公开(公告)号：US20240178749A1

公开(公告)日：2024-05-30

申请号：US18516826

申请日：2023-11-21

Applicant: CYNTEC CO., LTD.

Inventor： Chih-Tai Cheng ,  Pei-Yuan Chen

IPC: H02M3/00 ,  H02M3/158

CPC classification number: H02M3/003 ,  H02M3/1582

Abstract: A voltage convertor module includes a lead-frame, a unitary bare die and a molding body. The lead-frame can have a plurality of electrodes including an input voltage electrode, an output voltage electrode, a ground electrode and a controlling electrode. The unitary bare die is disposed only on the lead-frame, where a plurality of pads of the unitary bare die are electrically connected to the electrodes of the lead-frame correspondingly. The unitary bare die includes the plurality of pads, a buck controller block, a first switching unit block, a second switching unit block, a feedback unit block and a plurality of routing structures.

公开(公告)号：US11967446B2

公开(公告)日：2024-04-23

申请号：US17140143

申请日：2021-01-04

Applicant: CYNTEC CO., LTD.

Inventor： Chun-Tiao Liu ,  Lan-Chin Hsieh ,  Tsung-Chan Wu ,  Chi-Hsun Lee ,  Chih-Siang Chuang

IPC: H01F27/25 ,  H01F1/147 ,  H01F17/04 ,  H01F27/02 ,  H01F27/255 ,  H01F27/28 ,  H01F27/29

CPC classification number: H01F27/022 ,  H01F1/14741 ,  H01F1/14766 ,  H01F1/14791 ,  H01F17/045 ,  H01F27/255 ,  H01F27/2828 ,  H01F27/29

Abstract: An inductor is disclosed, the inductor comprising: a T-shaped magnetic core, being made of a material comprising an annealed soft magnetic metal material and having a base and a pillar integrally formed with the base, wherein μC×Hsat≥1800, where μC is a permeability of the T-shaped magnetic core, and Hsat (Oe) is a strength of the magnetic field at 80% of μC0, where μC0 is the permeability of the T-shaped magnetic core when the strength of the magnetic field is 0.

公开(公告)号：US20240105670A1

公开(公告)日：2024-03-28

申请号：US17952348

申请日：2022-09-26

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Hung Su

IPC: H01L23/00 ,  H01Q1/48 ,  H01Q9/04

CPC classification number: H01L24/73 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01Q1/48 ,  H01Q9/0407 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/0332 ,  H01L2224/0363 ,  H01L2224/05552 ,  H01L2224/05573 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/1163 ,  H01L2224/11825 ,  H01L2224/13012 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13616 ,  H01L2224/13618 ,  H01L2224/13639 ,  H01L2224/13647 ,  H01L2224/13655 ,  H01L2224/16227 ,  H01L2224/27462 ,  H01L2224/2763 ,  H01L2224/29012 ,  H01L2224/29034 ,  H01L2224/29082 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/29113 ,  H01L2224/29116 ,  H01L2224/29118 ,  H01L2224/29139 ,  H01L2224/29147 ,  H01L2224/29155 ,  H01L2224/32227 ,  H01L2224/73103 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/1421 ,  H01L2924/1423

Abstract: An electronic component with high coplanarity, including a body with a functional circuit and a mounting plane, a first electrode with a first area deposited on the mounting plane, and a second electrode with a second area deposited on the mounting plane, wherein the first area is larger than the second area, and the first electrode and the second electrode includes a conductive layer and at least one first plating layer over the conductive layer, and a thickness of the conductive layer of the first electrode is smaller than a thickness of the conductive layer of the second electrode, and a thickness of the first plating layer of the first electrode is larger than a thickness of the first plating layer of the second electrode.

公开(公告)号：US11929460B2

公开(公告)日：2024-03-12

申请号：US16698131

申请日：2019-11-27

Applicant: Cyntec Co., Ltd.

Inventor： Chihung Su ,  Wenhsiung Liao

IPC: H01M10/0562 ,  H01M4/04 ,  H01M50/46

CPC classification number: H01M10/0562 ,  H01M4/0419 ,  H01M50/46

Abstract: A solid-state battery includes a first electrode; a second electrode having a first side facing a first side of the first electrode and spaced from the first electrode; and a solid electrolyte at least partially disposed in a space between the first electrode and the second electrode for providing a path for metal ions associated with the first electrode and/or the second electrode to move through. The metal ions are kept differentially distributed along the path.

公开(公告)号：US20240049391A1

公开(公告)日：2024-02-08

申请号：US18229177

申请日：2023-08-02

Applicant: CYNTEC CO., LTD.

Inventor： Chien Ming Chen ,  DA-JUNG CHEN ,  SSU-LUNG HSU

IPC: H05K1/14 ,  H05K5/00 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/144 ,  H05K5/0065 ,  H05K1/028 ,  H05K1/118 ,  H05K1/147 ,  H05K5/0069 ,  H05K2201/10939

Abstract: An electronic module, comprising: a first electronic device, a first circuit board disposed over the first top surface, and a second circuit board disposed under the bottom surface of the body of the first electronic device, wherein a plurality of conductors are disposed over a first lateral surface for electrically connecting the first circuit board and the second circuit board, wherein a plurality of electrodes of the electronic module are disposed on a bottom surface of the second circuit board.

