公开(公告)号：US06270313B1

公开(公告)日：2001-08-07

申请号：US09347705

申请日：1999-07-03

Applicant: Te-Tsai Chuang ,  Kuo-Cheng Lin

Inventor： Te-Tsai Chuang ,  Kuo-Cheng Lin

IPC: F01D1712

CPC classification number: F04D29/667 ,  F04D25/0613 ,  F04D29/526 ,  F04D29/547 ,  F05D2250/51

Abstract: The present invention discloses a cooling system for temperature control, e.g., removing heat from electronic circuits. The cooling system includes a fan and an airflow guiding system where the guiding system includes an inlet air duct for guiding the airflow to the fan. The inlet air duct includes turbulence reduction grid for separating the air duct into a plurality of isolated flow path whereby the air turbulence is reduced. In a preferred embodiment, the airflow guiding system further includes an outlet duct for incorporating the fan therein wherein the outlet portion and the fan are directed to a direction different from the inlet air duct for guiding the airflow to the fan. In another preferred embodiment, the outlet duct and the fan are directed to a direction perpendicular to the inlet air duct for guiding the airflow to the fan. And, the inlet air duct and the outlet duct are connected via a corner duct-connector having a blunted corner angle for smoothing and reducing airflow turbulence flowing there through. In another preferred embodiment, the fan having a rotational shaft hung to the corner duct-connector whereby the fan is structurally supported only on the rotational shaft for reducing air turbulence. In another preferred embodiment, the fan includes a plurality of blades wherein the blades are configured to have a bending blade surface constituting same direction screw shape for reducing airflow turbulence. In another preferred embodiment, the blades are formed with a notch at a front end of the blades to reduce a reverse flow due to air resistance for further reducing airflow turbulence. In another preferred embodiment, the inlet air duct further includes other openings for increasing a flow rate of the airflow to improve the cooling efficiency.

Abstract translation: 本发明公开了一种用于温度控制的冷却系统，例如从电子电路去除热量。 冷却系统包括风扇和引导系统，其中引导系统包括用于将气流引导到风扇的入口空气管道。 入口风道包括用于将空气管道分离成多个隔离流动路径的湍流还原栅格，由此空气湍流减少。 在优选实施例中，气流引导系统还包括用于将风扇并入其中的出口管道，其中出口部分和风扇被引导到不同于入口空气管道的方向，用于将气流引导到风扇。 在另一个优选实施例中，出口管道和风扇被引导到垂直于入口空气管道的方向，用于将气流引导到风扇。 并且，入口空气管道和出口管道通过具有钝角转角的角管道连接器连接，用于平滑并减少流过其的气流湍流。 在另一优选实施例中，具有旋转轴的风扇悬挂在角管道连接器上，由此风扇仅在结构上被支撑在旋转轴上以减少空气湍流。 在另一个优选实施例中，风扇包括多个叶片，其中叶片构造成具有构成相同方向螺杆形状的弯曲叶片表面以减少气流紊流。 在另一个优选实施例中，叶片在叶片的前端形成有凹口，以减少由于空气阻力引起的反向流动，以进一步减少气流紊流。 在另一优选实施例中，入口空气管道还包括用于增加气流的流量以提高冷却效率的其它开口。

公开(公告)号：US08609526B2

公开(公告)日：2013-12-17

申请号：US12842617

申请日：2010-07-23

Applicant: Chung-Shi Liu ,  Cheng-Chung Lin ,  Ming-Che Ho ,  Kuo Cheng Lin ,  Meng-Wei Chou

Inventor： Chung-Shi Liu ,  Cheng-Chung Lin ,  Ming-Che Ho ,  Kuo Cheng Lin ,  Meng-Wei Chou

IPC: H01L21/445 ,  H01L21/4757

CPC classification number: H01L24/05 ,  H01L21/0206 ,  H01L21/02068 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/81022 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

Abstract: A method of forming an integrated circuit structure includes forming a copper-containing seed layer on a wafer, and performing a descum step on an exposed surface of the copper-containing seed layer. The descum step is performed using a process gas including fluorine and oxygen. A reduction/purge step is then performed on the exposed surface of the copper-containing seed layer using a nitrogen-containing gas. A copper-containing layer is plated on the copper-containing seed layer.

