ,  G09G3/32 ,  G09G3/36 ,  H01L21/77 ,  H01L21/822 ,  H01L21/84 ,  H01L21/98 ,  H01L25/075 ,  H01L25/10 ,  H01L27/06 ,  H01L27/12 ,  H01L27/15 ,  H01L29/786 ,  H01L33/00 ,  H01S5/02 ,  H01S5/42 ,  H04N5/70 ,  H04N5/74 ,  H05B33/12

CPC classification number: A61B3/113 ,  G02B27/0093 ,  G02B27/0172 ,  G02F1/13454 ,  G02F1/136209 ,  G09G3/30 ,  G09G3/36 ,  H01L21/8221 ,  H01L24/96 ,  H01L25/0756 ,  H01L25/10 ,  H01L25/50 ,  H01L27/0688 ,  H01L27/1214 ,  H01L27/156 ,  H01L29/786 ,  H01L29/78603 ,  H01L29/78648 ,  H04N5/7441 ,  H04N9/3141 ,  H05B33/12 ,  G02B2027/0132 ,  G02B2027/0138 ,  G02B2027/0187 ,  G02B2027/0198 ,  G02B5/30 ,  G02F1/13336 ,  G02F2001/13613 ,  G09G2300/023 ,  G09G2300/0809 ,  G09G2300/0842 ,  G09G2320/0233 ,  G09G2320/041 ,  G09G2320/043 ,  G09G2340/0464 ,  G09G2370/042 ,  G09G3/32 ,  G09G3/3607 ,  G09G3/3614 ,  G09G3/3648 ,  H01L2221/68359 ,  H01L2221/68363 ,  H01L2221/68368 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01065 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3511 ,  H01S5/0217 ,  H01S5/423 ,  H04N5/70 ,  H04N5/7491 ,  Y10T29/41

Abstract: Circuit modules including complex multi-function circuitry on common module substrates using circuit tiles of silicon thin-films which are transferred, interconnected and packaged. The modules include integrated transfer/interconnects with extremely high density and complexity with large-area active-matrix liquid crystal displays and on-board drivers and logic in glass-based modules.

Abstract translation: 电路模块包括使用传输，互连和封装的硅薄膜电路板的公共模块基板上的复杂多功能电路。 这些模块包括具有极高密度和复杂性的集成传输/互连，大面积有源矩阵液晶显示器和板载驱动器以及基于玻璃的模块中的逻辑。

公开(公告)号：US5446620A

公开(公告)日：1995-08-29

申请号：US133395

申请日：1993-10-08

Applicant: Carmen D. Burns ,  Jerry Roane ,  James W. Cady

Inventor： Carmen D. Burns ,  Jerry Roane ,  James W. Cady

IPC: H01L21/56 ,  H01L23/00 ,  H01L23/433 ,  H01L25/10 ,  H05K7/02 ,  H05K7/20

CPC classification number: H05K7/023 ,  H01L21/565 ,  H01L23/4334 ,  H01L23/564 ,  H01L25/10 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/1064 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01L2924/3511

Abstract: Thin and durable level-one and level-two integrated circuit packages are provided. Moisture-barriers may be provided to upper and/or lower surfaces of the thin level-one package. Additionally, a thin level-one package may be constructed with one or more metal layers to prevent warpage. These level-one packages are aligned in a stacked configuration to form a thin and durable horizontal level-two package. Various thermal conductors are thermally coupled to the level-two package to help dissipate heat.

Abstract translation: 提供了薄而耐用的一级和二级集成电路封装。 水分阻挡层可以设置在薄一级封装的上表面和/或下表面上。 此外，可以用一个或多个金属层构造薄一级封装以防止翘曲。 这些一级包装以堆叠配置对齐，形成一个薄而耐用的水平二级包装。 各种热导体热耦合到二级封装以帮助散热。

公开(公告)号：US4614964A

公开(公告)日：1986-09-30

申请号：US641215

申请日：1984-08-15

Applicant: Thomas Sutrina

Inventor： Thomas Sutrina

IPC: H01L25/10 ,  H01L23/46 ,  H01L29/52

CPC classification number: H01L25/10 ,  H01L2924/0002

Abstract: A semiconductor package including a first electrically conductive bus and a second electrically conductive bus spaced from and generally surrounding the first bus in approximately concentric relation thereto. A plurality of generally equally angularly spaced semiconductors are located in the space between the buses and each semiconductor has at least two electrodes. One electrode of each semiconductor is connected to the first bus and the other electrode is connected to the second bus.

