公开(公告)号：US08586871B2

公开(公告)日：2013-11-19

申请号：US13185866

申请日：2011-07-19

Applicant: Jonathan J. Bernstein ,  Brian R. Smith ,  Thomas E. Boydston

Inventor： Jonathan J. Bernstein ,  Brian R. Smith ,  Thomas E. Boydston

IPC: H05K1/09

CPC classification number: H05K1/0275 ,  H05K3/125 ,  H05K2201/0224 ,  H05K2201/09881 ,  H05K2203/013

Abstract: An interconnect scheme includes a conductive ink forming a plurality of conductive regions, and a dielectric ink occupying spaces between the conductive regions. The conductive ink and the dielectric ink have substantially identical optical, acoustic, and x-ray absorption properties, thereby making the interconnect scheme tamper-resistant and/or difficult to identify and reverse-engineer using conventional detection methods.

Abstract translation: 互连方案包括形成多个导电区域的导电油墨和占据导电区域之间的空间的电介质油墨。 导电油墨和电介质油墨具有基本上相同的光学，声学和x射线吸收特性，从而使得互连方案具有防篡改和/或难以使用常规检测方法进行识别和反向工程。

公开(公告)号：US08512933B2

公开(公告)日：2013-08-20

申请号：US12341099

申请日：2008-12-22

Applicant: Thomas N. Tombs ,  Donald S. Rimai

Inventor： Thomas N. Tombs ,  Donald S. Rimai

IPC: G03G13/22

CPC classification number: H05K3/1266 ,  B65H85/00 ,  B65H2301/33312 ,  G03G15/1625 ,  G03G15/224 ,  G03G15/225 ,  G03G15/6585 ,  G03G15/6591 ,  G03G2215/00523 ,  H05K2201/0129 ,  H05K2201/0224 ,  H05K2203/0517 ,  H05K2203/0522 ,  H05K2203/0783 ,  H05K2203/1572

Abstract: The present invention provides a method producing printed electronic circuits using electrophotography.

Abstract translation: 本发明提供使用电子照相法制造印刷电子电路的方法。

公开(公告)号：US08486498B2

公开(公告)日：2013-07-16

申请号：US13113716

申请日：2011-05-23

Applicant: Puwei Liu ,  Matthew James Holloway ,  Blake Olsen

Inventor： Puwei Liu ,  Matthew James Holloway ,  Blake Olsen

IPC: A01N3/00 ,  B32B5/16 ,  B01J13/02 ,  C08F20/06 ,  C08F118/02 ,  C08F32/00

CPC classification number: H05K3/3484 ,  B22F1/0062 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/268 ,  B23K35/282 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3612 ,  B23K35/3613 ,  B23K35/365 ,  H05K2201/0224 ,  Y10T428/2991

Abstract: The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates. The present invention relates to polymer coated metal powders, such as metal powders used in the formation of solder alloys and pastes. The metal powders are coated with curable compositions of cyanoacrylates, and once cured the coating on the metal powder is a cyanoacrylate polymer.

Abstract translation: 本发明涉及聚合物涂覆的金属粉末，例如用于形成焊料合金和糊料的金属粉末。 金属粉末涂覆有氰基丙烯酸酯的可固化组合物。 本发明涉及聚合物涂覆的金属粉末，例如用于形成焊料合金和糊料的金属粉末。 金属粉末涂覆有氰基丙烯酸酯的可固化组合物，并且一旦固化，金属粉末上的涂层是氰基丙烯酸酯聚合物。

公开(公告)号：US20130081759A1

公开(公告)日：2013-04-04

申请号：US13702718

申请日：2011-06-10

Applicant: Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

Inventor： Keiichi Endoh ,  Yutaka Hisaeda ,  Akihiro Miyazawa ,  Aiko Nagahara ,  Toshihiko Ueyama

