公开(公告)号：US07622800B2

公开(公告)日：2009-11-24

申请号：US11760712

申请日：2007-06-08

申请人： Kambhampati Ramakrishna ,  Il Kwon Shim ,  Seng Guan Chow

发明人： Kambhampati Ramakrishna ,  Il Kwon Shim ,  Seng Guan Chow

IPC分类号： H01L23/34

CPC分类号： H01L25/105 ,  H01L2224/48237 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/00

摘要： A stackable semiconductor package and method includes providing a first semiconductor package having a first plurality of lower leads and a first plurality of upper leads. A second semiconductor package having a second plurality of lower leads is provided. The second plurality of lower leads is attached to the first plurality of upper leads to form a stack of semiconductor packages.

摘要翻译： 可堆叠的半导体封装和方法包括提供具有第一多个下引线和第一多个上引线的第一半导体封装。 提供具有第二多个下引线的第二半导体封装。 第二多个下引线附接到第一多个上引线以形成半导体封装的堆叠。

公开(公告)号：US20090273062A1

公开(公告)日：2009-11-05

申请号：US12498163

申请日：2009-07-06

申请人： Virgil Cotoco Ararao ,  Il Kwon Shim ,  Seng Guan Chow ,  Sheila Marie L. Alvarez

发明人： Virgil Cotoco Ararao ,  Il Kwon Shim ,  Seng Guan Chow ,  Sheila Marie L. Alvarez

IPC分类号： H01L23/552 ,  H01L23/36

CPC分类号： H01L23/3672 ,  H01L21/4878 ,  H01L2224/32225 ,  H01L2924/15311

摘要： A semiconductor heat spreader from a unitary metallic plate is provided. The unitary metallic plate is formed into a panel, channel walls, at least two feet, and at least one external reversing bend. The channel walls depend from the panel to define a channel between the channel walls and the panel for receiving a semiconductor therein. The feet extend from respective channel walls for attachment to a substrate.

摘要翻译： 提供了从一体金属板制成的半导体散热器。 整体金属板形成一个面板，通道壁，至少两个脚和至少一个外部反向弯曲。 通道壁从面板取决于在通道壁和面板之间限定通道，用于在其中接收半导体。 脚从相应的通道壁延伸以附接到基底。

公开(公告)号：US20090170241A1

公开(公告)日：2009-07-02

申请号：US11964397

申请日：2007-12-26

申请人： Il Kwon Shim ,  Yaojian Lin ,  Seng Guan Chow

发明人： Il Kwon Shim ,  Yaojian Lin ,  Seng Guan Chow

IPC分类号： H01L21/56

CPC分类号： H05K1/185 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/16 ,  H01L24/19 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/82039 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/187 ,  H05K3/205 ,  H05K3/4644 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device is made by forming contact pads on a sacrificial carrier. The contact pads may be formed on a pillar. A semiconductor die is mounted to electrically connect to the contact pads with solder bumps or wire bonds. The semiconductor die is encapsulated with molding compound. The sacrificial carrier is removed. A backside interconnect structure has a first conductive layer formed over the molding compound to electrically connect to the contact pads. A first insulating layer is formed over the first conductive layer. A portion of the first insulating layer is removed to expose the first conductive layer. Solder material is deposited in electrical contact with the first conductive layer. The solder material is reflowed to form a solder bump. A wire bond electrically connects to a contact pad. A front-side interconnect structure can be formed through the molding compound to the contact pads.

