公开(公告)号：US08502380B2

公开(公告)日：2013-08-06

申请号：US12899258

申请日：2010-10-06

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H01L23/48

CPC分类号： H01L24/03 ,  H01L21/6835 ,  H01L24/32 ,  H01L2221/68372 ,  H01L2224/0236 ,  H01L2224/02377 ,  H01L2224/02381 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/11849 ,  H01L2224/13024 ,  H01L2224/131 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15788 ,  H01L2924/00

摘要： A chip package and a fabrication method thereof are provided. The chip package includes a semiconductor substrate containing a semiconductor component and a conductive pad thereon. A through hole penetrates the semiconductor substrate from a backside thereof to expose the conductive pad. A redistribution layer is below the backside of the semiconductor substrate and electrically connected to the conductive pad in the through hole. A conductive trace layer is below the redistribution layer and extended along a sidewall of the semiconductor substrate to electrically contact with an edge of the redistribution layer.

摘要翻译： 提供了芯片封装及其制造方法。 芯片封装包括其上包含半导体部件和导电焊盘的半导体衬底。 通孔从其背面穿透半导体衬底以露出导电焊盘。 再分配层位于半导体衬底的背面下方并且与通孔中的导电焊盘电连接。 导电迹线层位于再分布层之下并且沿着半导体衬底的侧壁延伸以与再分布层的边缘电接触。

公开(公告)号：US08350150B2

公开(公告)日：2013-01-08

申请号：US12860941

申请日：2010-08-23

申请人： Chien-Hung Liu ,  Po-Chuan Hsieh ,  Yu-Chang Pai

发明人： Chien-Hung Liu ,  Po-Chuan Hsieh ,  Yu-Chang Pai

IPC分类号： H05K5/00

CPC分类号： H05K9/0041 ,  B21D28/10 ,  Y10T29/49 ,  Y10T29/49826

摘要： An enclosure of an electronic device includes a plate. The plate defines a number of through holes. Each through hole has a pair of tabs connected to each other and with the through hole. Each pair of tabs are slantingly bent towards an inside of the enclosure. The enclosure with the shields can shield the electronic device from electro-magnetic interference.

摘要翻译： 电子设备的外壳包括板。 该板限定了多个通孔。 每个通孔具有彼此连接并与通孔连接的一对突片。 每对翼片朝向机壳的内侧倾斜弯曲。 带屏蔽的外壳可以屏蔽电子设备免受电磁干扰。

公开(公告)号：US08253509B2

公开(公告)日：2012-08-28

申请号：US12823147

申请日：2010-06-25

申请人： Yu-Chang Pai ,  Chien-Hung Liu ,  Po-Chuan Hsieh

发明人： Yu-Chang Pai ,  Chien-Hung Liu ,  Po-Chuan Hsieh

IPC分类号： H04B3/28

CPC分类号： H05K1/0224 ,  H01P1/20381 ,  H01P3/026 ,  H05K1/0245 ,  H05K1/165

摘要： A printed circuit board includes a signal layer and a ground layer adjacent to the signal layer. The signal layer includes a pair of differential transmission lines. The ground layer includes a first void, a second void, a third void, and a common mode filter. The first void and the second void are respectively arranged at opposite sides of a projection of the pair of differential transmission lines on the ground layer, and are bridged with the third void. The common mode filter includes a first filter portion positioned in the first void, and a second filter portion positioned in the second void. Each of the first and second filter portions includes a number of coils arranged side by side along a direction parallel to the projection of the pair of differential transmission lines.

摘要翻译： 印刷电路板包括与信号层相邻的信号层和接地层。 信号层包括一对差动传输线。 接地层包括第一空隙，第二空隙，第三空隙和共模滤波器。 第一空隙和第二空隙分别布置在接地层上的一对差动传输线的突起的相对侧，并与第三空隙桥接。 共模过滤器包括位于第一空隙中的第一过滤器部分和位于第二空隙中的第二过滤器部分。 第一和第二滤波器部分中的每一个包括沿着平行于一对差动传输线的突起的方向并排布置的多个线圈。

公开(公告)号：US08116902B2

公开(公告)日：2012-02-14

申请号：US12713181

申请日：2010-02-26

申请人： Chien-Hung Liu ,  Wen-Yuh Jywe ,  Yi-Tsung Li

发明人： Chien-Hung Liu ,  Wen-Yuh Jywe ,  Yi-Tsung Li

IPC分类号： G06F19/00 ,  G01B11/02

CPC分类号： G05B19/401 ,  B23Q1/5437 ,  B23Q17/2233 ,  B23Q17/2495 ,  G01B11/03 ,  G01B11/27 ,  G01B21/045 ,  G05B2219/37008 ,  G05B2219/37275 ,  Y10T409/305824

