公开(公告)号：US20250118572A1

公开(公告)日：2025-04-10

申请号：US18483994

申请日：2023-10-10

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Nolan L. Zimmerman ,  Deepak Saagar Kalaikadal ,  Matthew Paul McHugh ,  Daniil Oliferovskiy

IPC: H01L21/324 ,  H01L21/67 ,  H01L21/68 ,  H01L21/687

Abstract: Exemplary anneal chambers may include a base that defines a chamber interior. The base may include a cooling plate within the chamber interior. The base and the cooling plate may be integral with one another. The chambers may include a lid that is coupled with the base. The chambers may include a heater plate mounted in the chamber interior alongside the cooling plate. The chambers may include a transfer hoop movably coupled within the chamber interior. The base may define a first transfer hoop recess about at least a portion of the heater plate. The base may define a second transfer hoop recess about at least a portion of the cooling plate.

公开(公告)号：US20250116028A1

公开(公告)日：2025-04-10

申请号：US18483957

申请日：2023-10-10

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  Nolan L. Zimmerman ,  Randy A. Harris ,  John L. Klocke ,  Eric J. Bergman ,  Keith Edward Ypma

IPC: C25D21/10 ,  C25D7/12 ,  C25D17/00

Abstract: Exemplary electroplating systems may include a vessel. The systems may include a head that is configured to hold a substrate. The head may be positionable within an interior of the vessel. The systems may include a spray jet array disposed within the interior of the vessel. The spray jet array may include a plate defining a plurality of apertures through a thickness of the plate. The systems may include at least one fluid pump that is fluidly coupled with an inlet end of each of the plurality of apertures.

公开(公告)号：US12087571B2

公开(公告)日：2024-09-10

申请号：US18383617

申请日：2023-10-25

Applicant: Applied Materials, Inc.

Inventor： Ying Wang ,  Guan Huei See ,  Gregory J. Wilson

IPC: H01L21/02 ,  B08B3/02 ,  H01L21/67 ,  H01L21/683

CPC classification number: H01L21/02076 ,  B08B3/02 ,  H01L21/67051 ,  H01L21/6836

Abstract: Methods, systems, and apparatus for cleaning and drying a tape-frame substrate are provided. In embodiments, an apparatus for supporting a tape-frame substrate includes a chuck having a first side and a second side opposite the first side, the first side having a convex surface configured to support the tape-frame substrate; and a plurality of channels extending through the chuck and having outlets along the first side, wherein the plurality of channels are configured to dispense fluid from the outlets along the convex surface of the first side. In embodiments, a support system includes the chuck and a holder configured to mount a tape-frame substrate to the chuck. The plurality of channels are configured to dispense fluid from the outlets and between the tape-frame substrate and the convex surface of the chuck when the tape-frame substrate is mounted to the chuck.

公开(公告)号：US20230313406A1

公开(公告)日：2023-10-05

申请号：US18130004

申请日：2023-04-03

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Forrest G. Reinhart ,  Gregory J. Wilson ,  Kwan Wook Roh ,  Kyle M. Hanson ,  James E. Brown ,  David J. Reis

IPC: C25D17/00 ,  C25D3/38 ,  C25D21/04 ,  C25D21/02

CPC classification number: C25D17/002 ,  C25D3/38 ,  C25D21/04 ,  C25D21/02

Abstract: Electroplating methods may include providing an electrolyte feedstock comprising copper to a first compartment of an electrochemical cell. The methods may include providing an acidic solution to a second compartment of the electrochemical cell. The first compartment and second compartment may be separated by a membrane. The methods may include applying a current to an anode of the electrochemical cell. The anode of the electrochemical cell may be disposed proximate the first compartment and across from the membrane. The methods may include forming an anolyte and catholyte precursor.

公开(公告)号：US11705312B2

公开(公告)日：2023-07-18

申请号：US17134280

申请日：2020-12-26

Applicant: Applied Materials, Inc.

Inventor： Tsutomu Tanaka ,  Jared Ahmad Lee ,  Rakesh Ramadas ,  Dmitry A. Dzilno ,  Gregory J. Wilson ,  Sriharish Srinivasan

IPC: H01J37/32

CPC classification number: H01J37/32733 ,  H01J37/3244 ,  H01J37/32082 ,  H01J37/32522 ,  H01J2237/20235 ,  H01J2237/332

Abstract: The disclosure describes a plasma source assemblies comprising a differential screw assembly, an RF hot electrode, a top cover, an upper housing and a lower housing. The differential screw assembly is configured to provide force to align the plasma source assembly vertically matching planarity of a susceptor. More particularly, the differential screw assembly increases a distance between the top cover and the upper housing to align the gap with the susceptor. The disclosure also provides a better thermal management by cooling fins. A temperature capacity of the plasma source assemblies is extended by using titanium electrode. The disclosure provides a cladding material covering a portion of a first surface of RF hot electrode, a second surface of RF hot electrode, a bottom surface of RF hot electrode, a portion of a surface of the showerhead and a portion of lower housing surface.