公开(公告)号：US11862835B2

公开(公告)日：2024-01-02

申请号：US17393414

申请日：2021-08-04

Applicant: CYNTEC CO., LTD.

Inventor： Sheng-Ju Chou ,  Chen-Chung Liu

IPC: H01P1/205 ,  H01P1/20 ,  H01P3/16

CPC classification number: H01P1/2002 ,  H01P1/2053 ,  H01P3/16

Abstract: The present invention discloses a dielectric filter with multilayer resonator, including a dielectric block, a plurality of multilayer resonator formed in the dielectric block, wherein each multilayer resonator is in a column shape extending in a first direction into the dielectric block and is formed of multiple metal layers paralleling and overlapping each other in a second direction, and vias extend in the second direction and connecting the metal layers in each multilayer resonator, and a ground electrode connected to the ground terminal of each multilayer resonator.

公开(公告)号：US20230411057A1

公开(公告)日：2023-12-21

申请号：US18241916

申请日：2023-09-04

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Ching Hsiang Yu ,  Kuan Yu Chiu ,  YU-HSIN LIN

IPC: H01F5/06 ,  H01F5/04 ,  H05K1/11 ,  H01F41/063 ,  H01F41/076 ,  H01F27/06 ,  H05K1/18

CPC classification number: H01F5/06 ,  H01F5/04 ,  H05K1/118 ,  H01F41/063 ,  H01F41/076 ,  H01F27/06 ,  H05K1/182 ,  H01F2027/065 ,  H05K2201/1003 ,  H05K1/112

Abstract: A coil structure comprises a coil and a conductive terminal part, wherein the coil is formed by a conductive wire comprising a metal wire and at least one insulating layer encapsulating the metal wire, wherein a first terminal part of the metal wire is exposed from the at least one insulating layer, wherein a first portion of the conductive terminal part encapsulates the first terminal part of the metal wire and a second portion of the conductive terminal part extends from said first portion as an electrode for electrically connecting to an external circuit.

公开(公告)号：US20230358945A1

公开(公告)日：2023-11-09

申请号：US18143089

申请日：2023-05-04

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Jui Yang

IPC: F21V8/00 ,  H01R13/717

CPC classification number: G02B6/0073 ,  H01R13/7175 ,  G02B6/0015

Abstract: A light guide assembly, comprising: a substrate and a light guide disposed on the substrate, wherein the top surface of the body comprises a first protrusion having a first slanting surface and a second slanting surface opposite to the first slanting surface for reflecting lights entering into the body, wherein a first outer surface of the body extends from a first lateral surface to the first slanting surface, wherein a highest point of the first slanting surface is located between the first lateral surface and a second lateral surface opposite to the first lateral surface, and a highest point of the second slanting surface is located between the first lateral surface and a lowest point of the second slanting surface.

公开(公告)号：US11791079B2

公开(公告)日：2023-10-17

申请号：US16821014

申请日：2020-03-17

Applicant: CYNTEC CO., LTD.

Inventor： Min-Feng Chung ,  Ching Hsiang Yu ,  Kuan Yu Chiu ,  Yu-Hsin Lin

IPC: H01F5/00 ,  H01F5/06 ,  H01F5/04 ,  H05K1/11 ,  H01F41/063 ,  H01F41/076 ,  H01F27/06 ,  H05K1/18

CPC classification number: H01F5/06 ,  H01F5/04 ,  H01F27/06 ,  H01F41/063 ,  H01F41/076 ,  H05K1/118 ,  H05K1/182 ,  H01F2027/065 ,  H05K1/112 ,  H05K2201/1003

Abstract: A coating layer is formed on a coil made of an insulated conductive wire comprising a metal wire and an insulating layer encapsulating the metal layer, wherein the coating layer encapsulates at least one portion of the insulating layer of the insulated conductive wire so that a terminal part of the metal wire exposed from the insulating layer can be positioned firmly while going through an automatic soldering process for electrically connecting with an external circuit.

公开(公告)号：US11769621B2

公开(公告)日：2023-09-26

申请号：US16732342

申请日：2020-01-01

Applicant: CYNTEC CO., LTD.

Inventor： Chi-Hsun Lee ,  Hsieh-Shen Hsieh ,  Sen-Huei Chen

IPC: H01F27/29 ,  H01F27/24 ,  H01F27/28 ,  H01F17/04 ,  H01F41/02 ,  H01F41/076

CPC classification number: H01F27/292 ,  H01F17/04 ,  H01F27/24 ,  H01F27/28 ,  H01F27/2823 ,  H01F27/29 ,  H01F41/0206 ,  H01F41/076

Abstract: A method to form an electrical component, comprising: overlaying a conductive and adhesive layer on a body and covering a first portion of a terminal part of a conductive element, wherein a second portion of the terminal part of the conductive element is not covered by the conductive and adhesive layer; and overlaying at least one metal layer on the conductive and adhesive layer and covering the second portion of the terminal part of the conductive element, wherein the at least one metal layer is electrically connected to the second portion of the terminal part of the conductive element for electrically connecting with an external circuit.