摘要： A method of detecting a dynamic path of a five-axis machine tool having a spindle and a turntable and has a preparing step, a correcting step and a detecting step. The preparing step includes mounting a detector on the spindle, mounting a cat-eye reflector on the turntable, emitting a laser light to the cat-eye reflector, reflecting the laser light to the detector and splitting into two light beams. One of the light beams is emitted to a four-quadrant position sensitive detector. The correcting step includes rotating the detector, detecting a signal of the laser light by the four-quadrant position sensitive detector to eliminate an offset between the detecting assembly and the spindle. The detecting step includes detecting the dynamic path of the five-axis machine tool by detecting the positions of at least two of the linear axes and at least one of the rotation axes of the five-axis machine tool.

摘要翻译： 一种检测具有主轴和转盘的五轴机床的动态路径的方法，具有准备步骤，校正步骤和检测步骤。 制备步骤包括将检测器安装在心轴上，将猫眼反射器安装在转盘上，向猫眼反射器发射激光，将激光反射到检测器并分成两束光束。 一个光束被发射到四象限位置敏感检测器。 校正步骤包括旋转检测器，通过四象限位置敏感检测器检测激光的信号，以消除检测组件和主轴之间的偏移。 检测步骤包括通过检测五轴机床中至少两个线性轴线和至少一个旋转轴线的位置来检测五轴机床的动态路径。

公开(公告)号：US08076744B2

公开(公告)日：2011-12-13

申请号：US11657733

申请日：2007-01-25

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H01L31/0232

CPC分类号： H01L27/14618 ,  H01L2224/13

摘要： A photosensitizing chip package construction and manufacturing method thereof is comprised of photosensitizing chips constructed on one side of a wafer using a bonding layer; a color attachment array being disposed over those photosensitizing chips; a glass substrate provided with weir and covered up over the color attachment array; a proper gap being defined between the glass substrate and the color attachment array to promote permeability of stream of light by direct receiving stream of light from those photosensitizing chips constructed over the wafer.

摘要翻译： 光敏芯片封装结构及其制造方法由使用结合层的晶片一侧构成的光敏芯片构成; 在这些光敏芯片上设置着色附件阵列; 设置有堰并覆盖在附着阵列上的玻璃基板; 在玻璃基板和颜色附着阵列之间限定适当的间隙，以通过直接接收来自在晶片上构成的光敏芯片的光直接接收光来促进光流的透过性。

公开(公告)号：US20110298985A1

公开(公告)日：2011-12-08

申请号：US12962728

申请日：2010-12-08

申请人： Chao-Shin Wang ,  Chien-Hung Liu ,  Bomin Weng

发明人： Chao-Shin Wang ,  Chien-Hung Liu ,  Bomin Weng

IPC分类号： H04N5/14

CPC分类号： H04N5/57 ,  H04N5/20 ,  H04N21/4318

摘要： A method of enhancing a contrast ratio of a picture of a display device, comprising steps of providing the display device having a light source; continuously receiving plural display signals; and turning off the light source when the display device has a buffer time during which each of the continuously received plural display signals has a picture brightness equal to zero.

摘要翻译： 一种增强显示装置的图像的对比度的方法，包括以下步骤：提供具有光源的显示装置; 连续接收多个显示信号; 并且当所述显示装置具有缓冲时间时，关闭所述光源，在所述缓冲时间期间，所述连续接收的多个显示信号中的每一个具有等于零的图像亮度。

公开(公告)号：US08071889B2

公开(公告)日：2011-12-06

申请号：US11706411

申请日：2007-02-15

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： H05K1/11

CPC分类号： H01L23/552 ,  H01L23/3114 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L2224/0231 ,  H01L2224/02331 ,  H01L2224/02371 ,  H01L2224/02377 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/06102 ,  H01L2224/11334 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14051 ,  H01L2224/14104 ,  H01L2224/14515 ,  H01L2224/16 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01072 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2224/03 ,  H01L2224/11 ,  H01L2224/05552

摘要： An electronic device with EMI screen and packaging process thereof to provide even active EMI prevention means includes adhesion of a transit substrate to a soldering surface of the electronic device, a protection circuit layer functioning as EMI screen being paved on the bottom of the transit substrate; a packaging circuit layer being laid; protection circuit layer and the transit substrate as well as the packaging and protection circuit layers being segregated with an insulation material; and solder balls provided with electric continuity to the protection circuit layer and the packaging circuit layer being respectively implanted as soldering points respectively for EMI grounding and linkage between the electronic device and a printed circuit.