公开(公告)号：US20230193504A1

公开(公告)日：2023-06-22

申请号：US18111487

申请日：2023-02-17

Applicant: Applied Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson

IPC: C25D21/10 ,  C25D5/08 ,  C25D17/02 ,  C25D7/12 ,  C25D17/00

CPC classification number: C25D21/10 ,  C25D5/08 ,  C25D17/02 ,  C25D7/12 ,  C25D17/001

Abstract: Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a substrate in the vessel. The system may further include a first reservoir in fluid communication with the vessel. In addition, the system may include a second reservoir in fluid communication with the vessel. Furthermore, the system may include a first mechanism configured to expel a second portion of the liquid electrolyte from the first reservoir into the vessel. The system may also include a second mechanism configured to take in a third potion of the liquid electrolyte from the vessel into the second reservoir when the second portion of the liquid electrolyte is expelled from the first reservoir. Methods may include oscillating flow of the electrolyte within the vessel.

公开(公告)号：US20230167573A1

公开(公告)日：2023-06-01

申请号：US18159041

申请日：2023-01-24

Applicant: APPLIED Materials, Inc.

Inventor： Paul R. McHugh ,  Gregory J. Wilson ,  Kyle M. Hanson ,  John L. Klocke ,  Paul Van Valkenburg ,  Eric J. Bergman ,  Adam Marc McClure ,  Deepak Saagar Kalaikadal ,  Nolan Layne Zimmerman ,  Michael Windham ,  Mikael R. Borjesson

IPC: C25D17/12 ,  C25D17/00 ,  C25D21/12 ,  C25D5/08 ,  C25D7/12

CPC classification number: C25D17/12 ,  C25D17/001 ,  C25D21/12 ,  C25D5/08 ,  C25D7/123 ,  C25D17/007

Abstract: An electroplating system has a vessel assembly holding an electrolyte. A weir thief electrode assembly in the vessel assembly includes a plenum inside of a weir frame. The plenum divided into at least a first, a second and a third virtual thief electrode segment. A plurality of spaced apart openings through the weir frame lead out of the plenum. A weir ring is attached to the weir frame and guides flow of current during electroplating. The electroplating system provides process determined radial and circumferential current density control and does not require changing hardware components during set up.

公开(公告)号：US20220208531A1

公开(公告)日：2022-06-30

申请号：US17134280

申请日：2020-12-26

Applicant: Applied Materials, Inc.

Inventor： Tsutomu Tanaka ,  Jared Ahmad Lee ,  Rakesh Ramadas ,  Dmitry A. Dzilno ,  Gregory J. Wilson ,  Sriharish Srinivasan

IPC: H01J37/32

Abstract: The disclosure describes a plasma source assemblies comprising a differential screw assembly, an RF hot electrode, a top cover, an upper housing and a lower housing. The differential screw assembly is configured to provide force to align the plasma source assembly vertically matching planarity of a susceptor. More particularly, the differential screw assembly increases a distance between the top cover and the upper housing to align the gap with the susceptor. The disclosure also provides a better thermal management by cooling fins. A temperature capacity of the plasma source assemblies is extended by using titanium electrode. The disclosure provides a cladding material covering a portion of a first surface of RF hot electrode, a second surface of RF hot electrode, a bottom surface of RF hot electrode, a portion of a surface of the showerhead and a portion of lower housing surface.

公开(公告)号：US20210092800A1

公开(公告)日：2021-03-25

申请号：US16971409

申请日：2019-02-20

Applicant: Applied Materials, Inc.

Inventor： Kenneth Brian Doering ,  Gregory J. Wilson ,  Karthik Ramanathan ,  Mario D. Silvetti ,  Kevin Griffin

IPC: H05B3/14 ,  C23C16/455 ,  H05B3/00 ,  H05B3/03

Abstract: Heaters having a body with having a top and bottom comprising pyrolytic boron nitride (PBN), a first heater electrode and a second heater electrode are described. The heater electrodes can be enclosed within an electrically insulating standoff and connected to separate busbars to provide power. Heater assemblies including one or more of the heaters and processing chambers including the heater assemblies are also described.

公开(公告)号：US10655226B2

公开(公告)日：2020-05-19

申请号：US15986197

申请日：2018-05-22

Applicant: Applied Materials, Inc.

Inventor： Gregory J. Wilson ,  Paul McHugh ,  Karthik Ramanathan

IPC: H01L21/00 ,  C23C16/52 ,  C23C16/455 ,  H01L21/02 ,  H01L21/66 ,  C23C16/46 ,  H01L21/687 ,  H01L21/67

Abstract: Apparatus and methods to deposit a film using a batch processing chamber with a plurality of heating zones are described. The film is deposited on one or more substrates and the uniformity of the deposition thickness is determined at a plurality of points. The heating zones set points are applied to a sensitivity matrix and new temperature or power set points for the heating zones are determined and set. One or more substrates are processed using the new set points and the thickness uniformity is determined and may be adjusted again to increase the uniformity.