公开(公告)号：US20040072420A1

公开(公告)日：2004-04-15

申请号：US10271646

申请日：2002-10-15

Applicant: Brewer Science, Inc

Inventor： Tomoyuki Enomoto ,  Keisuke Nakayama ,  Rama Puligadda

IPC: H01L021/44

CPC classification number: G03F7/091 ,  Y10T428/31938

Abstract: The present invention relates to an anti-reflective coating composition characterized by comprising a resin made from triazine compounds having at least two nitrogen atoms substituted a hydroxymethyl group and/or an alkoxymethyl group, and a light absorbing compound and/or a light absorbing resin. The present invention offers an anti-reflective coating composition for the anti-reflective coating having high light absorption property of the light used for the lithography process in the preparation of semiconductor device, showing high reflective light preventing effect, being used at thinner film thickness more than before, and having greater dry etching rate in comparison to photoresist layer.

Abstract translation: 本发明涉及一种抗反射涂料组合物，其特征在于包含由具有至少两个氮原子取代羟甲基和/或烷氧基甲基的三嗪化合物制成的树脂，以及光吸收化合物和/或光吸收树脂。 本发明提供了一种用于抗反射涂层的抗反射涂层组合物，其在制备半导体器件时用于光刻工艺的光具有高的光吸收特性，显示出高的防反射光效果，在更薄的膜厚度下使用 并且与光致抗蚀剂层相比具有更大的干蚀刻速率。

公开(公告)号：US20250096005A1

公开(公告)日：2025-03-20

申请号：US18890144

申请日：2024-09-19

Applicant: Brewer Science, Inc.

Inventor： Jinhua Dai ,  Joyce A. Lowes ,  Daniel Patrick Sweat

IPC: H01L21/3105 ,  H01L21/02 ,  H01L21/027 ,  H01L21/32

Abstract: Compositions and methods for global planarization of microelectronic substrates are provided. The methods include applying a crosslinking modifier composition to the surface of a substrate, or to any intermediate layer(s) on the substrate surface. A planarizing material can then be applied to the crosslinking modifier layer, which influences the degree of crosslinking in the planarizing layer. Depending on the specific topography of the underlying substrate (or intermediate layer), different amounts of planarizing material are removed during a subsequent develop back step, thereby eliminating bias that usually exists between regions of varying topographic density. The result is an effective global planarization method that is both time and cost efficient.

公开(公告)号：US20250068077A1

公开(公告)日：2025-02-27

申请号：US18813295

申请日：2024-08-23

Applicant: Brewer Science, Inc.

Inventor： Daniel Patrick Sweat ,  Joyce A. Lowes

IPC: G03F7/11 ,  C07C67/313 ,  C07C69/734 ,  C07D251/32 ,  C08F8/14 ,  C08F38/00 ,  C08G59/14 ,  G03F7/20

Abstract: A novel method to prepare crosslinked thin films without the use of catalysts is disclosed. Propiolic acid is grafted to a glycidyl or epoxy group using a phosphonium catalyst under mild conditions to yield a propiolate ester. The propiolate ester is thermally crosslinkable (and the polymer film rendered insoluble) at temperatures as low as 120° C., and some embodiments may undergo photoinduced crosslinking upon exposure to DUV light. The resulting crosslinked films are equivalent or better in stability to acid-catalyzed epoxide crosslinked films and can be used for a multitude of different applications.

公开(公告)号：US12057308B2

公开(公告)日：2024-08-06

申请号：US17682175

申请日：2022-02-28

Applicant: Brewer Science, Inc.

Inventor： Jinhua Dai ,  Joyce A. Lowes ,  Reuben Chacko

IPC: H01L21/02 ,  C08F220/68 ,  C09D133/16 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L21/0212 ,  C08F220/68 ,  C09D133/16 ,  H01L21/02282 ,  H01L23/293 ,  H01L23/3171

Abstract: Materials and methods for modifying semiconducting substrate surfaces in order to dramatically change surface energy are provided. Preferred materials include perfluorocarbon molecules or polymers with various functional groups. The functional groups (carboxylic acids, hydroxyls, epoxies, aldehydes, and/or thiols) attach materials to the substrate surface by physical adsorption or chemical bonding, while the perfluorocarbon components contribute to low surface energy. Utilization of the disclosed materials and methods allows rapid transformation of surface properties from hydrophilic to hydrophobic (water contact angle 120° and PGMEA contact angle) 70°. Selective liquiphobic modifications of copper over Si/SiOx, TiOx over Si/SiOx, and SiN over SiOx are also demonstrated.

公开(公告)号：US20240222122A1

公开(公告)日：2024-07-04

申请号：US18607956

申请日：2024-03-18

Applicant: Brewer Science, Inc.