Abstract translation: 一种半导体封装，包括第一导电总线和第二导电总线，所述第一导电总线和第二导电总线与所述第一总线间隔开并且大致围绕所述第一 在总线之间的空间中设置多个大致相等的角度间隔的半导体，并且每个半导体具有至少两个电极。 每个半导体的一个电极连接到第一总线，另一个电极连接到第二总线。

公开(公告)号：US4321664A

公开(公告)日：1982-03-23

申请号：US111822

申请日：1980-01-14

Applicant: Gunter Matthai

Inventor： Gunter Matthai

IPC: H02K9/22 ,  H01L23/467 ,  H01L25/10 ,  H02K5/22 ,  H02K11/04 ,  H02M7/06

CPC classification number: H01L25/10 ,  H01L23/467 ,  H02K11/046 ,  H01L2924/0002

Abstract: Two U-shaped sheet metal members having legs through which the cooling air passes have bases onto which at least two of the load current carrying diodes are fastened, the connection between the diodes and the sheet metal members forming the heat sink being a highly heat conductive connection.

Abstract translation: 具有冷却空气通过的腿的两个U形金属板状构件具有至少两个负载电流承载二极管所固定的基座，二极管与形成散热片的金属片之间的连接是高度导热的 连接。

公开(公告)号：US4320446A

公开(公告)日：1982-03-16

申请号：US146738

申请日：1980-05-05

Applicant: Obie M. Langford ,  Albert P. Richter, Jr.

Inventor： Obie M. Langford ,  Albert P. Richter, Jr.

IPC: H01G4/40 ,  H01L25/10 ,  H02M7/10

CPC classification number: H01L25/10 ,  H01G4/40 ,  H02M7/106 ,  H05H5/045 ,  H01L2924/0002

Abstract: A Cockcroft-Walton voltage multiplying circuit constructed for use in a slim hole well logging tool includes a plurality of capacitor packages having a first capacitor package, adapted to receive an input voltage, and a last capacitor package. A plurality of high voltage rectifier packages of which each rectifier package, except for a last rectifier package, are physically as well as electrically interconnected with two capacitor packages. The last rectifier package is connected to the last capacitor package so that all of the capacitor packages and all of the rectifier packages form an inline rigid body. Output terminals are connected to the last rectifier package for providing the high voltage developed by the capacitor packages and the rectifier packages in response to a received input voltage.

Abstract translation: 构造用于细孔测井工具的Cockcroft-Walton电压倍增电路包括具有适于接收输入电压的第一电容器封装的多个电容器封装以及最后一个电容器封装。 除了最后一个整流器封装之外，每个整流器封装的多个高压整流器封装在物理上以及与两个电容器封装件电互连。 最后一个整流器封装连接到最后一个电容器封装，使得所有电容器封装和所有整流器封装形成一个内联的刚体。 输出端子连接到最后一个整流器封装，用于响应于接收的输入电压提供由电容器封装和整流器封装开发的高电压。

公开(公告)号：US4288711A

公开(公告)日：1981-09-08

申请号：US85111

申请日：1979-10-15

Applicant: Walter Hagenlocher ,  Heinz Hesse ,  Karl Kleebaur ,  Christoph Kugel ,  Johann Kunz ,  Werner Lemke ,  Rudiger Sohnle

Inventor： Walter Hagenlocher ,  Heinz Hesse ,  Karl Kleebaur ,  Christoph Kugel ,  Johann Kunz ,  Werner Lemke ,  Rudiger Sohnle

IPC: H02K19/36 ,  H01L25/10 ,  H02K11/04 ,  H02K11/00

CPC classification number: H02K11/046 ,  H01L25/10 ,  H01L2924/0002

Abstract: To form a compact combination structure which provides efficient cooling and ease of assembly, maintenance and repair, while reducing the number of elements necessary to be stocked for maintenance or repair purposes, the rectifier portion of the alternator-rectifier combination comprises two groups of rectifiers which are, respectively, set in openings of two disk-shaped support plates 15, 35, which have, each, ring-shaped portions 38 surrounding the shaft and radially projecting fins 39, 39'. One of the plates is formed with a hub to retain one of the bearings, the outer portion of the fins is apertured for attachment to the shell of the alternator, and additionally deformed to provide seating surfaces for accurate positioning, for example by externally applied punch marks, of the plate. An insulating spacer 43, 43' separates the two plates which are so positioned that the fins of one plate are opposite the gap between fins of the other, so that air drawn axially by a ventilating fan will cool both plates.

