Abstract:
In a method of forming a thin layer and a method of manufacturing a flash memory and a capacitor using the same, a first thin layer may be formed on a substrate, and the thin layer may include one of metal, metal nitride and a combination thereof. A binding inhibitor may be formed on the first thin layer by a surface treatment on the first thin layer. The binding inhibitor may reduce a bonding strength between first and second elements when a second thin layer is formed on the first thin layer in a subsequent process using a precursor including the first element and the second element having a ligand binding to the first element. In a flash memory, the first and second thin layers may be a floating gate and a dielectric layer, respectively, and in a capacitor, the first and second thin layers may be a lower electrode and a dielectric layer, respectively.
Abstract:
An apparatus for controlling an enable of a sense amplifier in a semiconductor memory device includes a test part for repeatedly varying a test code value until the enable of the sense amplifier has a zero margin with respect to data to be read by the sense amplifier, and for determining the test code value at a time point when the enable has the zero margin. A fuse array cuts a fuse corresponding to the determined test code value.
Abstract:
N-arylalkylphenylacetamide compounds of formula (I), and pharmaceutically acceptable salts thereof, possess potent analgesic and anti-inflammatory activities. ##STR1##
Abstract:
A method of forming an oxide layer. The method includes: forming a layer of reaction-inhibiting functional groups on a surface of a substrate; forming a layer of precursors of a metal or a semiconductor on the layer of the reaction-inhibiting functional groups; and oxidizing the precursors of the metal or the semiconductor in order to obtain a layer of a metal oxide or a semiconductor oxide. According to the method, an oxide layer having a high thickness uniformity may be formed and a semiconductor device having excellent electrical characteristics may be manufactured.
Abstract:
Methods of manufacturing a semiconductor device including a multi-layer of dielectric layers may include forming a metal oxide layer on a semiconductor substrate and forming a multi-layer of silicate layers including metal atoms and silicon atoms, on the metal oxide layer. The multi-layer of silicate layers may include at least two metallic silicate layers having different silicon concentrations, which are a ratio of silicon atoms among all metal atoms and silicon atoms included in the metallic silicate layer.
Abstract:
Provided are methods of removing water adsorbed or bonded to a surface of a semiconductor substrate, and methods of depositing an atomic layer using the method of removing water described herein. The method of removing water includes applying a chemical solvent to the surface of a semiconductor substrate, and removing the chemical solvent from the surface of the semiconductor substrate.
Abstract:
A backlight assembly, in which several parts are unified so as to reduce a number of parts used and simplify an assembly process includes lamps emitting light, first lamp sockets, each of which includes a first connection member coupled with one end of each of the lamps so as to be electrically connected to the end of each of the lamps, and a reflection plate to reflect the light emitted from the lamps, and including socket fixing units formed integrally therewith to respectively fix the first lamp sockets. Each of the socket fixing units includes a socket fixing groove formed on a bottom plane of the reflection plate.
Abstract:
Disclosed are a material for advertisement and a method for manufacturing the same. The material for advertisement includes a surface film layer, a pressure-sensitive adhesive layer and a release layer stacked in sequence, in which the surface film layer is composed of a biodegradable film layer containing 5 to 40 wt % of a biodegradable polymer and 95 to 60 wt % of an aliphatic polyester. The material including the biodegradable film layer can be used for print advertisement to be discarded after being used for a short period of time, and has biodegradability of 60% or more as compared with cellulose within six months when discarded, so that a toxic environmental hormone due to polyvinylchloride (PVC) is not emitted, and the environment is protected, thereby being very friendly toward humans and the earth.
Abstract:
A method of forming a semiconductor device includes forming a lower conductive pattern on a substrate, forming an insulating layer over the lower conductive pattern, forming a contact hole through the insulating layer to expose the lower conductive pattern, forming a first spacer along sides of the contact hole, and then forming a contact plug in the contact hole. The contact plug is formed so as to contact the lower conductive pattern.
Abstract:
A phase-change memory device, including a lower electrode, a phase-change material pattern electrically connected to the lower electrode, and an upper electrode electrically connected to the phase-change material pattern. The lower electrode may include a first structure including a metal semiconductor compound, a second structure on the first structure, the second structure including a metal nitride material, and including a lower part having a greater width than an upper part, and a third structure including a metal nitride material containing an element X, the third structure being on the second structure, the element X including at least one selected from the group of silicon, boron, aluminum, oxygen, and carbon.