Dual-mask arrangement for solar cell fabrication
    63.
    发明授权
    Dual-mask arrangement for solar cell fabrication 有权
    太阳能电池制造的双面罩布置

    公开(公告)号:US09525099B2

    公开(公告)日:2016-12-20

    申请号:US13866856

    申请日:2013-04-19

    Applicant: Intevac, Inc.

    Abstract: An arrangement for supporting substrates during processing, having a wafer carrier with a susceptor for supporting the substrate and confining the substrate to predetermined position. An inner mask is configured for placing on top of the substrate, the inner mask having an opening pattern to mask unprocessed parts of the substrate, but expose remaining parts of the substrate for processing. An outer mask is configured for placing on top of the inner mask, the outer mask having an opening that exposes the part of the inner mask having the opening pattern, but cover the periphery of the inner mask.

    Abstract translation: 一种用于在加工过程中支撑基板的装置,具有带有用于支撑基板并将基板限制在预定位置的基座的晶片载体。 内部掩模被配置为放置在基板的顶部上,内部掩模具有开口图案以掩蔽基板的未处理部分,但是暴露基板的剩余部分以进行处理。 外掩模被配置为放置在内掩模的顶部上,外掩模具有露出具有开口图案的内掩模的一部分,但覆盖内掩模的周边的开口。

    TEXTURED AR WITH PROTECTIVE THIN FILM
    64.
    发明申请
    TEXTURED AR WITH PROTECTIVE THIN FILM 审中-公开
    带有保护薄膜的纹理

    公开(公告)号:US20160332908A1

    公开(公告)日:2016-11-17

    申请号:US15152488

    申请日:2016-05-11

    Applicant: Intevac, Inc.

    CPC classification number: C03C17/3435 C03C2204/08

    Abstract: A glass cover for electronic devices, the glass cover having a first coating formed directly over and in contact with the front surface of the glass (where front means the surface facing the user), the first coating is textured, and a second coating is provided over the first coating, the second coating being resistance to scratching, e.g., a DLC coating. The first coating may be made of, e.g., silicon-oxide, silicon-nitride, or silicon oxy-nitride.

    Abstract translation: 一种用于电子设备的玻璃盖,玻璃盖具有直接形成在玻璃的前表面上并与玻璃的前表面接触的第一涂层(其中前表面是面向使用者的表面),第一涂层被纹理化,并且提供第二涂层 在第一涂层上,第二涂层耐划伤,例如DLC涂层。 第一涂层可以由例如氧化硅,氮化硅或氮氧化硅制成。

    Substrate processing system and method
    67.
    发明授权
    Substrate processing system and method 有权
    基板加工系统及方法

    公开(公告)号:US09324598B2

    公开(公告)日:2016-04-26

    申请号:US13672652

    申请日:2012-11-08

    Applicant: INTEVAC, INC.

    Abstract: A system for processing substrates has a vacuum enclosure and a processing chamber situated to process wafers in a processing zone inside the vacuum enclosure. Two rail assemblies are provided, one on each side of the processing zone. Two chuck arrays ride, each on one of the rail assemblies, such that each is cantilevered on one rail assemblies and support a plurality of chucks. The rail assemblies are coupled to an elevation mechanism that places the rails in upper position for processing and at lower position for returning the chuck assemblies for loading new wafers. A pickup head assembly loads wafers from a conveyor onto the chuck assemblies. The pickup head has plurality of electrostatic chucks that pick up the wafers from the front side of the wafers. Cooling channels in the processing chucks are used to create air cushion to assist in aligning the wafers when delivered by the pickup head.

    Abstract translation: 用于处理衬底的系统具有真空外壳和位于处理真空外壳内的处理区中的晶片的处理室。 提供两个轨道组件,一个在处理区域的每一侧。 两个卡盘阵列,每个在一个导轨组件上,使得每个卡盘阵列悬挂在一个导轨组件上并支撑多个卡盘。 轨道组件联接到升降机构,其将轨道放置在用于处理的上部位置,并且在较低位置处返回用于装载新晶片的卡盘组件。 拾取头组件将晶片从传送器装载到卡盘组件上。 拾取头具有从晶片的前侧拾取晶片的多个静电卡盘。 处理卡盘中的冷却通道用于产生气垫,以在由拾取头传送时帮助对准晶片。

    High throughput load lock for solar wafers
    68.
    发明授权
    High throughput load lock for solar wafers 有权
    太阳能硅片的高通量负载锁定

    公开(公告)号:US08998553B2

    公开(公告)日:2015-04-07

    申请号:US13708751

    申请日:2012-12-07

    Applicant: Intevac, Inc.