Abstract translation: 为了形成紧凑的组合结构，其提供有效的冷却和易于组装，维护和修理，同时减少为了维护或修理目的而需要储存的元件的数量，交流发电机 - 整流器组合的整流部分包括两组整流器 分别设置在两个盘形支撑板15,35的开口中，每个圆形支撑板15,35具有围绕轴的环形部分38和径向突出的翅片39,39'。 其中一个板形成有一个毂以保持其中一个轴承，翅片的外部部分是开孔的，用于连接到交流发电机的壳体，并且另外变形以提供用于精确定位的就座表面，例如通过外部施加的冲头 标记，板。 绝缘间隔件43,43'分开两个定位的两个板，使得一个板的翅片与另一个板的翅片之间的间隙相对，使得由通风扇轴向抽吸的空气将冷却两个板。

公开(公告)号：US4110821A

公开(公告)日：1978-08-29

申请号：US760739

申请日：1977-01-19

Applicant: Hiroshi Hisano ,  Kyoichi Sato

Inventor： Hiroshi Hisano ,  Kyoichi Sato

IPC: F25D9/00 ,  H01L23/427 ,  H01L25/10 ,  H02H3/12 ,  H02M7/04 ,  H02M7/12 ,  H05K7/20 ,  H02M7/00

CPC classification number: H01L25/10 ,  H01L23/427 ,  H02H3/12 ,  H01L2924/0002 ,  Y10S257/909

Abstract: A semiconductor device includes a sealed vessel accommodating a semiconductor body and a heating element. When the semiconductor body is not energized, the heating unit is heated.

Abstract translation: 半导体器件包括容纳半导体本体和加热元件的密封容器。 当半导体本体没有通电时，加热单元被加热。

公开(公告)号：US3872335A

公开(公告)日：1975-03-18

申请号：US44885974

申请日：1974-03-07

Applicant: WESTINGHOUSE ELECTRIC CORP

Inventor： PETERSEN SIGRUD R ,  YING SUI-CHUN ,  MANN AUGUST C

IPC: H02K3/51 ,  H01L25/10 ,  H02K11/04 ,  H02K19/36 ,  H02M7/04 ,  H02K11/00

CPC classification number: H01L25/10 ,  H01L2924/0002 ,  H02K11/042 ,  H01L2924/00

Abstract: Brushless excitation systems for alternating current generators include an alternating current exciter and a rotating rectifier assembly. In such a system, the rectifier diodes of the rectifier assembly are mounted on the rim of a wheel which rotates with the exciter armature member, and the leads from the exciter winding extend along the shaft and through openings in the wheel for connection to the diodes. Supporting means are provided for the leads consisting of an elastic tubular member such as an aluminum sleeve, which extends axially from the wheel and encloses the leads. The leads are supported radially against the inner surface of the tubular member which has sufficient elasticity to permit limited radial deflection of the leads to follow the wheel when it expands radially in operation.

Abstract translation: 用于交流发电机的无刷励磁系统包括交流励磁机和旋转整流器组件。 在这种系统中，整流器组件的整流二极管安装在与激励器电枢构件一起旋转的轮的边缘上，并且来自激励器绕组的引线沿着轴延伸并且通过车轮中的开口连接到二极管 。 针对包括诸如铝套筒的弹性管状构件的引线提供支撑装置，其从轮轴向延伸并包围引线。 引线径向地支撑在管状构件的内表面上，该管状构件的内表面具有足够的弹性，以允许引线在操作中径向膨胀时跟随车轮的有限的径向偏转。

公开(公告)号：US20240347404A1

公开(公告)日：2024-10-17

申请号：US18610114

申请日：2024-03-19

Applicant: Adeia Semiconductor Technologies LLC

Inventor： Rajesh Katkar

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/3107 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/566 ,  H01L21/568 ,  H01L21/6835 ,  H01L21/78 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/94 ,  H01L24/97 ,  H01L25/10 ,  H01L21/4857 ,  H01L24/13 ,  H01L24/16 ,  H01L24/32 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L2221/68327 ,  H01L2221/68372 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2224/83005 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/181 ,  H01L2924/19107

Abstract: A microelectronic assembly having a first side and a second side opposite therefrom is disclosed. The microelectronic assembly may include a microelectronic element having a first face, a second face opposite the first face, a plurality of sidewalls each extending between the first and second faces, and a plurality of element contacts. The microelectronic assembly may also include an encapsulation adjacent the sidewalls of the microelectronic element. The microelectronic assembly may include electrically conductive connector elements each having a first end, a second end remote from the first end, and an edge surface extending between the first and second ends, wherein one of the first end or the second end of each connector element is adjacent the first side of the package. The microelectronic assembly may include a redistribution structure having terminals, the redistribution structure adjacent the second side of the package, the terminals being electrically coupled with the connector elements.