公开(公告)号：US20160013085A1

公开(公告)日：2016-01-14

申请号：US14328211

申请日：2014-07-10

Applicant: Applied Materials, Inc.

Inventor： Xiong Yeu Chew ,  Venaka Rama Subrahmanyam Kommisetti ,  Uday Mahajan ,  Boguslaw A. Swedek ,  Rajeev Bajaj ,  Jianshe Tang

IPC: H01L21/67 ,  H01L21/768 ,  B24B37/005

CPC classification number: H01L21/7684 ,  B24B37/0053 ,  H01L21/3212 ,  H01L21/76898 ,  H01L22/12 ,  H01L22/26

Abstract: A method of controlling chemical mechanical polishing includes polishing a substrate having a plurality of protrusions, monitoring the substrate during polishing with an in-situ monitoring system to generate a signal, the in-situ monitoring system including an acoustic sensor, a motor current sensor or a motor torque sensor, and detecting breakage of the protrusions based on the signal.

Abstract translation: 一种控制化学机械抛光的方法包括抛光具有多个突起的基底，在用原位监测系统进行抛光时监测基底以产生信号，原位监测系统包括声传感器，马达电流传感器或 电动机转矩传感器，并且基于该信号检测突起的断裂。

公开(公告)号：US20140323017A1

公开(公告)日：2014-10-30

申请号：US13869307

申请日：2013-04-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Jianshe Tang ,  Thomas H. Osterheld ,  Fred C. Redeker ,  Gregory E. Menk

IPC: B24B53/017

CPC classification number: B24B53/017

Abstract: Methods adapted to clean a chemical mechanical polishing (CMP) pad are disclosed. The methods include positioning an energized fluid delivery assembly over a CMP polishing pad; rotating the polishing pad on a platen; energizing a fluid within the energized fluid delivery assembly; applying the energized fluid to the polishing pad to dislodge slurry residue and debris; and removing the dislodged slurry residue and debris using a vacuum suction unit. Systems and apparatus for carrying out the methods are provided, as are numerous additional aspects.

Abstract translation: 公开了适用于清洁化学机械抛光（CMP）垫的方法。 所述方法包括将激活的流体输送组件定位在CMP抛光垫上; 将抛光垫旋转在压板上; 激励通电流体输送组件内的流体; 将激活的流体施加到抛光垫以移除浆料残渣和碎屑; 并使用真空抽吸单元去除移出的浆料残渣和碎屑。 提供了用于执行方法的系统和装置，以及许多其它方面。

公开(公告)号：US20140196749A1

公开(公告)日：2014-07-17

申请号：US14146382

申请日：2014-01-02

Applicant: Applied Materials, Inc.

Inventor： Jianshe Tang ,  Sidney P. Huey ,  Lakshmanan Karuppiah

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67051 ,  H01L21/02057 ,  H01L21/02074 ,  H01L21/02096

Abstract: A cryogenic cleaning apparatus is disclosed. The cryogenic cleaning apparatus has a source of cryogen, a nozzle coupled to the source of cryogen, the nozzle including a main passage adapted to receive the cryogen, one or more auxiliary gas inlets adapted to supply an auxiliary gas to mix with the cryogen either within the nozzle or at a nozzle exit of the nozzle to produce cryogen droplets, and a heated holder adapted to receive a substrate to be cleaned. Cryogenic cleaning methods adapted to clean substrates are provided, as are numerous other aspects.

Abstract translation: 公开了一种低温清洁装置。 低温清洁装置具有致冷剂源，连接到冷冻剂源的喷嘴，喷嘴包括适于接收冷冻剂的主通道，一个或多个辅助气体入口适于供应辅助气体以与冷冻剂混合， 喷嘴或在喷嘴的喷嘴出口处产生低温液滴，以及适于接收待清洁的基底的加热保持器。 提供了适于清洁基底的低温清洁方法，以及许多其它方面。

公开(公告)号：US12296427B2

公开(公告)日：2025-05-13

申请号：US16989734

申请日：2020-08-10

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Shou-Sung Chang ,  Chih Chung Chou ,  Jianshe Tang ,  Hui Chen ,  Hari Soundararajan ,  Brian J. Brown

IPC: B24B37/015 ,  B24B57/02 ,  H01L21/321 ,  H01L21/67

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a conduit having an inlet to be coupled to a gas source, and a dispenser coupled to the conduit and having a convergent-divergent nozzle suspended over the platen to direct gas from the gas source onto the polishing surface of the polishing pad.

公开(公告)号：US20250114910A1

公开(公告)日：2025-04-10

申请号：US18905005

申请日：2024-10-02

Applicant: Applied Materials, Inc.

Inventor： Priscilla Diep LaRosa ,  Haosheng Wu ,  Jeonghoon Oh ,  Andrew Siordia ,  Taketo Sekine ,  Shou-Sung Chang ,  Jianshe Tang

IPC: B24B57/02 ,  B24B37/30 ,  B24B41/06 ,  B24B49/04

Abstract: A method of fabrication of a substrate includes, after deposition of an outer layer on a substrate and before polishing of an exposed surface of the outer layer of the substrate, performing a hydroblasting treatment of a selected portion of the exposed surface by directing a treatment liquid from a nozzle at a sufficiently high velocity onto the selected portion to remove material from the selected portion such that a thickness non-uniformity of the outer layer is reduced. Then the outer layer of the treated substrate is subject to chemical mechanical polishing to planarize and reduce a thickness of the outer layer.

公开(公告)号：US11948885B2

公开(公告)日：2024-04-02

申请号：US17356717

申请日：2021-06-24

Applicant: APPLIED MATERIALS, INC.