Inventor： Andrea M. Chacko ,  Vandana Krishnamurthy ,  Yichen Liang ,  Hao Lee ,  Stephen Grannemann ,  Douglas J. Guerrero

IPC: H01L21/027 ,  G03F1/24 ,  G03F7/00 ,  H01L21/02

CPC classification number: H01L21/0274 ,  G03F1/24 ,  G03F7/70033 ,  H01L21/02115 ,  H01L21/02282 ,  H01L21/02304 ,  H01L21/02422

Abstract: New lithographic compositions for use as EUV adhesion layers are provided. The present invention provides methods of fabricating microelectronics structures using those compositions as well as structures formed by those methods. The method involves utilizing an adhesion layer immediately below the photoresist layer. The adhesion layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate, such as an alpha-carbon, spin-on carbon, spin-on silicon hardmask, metal hardmask, or deposited silicon layer. The preferred adhesion layers are formed from spin-coatable, polymeric compositions. The inventive method improves adhesion and reduces or eliminates pattern collapse issues.

公开(公告)号：US20240134281A1

公开(公告)日：2024-04-25

申请号：US18483118

申请日：2023-10-09

Applicant: Brewer Science, Inc.

Inventor： Daniel Patrick Sweat

IPC: G03F7/075 ,  G03F7/16 ,  G03F7/20 ,  G03F7/34

CPC classification number: G03F7/0755 ,  G03F7/168 ,  G03F7/2004 ,  G03F7/346 ,  G03F7/32

Abstract: Methods for direct patterning of a silicon hardmask with extreme ultraviolet (EUV) radiation are provided. The method involves forming a polysiloxane and/or oligosiloxane composition into a silicon hardmask layer followed by solvent removal. Without using a photoresist and/or other layer silicon hardmask layer, condensation of the siloxane sol-gel polymers and/or oligomers is induced by EUV radiation, rendering the exposed portions insoluble in typical lithography solvents or developers. The exposed portions of the silicon hardmask layer are removed, leaving a pattern in the silicon hardmask layer that can be transferred to any layers below the silicon hardmask layer, and ultimately to the substrate.

公开(公告)号：US11817317B2

公开(公告)日：2023-11-14

申请号：US17079916

申请日：2020-10-26

Applicant: Brewer Science, Inc.

Inventor： Ming Luo ,  Yubao Wang ,  Kaumba Sakavuyi ,  Vandana Krishnamurthy

IPC: H01L21/033 ,  G03F1/46 ,  H01L21/027

CPC classification number: H01L21/0332 ,  G03F1/46 ,  H01L21/0271

Abstract: Lithographic compositions for use as wet-removable silicon gap fill layers are provided. The method of using these compositions involves utilizing a silicon gap fill layer over topographic features on a substrate. The silicon gap fill layer can either be directly applied to the substrate, or it can be applied to any intermediate layer(s) that may be applied to the substrate. The preferred silicon gap fill layers are formed from spin-coatable, polymeric compositions with high silicon content, and these layers exhibit good gap fill and planarization performance and high oxygen etch resistance.

公开(公告)号：US11610801B2

公开(公告)日：2023-03-21

申请号：US16747271

申请日：2020-01-20

Applicant: Brewer Science, Inc.

Inventor： Luke Prenger ,  Arthur O. Southard ,  Qi Wu ,  Xiao Liu

IPC: H01L21/683 ,  C08G73/02 ,  H01L21/56 ,  B32B43/00

Abstract: Novel polyketanil-based compositions for use as a laser-releasable composition for temporary bonding and laser debonding processes are provided. The inventive compositions can be debonded using various UV lasers, at wavelengths from about 300 nm to about 360 nm, leaving behind little to no debris. The layers formed from these compositions possess good thermal stabilities and are resistant to common solvents used in semiconductor processing. The compositions can also be used as build-up layers for redistribution layer formation.

公开(公告)号：US20230065235A1

公开(公告)日：2023-03-02

申请号：US17745375

申请日：2022-05-16

Applicant: Brewer Science, Inc.

Inventor： Zun Chen ,  Christopher Landorf ,  Vijaya Kayastha

IPC: G01N33/00 ,  G01N27/414

Abstract: A carbon nanotube sensor device for detecting CO2 and methods of its production and use. A printable polyethylenimine (PEI)-functionalized carbon nanomaterial paste may be used to form the active sensing layer of the device, which is particularly sensitive to CO2. A separate printed heating layer may be used to maintain the working temperature of the sensor, as well as to remove and/or clear volatile gases from the sensor.

公开(公告)号：US20230018859A1

公开(公告)日：2023-01-19

申请号：US17856816

申请日：2022-07-01

Applicant: Brewer Science, Inc.

Inventor： Jonathan J. Fury ,  Xi Cao ,  Austin Peters ,  Chad Lakin ,  Cody Simmons ,  Alec Neeson

IPC: G01N27/38 ,  G01N27/416 ,  G01N33/18 ,  G01N27/333

Abstract: A sensing platform for continuous water resource monitoring by electrochemical detection and solution parameter correction is provided. The sensing platform employs a solid-state electrolyte three-electrode cell, creating a high ionic strength environment within the solid-state electrolyte membrane, which is in ion exchange equilibria with the sampled solution. This device may be used as a standalone sensor in environments where the water parameters (pH temperature, and ionic strength) are controlled, or in concert with compensation sensors where water parameters are not controlled.