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61.发明申请公开(公告)号：US20090013526A1
公开(公告)日：2009-01-15
申请号：US11959212
申请日：2007-12-18
Applicant: CHIH-KANG YANG , CHENG-HSIEN LIN
Inventor： CHIH-KANG YANG , CHENG-HSIEN LIN
CPC classification number: H05K3/0097 , H05K1/0393 , H05K3/06 , H05K3/242 , H05K3/4611 , H05K3/4635 , H05K3/4652 , H05K3/4691 , H05K2201/055 , H05K2201/09036 , H05K2201/09063 , H05K2201/1028 , H05K2203/1536 , H05K2203/1545 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49165 , Y10T428/15
Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other. An exemplary method for manufacturing multilayer printed circuit boards using the inner substrate is also provided. The method can improve efficiency of manufacturing multilayer printed circuit boards.
Abstract translation: 提供了用于制造多层印刷电路板的示例性内基板。 内部基板具有多个基板单元和沿着内部基板的纵向方向交替排列的多个横向折叠部。 每个基板单元被构造成用于形成一体的印刷电路板。 每个折叠部分在相邻的基板单元之间互连。 每个折叠部分限定垂直于内部基板的纵向方向的至少一条线弱点，以便于相邻的基板单元相互折叠和展开。 还提供了使用内部基板制造多层印刷电路板的示例性方法。 该方法可以提高制造多层印刷电路板的效率。
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公开(公告)号：US20080283289A1
公开(公告)日：2008-11-20
申请号：US12047152
申请日：2008-03-12
Applicant: Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
Inventor： Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
IPC: H05K1/02
CPC classification number: H05K1/025 , H05K1/111 , H05K2201/09727 , Y02P70/611
Abstract: The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced.
Abstract translation: 印刷电路板技术领域本发明涉及印刷电路板。 在一个实施例中，印刷电路板包括介电层和形成在电介质层上的导电迹线。 导电层包括第一导电部分，连接部分和第二导电部分。 连接部分包括第一端和第二端。 第一端连接到第一导电部分; 第二端连接到第二导电部分。 连接部的宽度从第一端到第二端逐渐减小。 可以减少在所呈现的印刷电路板中传输的信号的反射和串扰。
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公开(公告)号：US20080264675A1
公开(公告)日：2008-10-30
申请号：US11847297
申请日：2007-08-29
Applicant: WEN-CHIN LEE , CHENG-HSIEN LIN
Inventor： WEN-CHIN LEE , CHENG-HSIEN LIN
CPC classification number: H05K3/281 , B23K1/0016 , B23K26/361 , H05K3/0035 , H05K3/28 , H05K3/3452
Abstract: An exemplary method for manufacturing a printed circuit board is provided. In the method, firstly, a circuit substrate having a substrate and a number of soldering pads is provided. Secondly, a protective layer is formed onto the circuit substrate in a manner such that the soldering pads are entirely covered by the protective layer. Fourthly, a laser beam is applied onto portions of the protective layer spatially corresponding to the soldering pads in a manner such that the portions of the protective layer is removed, thereby exposing the soldering pads to an exterior. A printed circuit board having a protective layer with high precision of resolution is also provided.
Abstract translation: 提供了制造印刷电路板的示例性方法。 在该方法中，首先，提供具有基板和多个焊盘的电路基板。 其次，以使得焊盘完全被保护层覆盖的方式在电路基板上形成保护层。 第四，以保护层的部分被去除的方式将激光束施加到空间对应于焊盘的保护层的部分上，从而将焊盘暴露于外部。 还提供了具有高精度分辨率的保护层的印刷电路板。
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公开(公告)号：US09247650B2
公开(公告)日：2016-01-26
申请号：US12589459
申请日：2009-10-22
Applicant: Yao-Wen Bai , Rui Zhang , Cheng-Hsien Lin
Inventor： Yao-Wen Bai , Rui Zhang , Cheng-Hsien Lin
CPC classification number: H05K3/246 , B82Y10/00 , C23C18/18 , H05K3/125 , H05K2201/026 , H05K2201/0323 , H05K2201/0347 , H05K2203/013 , H05K2203/072
Abstract: A method for making conductive wires is provided. Firstly, an ink having carbon nanotubes is provided. Secondly, a baseline is formed using the ink on a substrate. Thirdly, the baseline is electroless plated.