IPC: C09J1/00 ,  B32B37/12

CPC classification number: C09J1/00 ,  B22F1/0018 ,  B22F1/0062 ,  B22F2303/10 ,  B22F2998/00 ,  B32B37/12 ,  B82Y30/00 ,  C22C5/06 ,  H01L24/27 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/29299 ,  H01L2224/29339 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1301 ,  H01L2924/13033 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15747 ,  H05K3/32 ,  H05K3/3463 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2203/1131 ,  B22F2303/01 ,  B22F2301/255 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/2929

Abstract: Provided is a bonding material which enables formation of a bonded article in nitrogen, and can exhibit bonding strength to withstand practical use while having reduced bonding fluctuations between samples without a heat treatment procedure under pressurized or high temperature conditions. The bonding material comprises: silver nanoparticles having an average primary particle diameter of 1 to 200 nm and coated with an organic substance having 8 carbon atoms or less; a dispersion medium having a boiling point of 230° C. or higher; and a flux component including an organic matter having at least two carboxyl groups. Particularly, it is preferable to use the silver nanoparticles and submicron silver particles in combination.

Abstract translation: 提供一种能够在氮气中形成接合体的接合材料，并且在加压或高温条件下，在不进行热处理的情况下，可以显示接合强度以抵抗实际应用，同时减少样品之间的接合波动。 接合材料包括：平均一次粒径为1〜200nm的银纳米粒子，并涂布有碳原子数为8以下的有机物质; 沸点为230℃以上的分散介质; 以及包含具有至少两个羧基的有机物质的助熔剂成分。 特别地，优选组合使用银纳米粒子和亚微米银粒子。

公开(公告)号：US20120183775A1

公开(公告)日：2012-07-19

申请号：US13498161

申请日：2010-10-08

Applicant: Yoichi Shinba ,  Shoichi Niizeki ,  Toshihisa Nonaka

Inventor： Yoichi Shinba ,  Shoichi Niizeki ,  Toshihisa Nonaka

IPC: H05K3/22 ,  C09K5/00 ,  B32B15/02 ,  C23C22/06 ,  C23C22/07

CPC classification number: C09C3/10 ,  C01P2004/03 ,  C01P2004/62 ,  C01P2004/84 ,  C01P2006/40 ,  C09C1/62 ,  C09C1/64 ,  C09C1/644 ,  H05K3/28 ,  H05K2201/0224 ,  H05K2201/10977 ,  H05K2203/122 ,  Y10T428/2991

Abstract: Disclosed is a process which comprises bringing an acidic organic substance or phosphoric acid into contact with a metal to form, on the surface of the metal, a layer that contains either an organic acid salt formed from both the acidic organic substance and the metal or a phosphoric acid salt formed from both the phosphoric acid and the metal. In the process, the layer can be selectively formed only on the surface of the metal. When the process is applied to the production of core-shell particles, neither agglomeration of the particles nor viscosity increase of the fluid occurs, while when the process is applied to the production of a covered metal-wiring circuit board, the layer can be selectively formed only in the metal area to be covered.

Abstract translation: 公开了一种方法，其包括使酸性有机物质或磷酸与金属接触以在金属表面上形成含有由酸性有机物质和金属形成的有机酸盐的层或 由磷酸和金属形成的磷酸盐。 在该过程中，该层可以仅选择性地形成在金属的表面上。 当将该方法应用于核 - 壳颗粒的生产时，不会发生颗粒的聚集或流体的粘度增加，而当该方法应用于覆盖金属布线电路板的生产时，该层可以是选择性的 仅在被覆盖的金属区域形成。