Inventor： Suketu A. Parikh ,  Rong Tao ,  Roey Shaviv ,  Joung Joo Lee ,  Seshadri Ganguli ,  Shirish Pethe ,  David Gage ,  Jianshe Tang ,  Michael A Stolfi

IPC: H01L23/528 ,  H01L21/02 ,  H01L21/321 ,  H01L21/67 ,  H01L21/768 ,  H01L23/522 ,  H01L23/532

CPC classification number: H01L23/5283 ,  H01L21/02063 ,  H01L21/32125 ,  H01L21/67207 ,  H01L21/76814 ,  H01L21/76816 ,  H01L21/76831 ,  H01L21/7684 ,  H01L21/76843 ,  H01L21/76871 ,  H01L21/76879 ,  H01L21/76882 ,  H01L23/5226 ,  H01L23/53209 ,  H01L23/53223 ,  H01L23/53233 ,  H01L23/53238 ,  H01L23/53252 ,  H01L23/53266

Abstract: Methods and apparatus for creating a dual metal interconnect on a substrate. In some embodiments, a first liner of a first nitride material is deposited into at least one 1X feature and at least one wider than 1X feature, the first liner has a thickness of less than or equal to approximately 12 angstroms; a second liner of a first metal material is deposited into the at least one 1X feature and at least one wider than 1X feature; the first metal material is reflowed such that the at least one 1X feature is filled with the first metal material and the at least one wider than 1X feature remains unfilled with the first metal material; a second metal material is deposited on the first metal material, and the second metal material is reflowed such that the at least one wider than 1X feature is filled with the second metal material.

公开(公告)号：US20240075583A1

公开(公告)日：2024-03-07

申请号：US18505871

申请日：2023-11-09

Applicant: Applied Materials, Inc.

Inventor： Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown ,  Wei Lu ,  Priscilla Diep

IPC: B24B37/26 ,  B24B37/005 ,  B24B37/04 ,  B24B37/27

CPC classification number: B24B37/26 ,  B24B37/005 ,  B24B37/042 ,  B24B37/27

Abstract: A chemical mechanical polishing system includes a platen to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad, and a controller. The polishing pad has a polishing control groove. The carrier is laterally movable by a first actuator across the polishing pad and rotatable by a second actuator. The controller synchronizes lateral oscillation of the carrier head with rotation of the carrier head such that over a plurality of successive oscillations of the carrier head such that when a first angular swath of an edge portion of the substrate is at an azimuthal angular position about an axis of rotation of the carrier head the first angular swath overlies the polishing surface and when a second angular swath of the edge portion of the substrate is at the azimuthal angular position the second angular swath overlies the polishing control groove.

公开(公告)号：US11897079B2

公开(公告)日：2024-02-13

申请号：US16831436

申请日：2020-03-26

Applicant: Applied Materials, Inc.

Inventor： Haosheng Wu ,  Hari Soundararajan ,  Jianshe Tang ,  Shou-Sung Chang ,  Brian J. Brown ,  Yen-Chu Yang ,  You Wang ,  Rajeev Bajaj

IPC: B24B37/015 ,  B24B55/03 ,  B24B37/10 ,  H01L21/306 ,  B24B49/14 ,  B24B37/04

CPC classification number: B24B37/015 ,  B24B37/105 ,  B24B55/03 ,  B24B37/042 ,  B24B49/14 ,  H01L21/30625

Abstract: A chemical mechanical polishing system includes a platen to support a polishing pad having a polishing surface, a source of coolant, a dispenser having one or more apertures suspended over the platen to direct coolant from the source of coolant onto the polishing surface of the polishing pad; and a controller coupled to the source of coolant and configured to cause the source of coolant to deliver the coolant through the nozzles onto the polishing surface during a selected step of a polishing operation.

公开(公告)号：US11823916B2

公开(公告)日：2023-11-21

申请号：US17091105

申请日：2020-11-06

Applicant: Applied Materials, Inc.

Inventor： Wei Lu ,  Jimin Zhang ,  Jianshe Tang ,  Brian J. Brown

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/687

CPC classification number: H01L21/67051 ,  H01L21/02087 ,  H01L21/67248 ,  H01L21/68721

Abstract: The present disclosure relates to load cups that include an annular substrate station configured to receive a substrate. The annular substrate station surrounds a nebulizer located within the load cup. The nebulizer includes a set of energized fluid nozzles disposed on an upper surface of the nebulizer adjacent to an interface between the annular substrate station and the nebulizer. The set of energized fluid nozzles are configured to release energized fluid at an upward angle relative to the upper surface.

公开(公告)号：US20230356351A1

公开(公告)日：2023-11-09

申请号：US18356604

申请日：2023-07-21

Applicant: Applied Materials, Inc.

Inventor： Hari Soundararajan ,  Shou-Sung Chang ,  Haosheng Wu ,  Jianshe Tang

IPC: B24B37/015 ,  B24B37/10 ,  B24B37/22 ,  B24B37/34 ,  B24B55/02

CPC classification number: B24B37/015 ,  B24B37/105 ,  B24B37/22 ,  B24B37/34 ,  B24B55/02 ,  B24B49/14

Abstract: A chemical mechanical polishing apparatus includes a platen having a top surface to hold a polishing pad, a carrier head to hold a substrate against a polishing surface of the polishing pad during a polishing process, and a temperature monitoring system. The temperature monitoring system includes a non-contact thermal sensor positioned above the platen that has a field of view of a portion of the polishing pad on the platen. The sensor is rotatable by the motor around an axis of rotation so as to move the field of view across the polishing pad.