Abstract translation: 提供制造导线的方法。 首先，提供具有碳纳米管的油墨。 其次，使用基板上的墨形成基线。 第三，基线是无电镀。
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公开(公告)号：US20120237721A1
公开(公告)日：2012-09-20
申请号：US13461006
申请日：2012-05-01
Applicant: CHENG-HSIEN LIN , YAO-WEN BAI , WEN-CHIN LEE , RUI ZHANG , KAI-LI JIANG , CHEN FENG
Inventor： CHENG-HSIEN LIN , YAO-WEN BAI , WEN-CHIN LEE , RUI ZHANG , KAI-LI JIANG , CHEN FENG
CPC classification number: H05K9/009 , B29C70/882 , B29C70/885 , B29K2105/167 , C08L2666/76 , H05K9/0083 , H05K9/0088 , Y10S977/784 , Y10S977/789 , Y10T428/24132 , Y10T428/249979
Abstract: An electromagnetic shielding composite includes a polymer and a carbon nanotube film structure. The carbon nanotube structure includes a number of carbon nanotubes disposed in the polymer. The number of carbon nanotubes are parallel with each other.
Abstract translation: 电磁屏蔽复合材料包括聚合物和碳纳米管薄膜结构。 碳纳米管结构包括设置在聚合物中的多个碳纳米管。 碳纳米管的数量彼此平行。
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Patent Agency Ranking
公开(公告)号：US08071887B2
公开(公告)日：2011-12-06
申请号：US12253869
申请日：2008-10-17
Applicant: Shing-Tza Liou , Yao-Wen Bai , Cheng-Hsien Lin
Inventor： Shing-Tza Liou , Yao-Wen Bai , Cheng-Hsien Lin
IPC: H05K1/03
CPC classification number: H05K1/097 , B82Y10/00 , H05K3/125 , H05K3/246 , H05K2201/026 , H05K2201/0272 , H05K2201/0323 , H05K2201/0347 , H05K2203/013 , Y10T29/49155 , Y10T428/2462 , Y10T428/30 , Y10T428/32
Abstract: A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.
Abstract translation: 印刷电路板包括具有表面的基板，具有形成在表面上的多个电迹线的电路层和形成在电路层上的导电金属层。 电路层由碳纳米管和金属纳米颗粒组成。
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公开(公告)号：US08049113B2
公开(公告)日：2011-11-01
申请号：US12047152
申请日：2008-03-12
Applicant: Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
Inventor： Dong-Qing He , Ming Wang , Chih-Yi Tu , Cheng-Hsien Lin
IPC: H05K1/02
CPC classification number: H05K1/025 , H05K1/111 , H05K2201/09727 , Y02P70/611
Abstract: The present invention relates to a printed circuit board. In one embodiment, a printed circuit board includes a dielectric layer and a conductive trace formed on the dielectric layer. The conductive layer includes a first conductive portion, a connecting portion and a second conductive portion. The connecting portion includes a first end and a second end. The first end is connected to the first conductive portion; the second end is connected to the second conductive portion. A width of the connecting portion gradually decreases from the first end to the second end. Reflection and cross talk of signals transmitted in the presented printed circuit board can be reduced.