公开(公告)号：US20120138868A1

公开(公告)日：2012-06-07

申请号：US13266906

申请日：2010-04-22

Applicant: Motohiro Arifuku ,  Kouji Kobayashi ,  Tohru Fujinawa

Inventor： Motohiro Arifuku ,  Kouji Kobayashi ,  Tohru Fujinawa

IPC: H01B1/22 ,  H01B1/24 ,  H01R43/00 ,  H01B1/20 ,  B82Y30/00

CPC classification number: H05K3/323 ,  B82Y10/00 ,  H01L2224/83101 ,  H01L2924/12044 ,  H05K3/361 ,  H05K2201/0224 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T29/49117 ,  Y10T29/532 ,  H01L2924/00

Abstract: The circuit connecting material of the invention is situated between mutually opposing circuit electrodes, and provides electrical connection between the electrodes in the pressing direction when the mutually opposing circuit electrodes are pressed, the circuit connecting material comprising anisotropic conductive particles wherein conductive fine particles are dispersed in an organic insulating material.

Abstract translation: 本发明的电路连接材料位于相互相对的电路电极之间，并且当相互相对的电路电极被按压时，在按压方向上提供电极之间的电连接，该电路连接材料包括导电细颗粒分散在其中的各向异性导电颗粒 有机绝缘材料。

公开(公告)号：US08142688B2

公开(公告)日：2012-03-27

申请号：US11390663

申请日：2006-03-28

Applicant: Yoshihiro Kobayashi ,  Kiyoshi Itoh

Inventor： Yoshihiro Kobayashi ,  Kiyoshi Itoh

IPC: H01B1/02

CPC classification number: H01L51/0021 ,  G03F7/0047 ,  H01L27/3239 ,  H01L51/0015 ,  H01L51/5048 ,  H01L51/5088 ,  H05K1/092 ,  H05K3/105 ,  H05K2201/0224 ,  H05K2203/1142 ,  Y10T428/2991 ,  Y10T428/31928

Abstract: The present disclosure provides a conductive pattern formed body with a conductive pattern formed efficiently and highly precisely in a simple process, a conductivity variable laminated body used for formation of the conductive pattern, and the like. The disclosure provides a conductivity variable composition characterized by containing insulating particle including a conductive inorganic material and an organic material adhered on the circumference of the conductive inorganic material, and a photocatalyst.

Abstract translation: 本公开内容提供了一种具有导电图案的导电图案形成体，其具有以简单的方法有效且高度精确地形成的导电图案，用于形成导电图案的导电率可变叠层体等。 本发明提供了一种电导率可变组合物，其特征在于包含绝缘颗粒，其包含导电无机材料和粘附在导电无机材料的圆周上的有机材料和光催化剂。

公开(公告)号：US08088486B2

公开(公告)日：2012-01-03

申请号：US11407401

申请日：2006-04-19

Applicant: Naoyuki Toyoda ,  Toshiyuki Miyabayashi

Inventor： Naoyuki Toyoda ,  Toshiyuki Miyabayashi

IPC: B32B5/66

CPC classification number: H05K1/097 ,  B22F1/0059 ,  C09D11/30 ,  H05K3/125 ,  H05K2201/0224 ,  H05K2203/013 ,  Y10T428/2991 ,  Y10T428/2998

Abstract: A microencapsulated particulate metal material includes metal particles, a polymer coating the metal particles, and an ionic group provided on a surface of the polymer.

Abstract translation: 微胶囊化颗粒状金属材料包括金属颗粒，涂覆金属颗粒的聚合物和设置在聚合物表面上的离子基团。

公开(公告)号：US20100222477A1

公开(公告)日：2010-09-02

申请号：US11993350

申请日：2006-06-21

Applicant: Nami Tsukamoto ,  Toshifumi Hashiba ,  Mayumi Mizushiri

Inventor： Nami Tsukamoto ,  Toshifumi Hashiba ,  Mayumi Mizushiri

IPC: C08K5/29 ,  C07C267/00

CPC classification number: C08K9/04 ,  H05K1/0373 ,  H05K2201/0209 ,  H05K2201/0224