摘要翻译： 通过在牺牲载体上形成接触垫来制造半导体器件。 接触垫可以形成在支柱上。 半导体管芯被安装成用焊料凸块或引线接合电连接到接触焊盘。 半导体管芯用模塑料封装。 牺牲载体被去除。 背面互连结构具有形成在模制化合物上的第一导电层以电连接到接触焊盘。 第一绝缘层形成在第一导电层上。 去除第一绝缘层的一部分以露出第一导电层。 焊料与第一导电层电接触沉积。 焊料材料被回流以形成焊料凸块。 导线键合电连接到接触垫。 可以通过模制化合物将前侧互连结构形成到接触垫。

公开(公告)号：US07554179B2

公开(公告)日：2009-06-30

申请号：US11053564

申请日：2005-02-07

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Jeffrey D. Punzalan ,  Pandi Chelvam Marimuthu

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Jeffrey D. Punzalan ,  Pandi Chelvam Marimuthu

IPC分类号： H01L23/495 ,  H01L21/50 ,  H01L23/28 ,  H01L23/48 ,  H05K3/34

CPC分类号： H01L23/49568 ,  H01L23/3107 ,  H01L23/49537 ,  H01L23/49548 ,  H01L24/48 ,  H01L24/97 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A multi-leadframe semiconductor package and method of manufacture includes a first leadframe having a die pad and a plurality of contact leads around the periphery of the die pad. A die is attached to the die pad and electrically connected to the plurality of contact leads. A heat spreader leadframe having a heat spreader and a plurality of terminal leads around the periphery of the heat spreader is provided. The die pad is attached to the heat spreader, and the plurality of contact leads is attached to the plurality of terminal leads.

摘要翻译： 多引线框半导体封装和制造方法包括具有管芯焊盘和围绕管芯焊盘周边的多个接触引线的第一引线框架。 模具附接到管芯焊盘并电连接到多个接触引线。 提供了具有散热器的散热器引线框架和围绕散热器周边的多个端子引线。 芯片焊盘安装在散热器上，多个接触引线安装在多个端子引线上。

公开(公告)号：US07518224B2

公开(公告)日：2009-04-14

申请号：US11383403

申请日：2006-05-15

申请人： Il Kwon Shim ,  Byung Joon Han ,  Seng Guan Chow

发明人： Il Kwon Shim ,  Byung Joon Han ,  Seng Guan Chow

IPC分类号： H01L23/02 ,  H01L23/48 ,  H01L21/00

CPC分类号： H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： An offset integrated circuit package-on-package stacking system is provided including providing a base substrate, forming a contact pad on the base substrate, mounting a first integrated circuit on the base substrate, forming a base package body around the first integrated circuit, providing an offset substrate, mounting a second integrated circuit on the offset substrate, and coupling the offset substrate to the contact pad, including placing the offset substrate on the base package body.

摘要翻译： 提供一种偏移集成电路封装堆叠堆叠系统，包括提供基底基板，在基底基板上形成接触焊盘，将第一集成电路安装在基底基板上，在第一集成电路周围形成基底封装体，提供 偏移衬底，将第二集成电路安装在偏移衬底上，以及将偏移衬底耦合到接触焊盘，包括将偏移衬底放置在基底封装主体上。

公开(公告)号：US20090016032A1

公开(公告)日：2009-01-15

申请号：US12136002

申请日：2008-06-09

申请人： Seng Guan Chow ,  Il Kwon Shim ,  Byung Joon Han ,  Kambhampati Ramakrishna

发明人： Seng Guan Chow ,  Il Kwon Shim ,  Byung Joon Han ,  Kambhampati Ramakrishna

IPC分类号： H05K1/18

CPC分类号： H01L25/105 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/05599

摘要： An integrated circuit package system includes: providing a flexible circuit substrate having a fold; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a recessed encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.

摘要翻译： 集成电路封装系统包括：提供具有折叠的柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的凹入封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。

公开(公告)号：US20080296759A1

公开(公告)日：2008-12-04

申请号：US11757869

申请日：2007-06-04

申请人： Kambhampati Ramakrishna ,  Il Kwon Shim ,  Seng Guan Chow

发明人： Kambhampati Ramakrishna ,  Il Kwon Shim ,  Seng Guan Chow

IPC分类号： H01L23/48 ,  H01L21/60

CPC分类号： H01L21/6835 ,  H01L21/561 ,  H01L21/568 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/24137 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2224/82 ,  H01L2924/00

摘要： A semiconductor package comprises a semiconductor component (e.g., a die) and a via at least partially covered by an encapsulant. The encapsulant forms substantially parallel top and bottom surfaces, with at least part of the via being exposed on the top surface. At least one conductive pad is exposed on the bottom surface, and the via can electrically couple the top and bottom surfaces, as well as couple the semiconductor component at the top and bottom surfaces. An additional semiconductor component can be coupled to the top surface with a circuit pattern formed on the top surface and coupled to the via.