Abstract translation: 印刷电路板技术领域本发明涉及印刷电路板。 在一个实施例中，印刷电路板包括介电层和形成在电介质层上的导电迹线。 导电层包括第一导电部分，连接部分和第二导电部分。 连接部分包括第一端和第二端。 第一端连接到第一导电部分; 第二端连接到第二导电部分。 连接部的宽度从第一端到第二端逐渐减小。 可以减少在所呈现的印刷电路板中传输的信号的反射和串扰。
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68.发明申请Carbon nanotube metal nanoparticle composite and method for making the same 审中-公开碳纳米管金属纳米颗粒复合材料及其制备方法公开(公告)号：US20100255290A1
公开(公告)日：2010-10-07
申请号：US12589477
申请日：2009-10-22
Applicant: Yao-Wen Bai , Qiu-Yue Zhang , Cheng-Hsien Lin
Inventor： Yao-Wen Bai , Qiu-Yue Zhang , Cheng-Hsien Lin
CPC classification number: B82Y30/00 , B82Y40/00 , C01B32/174 , Y10T428/254
Abstract: A method for making carbon nanotube precious metal nanoparticles composite includes the following steps. A solution dissolving precious metal ions is provided. A water soluble polymer is provided and dissolved in water to form a solution of the soluble polymer. The solution of the precious metal ions is added into the solution of the soluble polymer to form a first mixture. A solution of carbon nanotubes is provided and added in the first mixture to form a second mixture. The second mixture is irradiated via radiation, the radiation have a wave length less than 450 nm.
Abstract translation: 制备碳纳米管贵金属纳米复合材料的方法包括以下步骤。 提供了溶解贵金属离子的溶液。 提供水溶性聚合物并溶解在水中以形成可溶性聚合物的溶液。 将贵金属离子的溶液加入到可溶性聚合物的溶液中以形成第一混合物。 提供碳纳米管溶液并加入到第一混合物中以形成第二混合物。 第二混合物通过辐射照射，辐射波长小于450nm。
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公开(公告)号：US07789989B2
公开(公告)日：2010-09-07
申请号：US12270612
申请日：2008-11-13
Applicant: Lin Ren , Ying Su , Cheng-Hsien Lin
Inventor： Lin Ren , Ying Su , Cheng-Hsien Lin
IPC: B29C65/00
CPC classification number: H05K3/4691 , H05K3/0052 , H05K3/4611 , H05K2201/0909 , H05K2201/09127 , Y10T156/1052 , Y10T156/1062 , Y10T156/1064
Abstract: A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.
Abstract translation: 制造刚柔柔性印刷电路板的方法包括以下步骤。 首先，提供柔性基板。 其次，在柔性基板中限定至少一个狭缝。 第三，提供具有对应于柔性基板的结构的刚性基板。 第四，将柔性基板层合到刚性基板上以获得层压基板。 第五，去除刚性基板的一部分。 第六，层叠基板沿着假想边界线切割以去除层叠基板的废弃部分。 因此，获得刚性柔性印刷电路板。
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公开(公告)号：US20100139966A1
公开(公告)日：2010-06-10
申请号：US12702439
申请日：2010-02-09
Applicant: CHIH-KANG YANG , CHENG-HSIEN LIN
Inventor： CHIH-KANG YANG , CHENG-HSIEN LIN
IPC: H05K1/11
CPC classification number: H05K3/0097 , H05K1/0393 , H05K3/06 , H05K3/242 , H05K3/4611 , H05K3/4635 , H05K3/4652 , H05K3/4691 , H05K2201/055 , H05K2201/09036 , H05K2201/09063 , H05K2201/1028 , H05K2203/1536 , H05K2203/1545 , Y10T29/49124 , Y10T29/49126 , Y10T29/4913 , Y10T29/49135 , Y10T29/49165 , Y10T428/15
Abstract: An exemplary inner substrate for manufacturing multilayer printed circuit boards is provided. The inner substrate has a number of substrate units and a number of transverse folding portions alternately arranged along a longitudinal direction of the inner substrate. Each of the substrate units is configured for forming a unitary printed circuit board. Each of the folding portions is interconnected between neighboring substrate units. Each of the folding portions defines at least one line of weakness perpendicular to the longitudinal direction of the inner substrate for facilitating folding and unfolding the neighboring substrate units to each other.
Abstract translation: 提供了用于制造多层印刷电路板的示例性内基板。 内部基板具有多个基板单元和沿着内部基板的纵向方向交替排列的多个横向折叠部。 每个基板单元被构造成用于形成一体的印刷电路板。 每个折叠部分在相邻的基板单元之间互连。 每个折叠部分限定垂直于内部基板的纵向方向的至少一条弱线，以便于相邻的基板单元相互折叠和展开。
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