摘要翻译： 具有EMI屏蔽及其包装工艺的电子设备提供均匀的有源EMI防止装置，包括将运输基板粘附到电子设备的焊接表面，保护电路层用作铺设在运输衬底底部的EMI屏蔽层; 铺设的包装电路层; 保护电路层和运输基板以及与绝缘材料隔离的封装和保护电路层; 分别为保护电路层和封装电路层提供与电连接的焊料球分别作为焊接点植入电子设备和印刷电路之间的EMI接地和连接。

公开(公告)号：US08058557B2

公开(公告)日：2011-11-15

申请号：US11957416

申请日：2007-12-15

申请人： Chien-Hung Liu ,  Shou-Kuo Hsu ,  Chia-Nan Pai

发明人： Chien-Hung Liu ,  Shou-Kuo Hsu ,  Chia-Nan Pai

IPC分类号： H05K1/00

CPC分类号： H05K1/0245 ,  H05K2201/0715 ,  H05K2201/09236 ,  H05K2201/09672

摘要： An exemplary PCB includes a first reference layer, a first signal layer, a second signal layer, and a third signal layer in that order, a first differential pair is arranged in the first signal layer in edge-coupled structure and references the first reference layer, a distance between the first signal layer and the second signal layer is greater than a distance between the first reference layer and the first signal layer, a second differential pair is arranged in the second signal layer and the third signal layer in broad-coupled structure. The PCB has a high density layout of transmission lines.

摘要翻译： 示例性PCB包括第一参考层，第一信号层，第二信号层和第三信号层，第一差分对以边缘耦合结构布置在第一信号层中，并参考第一参考层 第一信号层和第二信号层之间的距离大于第一参考层和第一信号层之间的距离，第二差分对被布置在第二信号层中，第三信号层以广泛耦合结构 。 PCB具有传输线高密度布局。

公开(公告)号：US08022309B2

公开(公告)日：2011-09-20

申请号：US11946859

申请日：2007-11-29

申请人： Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu

发明人： Yu-Chang Pai ,  Shou-Kuo Hsu ,  Chien-Hung Liu

IPC分类号： H05K1/00

CPC分类号： H05K1/0245 ,  H05K1/0224 ,  H05K1/0253 ,  H05K1/0393 ,  H05K2201/09236 ,  H05K2201/09336 ,  H05K2201/0969 ,  Y10T29/49156

摘要： An exemplary FPCB includes a signal layer having a differential pair consisting of two transmission lines arranged therein, a ground layer, and a dielectric layer lying between the signal layer and the ground layer. Two sheets made of conductive materials are respectively arranged at opposite sides of the differential pair, and both connected to ground. The sheets are apart from and parallel to the transmission lines. The ground layer has a void defined therein, and the void is located under the two transmission lines.

摘要翻译： 示例性FPCB包括具有由布置在其中的两条传输线组成的差分对的信号层，接地层和位于信号层和接地层之间的电介质层。 由导电材料制成的两片分别布置在差动对的相对两侧，并且都连接到地面。 纸张与传输线分开并平行。 接地层具有限定在其中的空隙，并且空隙位于两条传输线之下。

公开(公告)号：US20110109863A1

公开(公告)日：2011-05-12

申请号：US12616420

申请日：2009-11-11

申请人： Chien-Hung Liu

发明人： Chien-Hung Liu

IPC分类号： G02F1/1345 ,  H01J9/50

CPC分类号： G02F1/136259 ,  G02F2001/136263

摘要： One aspect of the present disclosure relates to a common repair structure for repairing scanning and/or data line defects in a liquid crystal display panel. In one embodiment, the common repair structure includes a plurality of “H” shaped structures, where each “H” shaped structure is placed over a corresponding segment of two neighboring scanning lines located between and associated with two neighboring pixels along the second direction or a corresponding segment of two neighboring data lines located between and associated with two neighboring pixels along the first direction.

摘要翻译： 本公开的一个方面涉及用于修复液晶显示面板中的扫描和/或数据线缺陷的常见修复结构。 在一个实施例中，公共修复结构包括多个“H”形结构，其中每个“H”形结构被放置在沿着第二方向位于两个相邻像素之间并与之相关联的两个相邻扫描线的对应段上，或者 两个相邻数据线的对应段位于沿着第一方向的两个相邻像素之间并与之相关联。