Abstract translation: 形成集成电路结构的方法包括在晶片上形成含铜晶种层，并在含铜种子层的暴露表面上进行除氧步骤。 除氧步骤使用包括氟和氧的工艺气体进行。 然后使用含氮气体在含铜种子层的暴露表面上进行还原/吹扫步骤。 含铜层镀在含铜种子层上。

公开(公告)号：US08324766B2

公开(公告)日：2012-12-04

申请号：US12728799

申请日：2010-03-22

Applicant: Hung-Chi Chen ,  Ying-Chi Chen ,  Te-Tsai Chuang ,  Kuo-Cheng Lin ,  Wen-Shi Huang

Inventor： Hung-Chi Chen ,  Ying-Chi Chen ,  Te-Tsai Chuang ,  Kuo-Cheng Lin ,  Wen-Shi Huang

IPC: H02K9/00 ,  H02K9/06 ,  F04D29/26

CPC classification number: F04D25/082 ,  F04D29/329 ,  H02K9/06

Abstract: A heat-dissipation structure for a motor. The heat-dissipation structure comprises a shaft, a seat and a rotator. The rotator coupled to the seat by the shaft comprises a housing and a cover. The housing comprises an inner side connected to the shaft and a bottom comprising at least one through hole. The cover is connected to an exterior of the bottom of the housing and a distance is formed between the cover and the housing, so that the cover prevents objects from entering the through hole.

Abstract translation: 电机的散热结构。 散热结构包括轴，座和旋转器。 通过轴联接到座椅的旋转器包括壳体和盖。 壳体包括连接到轴的内侧和包括至少一个通孔的底部。 盖子连接到壳体底部的外部并且在盖子和壳体之间形成一定距离，使得盖子防止物体进入通孔。

公开(公告)号：US20120049346A1

公开(公告)日：2012-03-01

申请号：US12871565

申请日：2010-08-30

Applicant: Cheng-Chung Lin ,  Chung-Shi Liu ,  Meng-Wei Chou ,  Kuo Cheng Lin ,  Wen-Hsiung Lu ,  Chien Ling Hwang ,  Ying-Jui Huang ,  De-Yuan Lu

Inventor： Cheng-Chung Lin ,  Chung-Shi Liu ,  Meng-Wei Chou ,  Kuo Cheng Lin ,  Wen-Hsiung Lu ,  Chien Ling Hwang ,  Ying-Jui Huang ,  De-Yuan Lu

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L24/11 ,  H01L21/02052 ,  H01L21/32125 ,  H01L21/76873 ,  H01L21/76885 ,  H01L23/488 ,  H01L24/03 ,  H01L24/05 ,  H01L24/13 ,  H01L2221/1084 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05073 ,  H01L2224/05541 ,  H01L2224/05573 ,  H01L2224/1111 ,  H01L2224/1132 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/1146 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/11472 ,  H01L2224/11474 ,  H01L2224/11614 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/1191 ,  H01L2224/11912 ,  H01L2224/13005 ,  H01L2224/13017 ,  H01L2224/13018 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/81191 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01059 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0541 ,  H01L2924/07025 ,  H01L2924/10329 ,  H01L2924/14 ,  H01L2924/20102 ,  H01L2924/3512 ,  H01L2924/381 ,  H01L2924/3841 ,  H01L2924/0105 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/207

Abstract: Apparatus and methods for providing solder pillar bumps. Pillar bump connections are formed on input/output terminals for integrated circuits by forming a pillar of conductive material using plating of a conductive material over terminals of an integrated circuit. A base portion of the pillar bump has a greater width than an upper portion. A cross-section of the base portion of the pillar bump may make a trapezoidal, rectangular or sloping shape. Solder material may be formed on the top surface of the pillar. The resulting solder pillar bumps form fine pitch package solder connections that are more reliable than those of the prior art.