摘要翻译： 半导体封装包括半导体部件（例如，管芯）和至少部分被密封剂覆盖的通孔。 密封剂形成基本上平行的顶表面和底表面，其中通孔的至少一部分暴露在顶表面上。 至少一个导电焊盘暴露在底表面上，并且通孔可以电耦合顶表面和底表面，以及在顶表面和底表面处连接半导体部件。 附加的半导体部件可以与形成在顶表面上并耦合到通孔的电路图案耦合到顶表面。

公开(公告)号：US07446408B2

公开(公告)日：2008-11-04

申请号：US10462288

申请日：2003-06-16

申请人： Il Kwon Shim ,  Seng Guan Chow ,  Gerry Balanon

发明人： Il Kwon Shim ,  Seng Guan Chow ,  Gerry Balanon

IPC分类号： H01L23/34

CPC分类号： H01L23/50 ,  H01L23/3128 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16251 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A package is provided for a semiconductor device including a semiconductor device support substrate having at least one interconnect metal therein connectible to a ground and having at least one opening exposing the surface of the interconnect metal. A heat sink has elastic means integral therewith for cooperating with the opening to position and secure the heat sink to the semiconductor support substrate.

摘要翻译： 提供了一种用于半导体器件的封装，其包括半导体器件支撑衬底，其具有可连接到地的至少一个互连金属，并具有暴露互连金属表面的至少一个开口。 散热器具有与其一体的弹性装置，用于与开口协作以将散热器定位并固定到半导体支撑基板。

公开(公告)号：US20080157402A1

公开(公告)日：2008-07-03

申请号：US11618806

申请日：2006-12-30

申请人： Kambhampati Ramakrishna ,  Il Kwon Shim ,  Seng Guan Chow

发明人： Kambhampati Ramakrishna ,  Il Kwon Shim ,  Seng Guan Chow

IPC分类号： H01L23/28

CPC分类号： H01L23/3128 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3135 ,  H01L23/49861 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/85 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0652 ,  H01L25/165 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/45014 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/85 ,  H01L2224/92247 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/078 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： A dual molded multi-chip package system is provided including forming an embedded integrated circuit package system having a first encapsulation partially covering a first integrated circuit die and a lead connected thereto, mounting a semiconductor device over the first encapsulation and connected to the lead, and forming a second encapsulation over the semiconductor device and the embedded integrated circuit package system.

摘要翻译： 提供了一种双模塑多芯片封装系统，包括形成嵌入式集成电路封装系统，其具有部分覆盖第一集成电路管芯的第一封装和与其连接的引线，将半导体器件安装在第一封装上并连接到引线上，以及 在半导体器件和嵌入式集成电路封装系统上形成第二封装。

公开(公告)号：US20080157318A1

公开(公告)日：2008-07-03

申请号：US11616878

申请日：2006-12-28

申请人： Seng Guan Chow ,  Il Kwon Shim ,  Byung Joon Han

发明人： Seng Guan Chow ,  Il Kwon Shim ,  Byung Joon Han

IPC分类号： H01L23/538 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L23/552 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A bridge stack integrated circuit package-on-package system is provided including forming a first integrated circuit package system having a first substrate, forming a second integrated circuit package system having a second substrate, and mounting a bridge integrated circuit package system on the first substrate and on the second substrate.

摘要翻译： 提供了一种桥式堆叠集成电路封装封装系统，包括形成具有第一衬底的第一集成电路封装系统，形成具有第二衬底的第二集成电路封装系统，以及将桥式集成电路封装系统安装在第一衬底上 并在第二基板上。