Abstract: A filler for substrates which comprises an inorganic substance and a carbodiimide-group-containing organic layer chemically bonded to the surface of the inorganic substance. Examples of the carbodiimide-group-containing organic layer include a layer comprising a carbodiimide-group-containing compound represented by either of the following formulae. Due to the constitution, the filler for substrates can be highly dispersed in a resin for substrates even when added in a high proportion and can give a substrate inhibited from deteriorating in electrical properties, mechanical properties, etc. (X1)m—Z-[A-(R1—N═C═N)n—R1—NCO]1   (1) (X1)m—Z-[A-(R1—N═C═N)n—R1-A-Z—(X2)3]1   (2) [R1 represents a residue of an isocyanate compound; X′ and X2 each independently represents hydrogen, halogeno, etc.; Z′s each independently represents silicon or titanium; A represents an organic group having a valence of 2 or higher containing a bond derived from an isocyanate group; m and 1 each is an integer of 1-3, provided that m+1=4; and n is an integer of 1-100.]

Abstract translation: 一种用于基材的填料，其包含无机物质和与无机物质的表面化学键合的含碳二亚胺基的有机层。 含有碳二亚胺基的有机层的实例包括由下式表示的含碳二亚胺基化合物的层。 由于该结构，即使以高比例添加，基板用填料也可以高分散在基板用树脂中，能够抑制电性，机械性能等劣化的基板（X1）m-Z- [ A-（R1-N = C = N）n-R1-NCO] 1（1）（X1）m-Z- [A-（R1-N = C = N）n-R1-AZ-（X2）3 ] 1（2）[R1表示异氰酸酯化合物的残基] X'和X2各自独立地表示氢，卤素等; Z各自独立地表示硅或钛; A表示含有来自异氰酸酯基的键的化合价为2以上的有机基团; m和1各自为1-3的整数，条件是m + 1 = 4; n为1-100的整数。]

公开(公告)号：US20100219382A1

公开(公告)日：2010-09-02

申请号：US12738017

申请日：2008-10-21

Applicant: Shinji Abe

Inventor： Shinji Abe

IPC: H01B1/16

CPC classification number: H05K3/323 ,  C08K3/017 ,  C08K9/02 ,  C09J9/02 ,  C09J11/04 ,  H01B1/22 ,  H01R4/04 ,  H05K2201/0209 ,  H05K2201/0221 ,  H05K2201/0224 ,  Y10T428/2991

Abstract: The present invention provides a coated conductive powder in which the aggregation of conductive particles is suppressed and which is also excellent in electrical reliability, and a conductive adhesive using the same that can provide connection with high electrical reliability even for the connection of the electrodes of miniaturized electronic parts, such as IC chips, and circuit boards. The coated conductive powder of the present invention is a coated conductive powder obtained by coating the surfaces of conductive particles with insulating inorganic fine particles, wherein the volume resistivity value of the coated conductive powder is 1 Ω·cm or less, the specific gravity of the insulating inorganic fine particles is 5.0 g/ml or less, the particle diameter ratio of the insulating inorganic fine particles to the conductive particles (the insulating inorganic fine particles/the conductive particles) is 1/100 or less, and the insulating inorganic fine particles adhere to the surfaces of the conductive particles.

Abstract translation: 本发明提供了一种涂覆的导电粉末，其中导电颗粒的聚集被抑制并且电可靠性也优异，并且使用该导电粘合剂可以提供甚至连接小型化的电极的高电气可靠性 电子部件，如IC芯片和电路板。 本发明的涂覆导电粉末是通过用绝缘无机细颗粒涂覆导电颗粒的表面而获得的涂覆导电粉末，其中涂覆的导电粉末的体积电阻率值为1＆OHgr·cm以下，比重为 绝缘性无机微粒为5.0g / ml以下，绝缘性无机微粒与导电性粒子（绝缘性无机微粒/导电性粒子）的粒径比为1/100以下，绝缘性无机质 颗粒附着在导电颗粒的表面上。