Abstract translation: 用于提供焊料柱凸块的装置和方法。 通过在集成电路的端子上通过导电材料的电镀形成导电材料的支柱，在集成电路的输入/输出端子上形成支柱凸点连接。 柱状凸块的基部具有比上部更大的宽度。 柱形凸起的基部的横截面可以形成梯形，矩形或倾斜的形状。 焊料可以形成在柱的顶表面上。 所得到的焊料柱凸起形成比现有技术更可靠的细间距封装焊接连接。

公开(公告)号：US20110092064A1

公开(公告)日：2011-04-21

申请号：US12842617

申请日：2010-07-23

Applicant: Chung-Shi Liu ,  Cheng-Chung Lin ,  Ming-Che Ho ,  Kuo Cheng Lin ,  Meng-Wei Chou

Inventor： Chung-Shi Liu ,  Cheng-Chung Lin ,  Ming-Che Ho ,  Kuo Cheng Lin ,  Meng-Wei Chou

IPC: H01L21/3205

CPC classification number: H01L24/05 ,  H01L21/0206 ,  H01L21/02068 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0346 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/0381 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05655 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/81022 ,  H01L2224/94 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/14 ,  H01L2924/00014 ,  H01L2224/11 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

Abstract: A method of forming an integrated circuit structure includes forming a copper-containing seed layer on a wafer, and performing a descum step on an exposed surface of the copper-containing seed layer. The descum step is performed using a process gas including fluorine and oxygen. A reduction/purge step is then performed on the exposed surface of the copper-containing seed layer using a nitrogen-containing gas. A copper-containing layer is plated on the copper-containing seed layer.

Abstract translation: 形成集成电路结构的方法包括在晶片上形成含铜晶种层，并在含铜种子层的暴露表面上进行除氧步骤。 除氧步骤使用包括氟和氧的工艺气体进行。 然后使用含氮气体在含铜种子层的暴露表面上进行还原/吹扫步骤。 含铜层镀在含铜种子层上。

公开(公告)号：US20100322764A1

公开(公告)日：2010-12-23

申请号：US12870419

申请日：2010-08-27

Applicant: Wen-Shi HUANG ,  Kuo-Cheng LIN ,  Li-Kuang TAN ,  Tsung-Yu LEI ,  Wen-Ha LIU

Inventor： Wen-Shi HUANG ,  Kuo-Cheng LIN ,  Li-Kuang TAN ,  Tsung-Yu LEI ,  Wen-Ha LIU

IPC: F04D29/52

CPC classification number: F04D25/0613 ,  F04D29/526

Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.

Abstract translation: 具有高散热性能的冷却风扇包括多个叶片; 以及用于在其中接收叶片的框架，其中框架具有降低的高度，用于将叶片暴露于框架外部，以便空气经由叶片的顶部和周边部分进入框架以改善空气引入 和散热风扇的散热效率。 盖可以安装到框架的顶表面，并且形成有多个开口，用于允许空气通过开口进入框架; 这种布置凸轮有效地提高了冷却风扇的进气和工作效率。

公开(公告)号：US07416388B2

公开(公告)日：2008-08-26

申请号：US10879146

申请日：2004-06-30

Applicant: Wen-Shi Huang ,  Kuo-Cheng Lin ,  Jeng-Hung Lin ,  Tsu-Liang Lin ,  Chih-Jen Chen ,  Chen-Yu Yu ,  Lobato Lu ,  Ming-Shi Tsai

Inventor： Wen-Shi Huang ,  Kuo-Cheng Lin ,  Jeng-Hung Lin ,  Tsu-Liang Lin ,  Chih-Jen Chen ,  Chen-Yu Yu ,  Lobato Lu ,  Ming-Shi Tsai

IPC: F04D29/40

CPC classification number: F04D29/646 ,  F04D25/0606

Abstract: A fan is disclosed for use in a system, and the system has at least one connection structure. The fan is mainly composed of an impeller and a base, and the impeller is connected to the base. The impeller at least has a hub, a plurality of blades and a driver. The base has at least one engaging member, and the engaging member is corresponding to the connection structure. Further, the fan is fixed on the system by connecting the engaging member and the connection structure together.