    Abstract: A system for transporting substrates from an atmospheric pressure to high vacuum pressure and comprising: a rough vacuum chamber having an entry valve and an exit opening; a high vacuum chamber having an entry opening, the high vacuum chamber coupled to the rough vacuum chamber such that the exit opening and the entry opening are aligned; a valve situated between the exit opening and the entry opening; a first conveyor belt provided in the rough vacuum chamber; a second conveyor provided in the high vacuum chamber; a sensing element provided in the high vacuum chamber to enable detection of broken substrates on the second conveyor; and, a mechanism provided on the second conveyor belt enabling dumping of broken substrates onto the bottom of the high vacuum chamber.

    Abstract translation: 一种用于将基板从大气压输送到高真空压力的系统,包括:具有入口阀和出口的粗真空室; 具有进入开口的高真空室,所述高真空室联接到所述粗真空室,使得所述出口和入口开口对齐; 位于出口和入口之间的阀; 设置在粗糙真空室中的第一传送带; 设置在高真空室中的第二传送器; 设置在所述高真空室中以便能够检测所述第二输送机上的破裂的基板的感测元件; 以及设置在第二传送带上的机构,其能够将破碎的基板倾倒到高真空室的底部上。

    SYSTEM ARCHITECTURE FOR COMBINED STATIC AND PASS-BY PROCESSING
    69.
    发明申请
    SYSTEM ARCHITECTURE FOR COMBINED STATIC AND PASS-BY PROCESSING 有权
    用于组合静态和通过处理的系统架构

    公开(公告)号:US20130161183A1

    公开(公告)日:2013-06-27

    申请号:US13728145

    申请日:2012-12-27

    Applicant: Intevac, Inc.

    CPC classification number: C23C14/34 C23C14/50 C23C14/566 C23C14/568

    Abstract: Disclosed is a substrate processing system which enables combined static and pass-by processing. Also, a system architecture is provided, which reduces footprint size. The system is constructed such that the substrates are processed therein vertically, and each chamber has a processing source attached to one sidewall thereof, wherein the other sidewall backs to a complementary processing chamber. The chamber system can be milled from a single block of metal, e.g., aluminum, wherein the block is milled from both sides, such that a wall remains and separates each two complementary processing chambers.

    Abstract translation: 公开了一种能够组合静态和通过处理的衬底处理系统。 此外,还提供了一种减小占位面积的系统架构。 该系统构造成使得基板在其中垂直处理,并且每个室具有附接到其一个侧壁的处理源,其中另一个侧壁返回到互补处理室。 室系统可以从单块金属例如铝碾磨,其中块从两侧铣削,使得壁保持并分离每两个补充处理室。

    LINEAR SCANNING SPUTTERING SYSTEM AND METHOD
    70.
    发明申请
    LINEAR SCANNING SPUTTERING SYSTEM AND METHOD 审中-公开
    线性扫描飞溅系统及方法

    公开(公告)号:US20130112546A1

    公开(公告)日:2013-05-09

    申请号:US13667976

    申请日:2012-11-02

    Applicant: INTEVAC, INC.

    Abstract: A sputtering system having a processing chamber with an inlet port and an outlet port, and a sputtering target positioned on a wall of the processing chamber. A movable magnet arrangement is positioned behind the sputtering target and reciprocally slides behinds the target. A conveyor continuously transports substrates at a constant speed past the sputtering target, such that at any given time, several substrates face the target between the leading edge and the trailing edge. The movable magnet arrangement slides at a speed that is at least several times faster than the constant speed of the conveyor. A rotating zone is defined behind the leading edge and trailing edge of the target, wherein the magnet arrangement decelerates when it enters the rotating zone and accelerates as it reverses direction of sliding within the rotating zone.

    Abstract translation: 一种溅射系统,具有具有入口和出口的处理室和位于处理室的壁上的溅射靶。 可移动磁体布置位于溅射靶的后面并在靶后方往复滑动。 输送机以恒定速度连续输送基板通过溅射靶,使得在任何给定时间,几个基板在前缘和后缘之间面对目标。 可移动磁铁装置以比传送带的恒定速度快至少几倍的速度滑动。 旋转区域被限定在目标的前缘和后缘之后,其中磁体装置在进入旋转区域时减速,并且当其在转动区域内反转滑动方向时加速。

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