Abstract translation: 公开了一种用于系统的风扇，并且该系统具有至少一个连接结构。 风扇主要由叶轮和底座组成，叶轮连接到底座上。 叶轮至少具有毂，多个叶片和驱动器。 基座具有至少一个接合构件，并且接合构件对应于连接结构。 此外，通过将接合构件和连接结构连接在一起，将风扇固定在系统上。

公开(公告)号：US20070000643A1

公开(公告)日：2007-01-04

申请号：US11515786

申请日：2006-09-06

Applicant: Li-Kuang Tan ,  Yu-Hung Huang ,  Wei-Fan Wu ,  Kuo-Cheng Lin ,  Wen-Shi Huang

Inventor： Li-Kuang Tan ,  Yu-Hung Huang ,  Wei-Fan Wu ,  Kuo-Cheng Lin ,  Wen-Shi Huang

IPC: H05K7/20

CPC classification number: H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat sink for coolers is provided. The heat sink contains a heat conductive element, a heat dissipating shell covering over the heat conductive element, and a plurality of heat dissipating fins installed on the heat dissipating shell. The heat conductive element includes a heat conductive plate and a heat conductive block installed at the center thereof. The area of the bottom surface of the heat conductive block is greater than that of the topmost surface thereof. When the lower surface of the heat conductive plate is in contact with a device that needs heat dissipation, the heat conductive block increases the heat conducting volume at the center of the heat conductive plate, so that the heat produced by the device can be released at an optimal rate.

Abstract translation: 提供冷却器散热器。 散热器包括导热元件，覆盖在导热元件上的散热壳，以及安装在散热壳上的多个散热片。 导热元件包括导热板和安装在其中心的导热块。 导热块的底面的面积大于其最上表面的面积。 当导热板的下表面与需要散热的装置接触时，导热块增加了导热板中心处的导热体积，使得由该装置产生的热可以在 最佳速率。

公开(公告)号：US20060285295A1

公开(公告)日：2006-12-21

申请号：US11511985

申请日：2006-08-28

Applicant: Hao-wen Ko ,  Tsung-Yu Lei ,  Kuo-cheng Lin ,  Hsiou-chen Chang

Inventor： Hao-wen Ko ,  Tsung-Yu Lei ,  Kuo-cheng Lin ,  Hsiou-chen Chang

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  F04D29/545 ,  F04D29/582 ,  H01L23/467 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A heat-dissipating device and a housing thereof. The housing includes a passage for guiding an air stream flowing from an opening to another opening, wherein an inner wall of the passage at at least one of the opening sides extends radially outwards with a rotational axis of the heat-dissipating device or the passage so as to enlarge intake or discharge area for the air streams. Accordingly, the intake airflow rate may be greatly increased and the heat-dissipating efficiency of the heat-dissipating device may be greatly enhanced without changing assembling conditions with other elements.

公开(公告)号：US20060115359A1

公开(公告)日：2006-06-01

申请号：US11332397

申请日：2006-01-17

Applicant: Wen-Shi Huang ,  Kuo-Cheng Lin ,  Li-Kuang Tan ,  Tsung-Yu Lei ,  Wen-Ha Liu

Inventor： Wen-Shi Huang ,  Kuo-Cheng Lin ,  Li-Kuang Tan ,  Tsung-Yu Lei ,  Wen-Ha Liu

IPC: F04D19/00

CPC classification number: F04D25/0613 ,  F04D29/526

Abstract: A cooling fan with high heat-dissipating performance includes a plurality of blades; and a frame for receiving the blades therein, wherein the frame has a reduced height for exposing the blades to outside of the frame so as to allow air to enter into the frame via a top portion and a peripheral portion of the blades to improve air introduction and heat dissipating efficiency of the cooling fan. A cover may be mounted to a top surface of the frame, and formed with a plurality of openings for allowing air to enter into the frame through the openings; such an arrangement cam effectively enhance air intake and working efficiency of the cooling fan.