公开(公告)号：US20090053852A1

公开(公告)日：2009-02-26

申请号：US12192225

申请日：2008-08-15

申请人： Shuichi Takeuchi ,  Kenji Kobae ,  Takashi Kubota ,  Hiroshi Kobayashi

发明人： Shuichi Takeuchi ,  Kenji Kobae ,  Takashi Kubota ,  Hiroshi Kobayashi

IPC分类号： H05K3/30 ,  H05K13/04

CPC分类号： H01L21/563 ,  H01L24/28 ,  H01L24/75 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  Y10T29/4913 ,  Y10T29/5313 ,  H01L2924/00

摘要： A manufacturing method for an electronic apparatus and manufacturing apparatus are provided. The manufacturing method includes applying to a surface of a sheet an adhesive to be charged into a space between a mounting board and an electronic component mounted on the mounting board, bringing the one surface of the sheet into contact with a back surface of the electronic component mounted on the mounting board and charging the adhesive into the space by bringing the adhesive into contact with a peripheral portion of the electronic component under a low pressure, and pressing a heating head against the other surface of the sheet and heating the sheet with the heating head via the sheet to set the adhesive under atmospheric pressure, in a state that the sheet is in contact with the electronic component.

摘要翻译： 提供了一种用于电子设备和制造设备的制造方法。 制造方法包括向片材的表面施加要填充到安装板和安装在安装板上的电子部件之间的空间中的粘合剂，使片材的一个表面与电子部件的背面接触 安装在安装板上，并通过使粘合剂在低压下与电子部件的周边部分接触来将粘合剂装入空间，并将加热头压在片材的另一个表面上并加热片材 在片材与电子部件接触的状态下，经由片材头部，以在大气压下设置粘合剂。

公开(公告)号：US20070137026A1

公开(公告)日：2007-06-21

申请号：US11391362

申请日：2006-03-29

申请人： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

发明人： Takashi Kubota ,  Kenji Kobae ,  Kimio Nakamura

IPC分类号： B23K20/10

CPC分类号： B23K20/10 ,  B23K2101/32 ,  H05K3/26 ,  H05K3/328 ,  Y10T29/49027 ,  Y10T29/4903

摘要： A method of bonding flying leads produces reliable bonds between the flying leads and substrate pads and can efficiently bond a plurality of flying leads and a plurality of substrate pads using a bonding tool. Flying leads are respectively aligned with a plurality of substrate pads disposed in parallel and a bonding tool applies ultrasonic vibration to the flying leads to bond the respective substrate pads and the flying leads. Bonding is carried out using a bonding tool in which at least one contact member that contacts the flying leads and applies the ultrasonic vibration thereto is rotatably supported. The bonding tool is moved in a direction so as to cross the flying leads disposed in parallel with the at least one contact member rolling while in contact with the flying leads, and the ultrasonic vibration is applied from the at least one contact member to the flying leads to ultrasonically bond the respective flying leads to the substrate pads.

摘要翻译： 结合飞行引线的方法在飞行引线和衬底焊盘之间产生可靠的结合，并且可以使用焊接工具有效地结合多个飞行引线和多个衬底焊盘。 飞行引线分别与平行设置的多个基板焊盘对准，并且焊接工具对飞行引线施加超声波振动以将相应的基板焊盘和飞行引线接合。 使用接合工具进行接合，其中至少一个接触飞行引线并且对其施加超声波振动的接触构件被可旋转地支撑。 接合工具沿与所述至少一个接触构件平行布置的与所述飞行导线接触的方向交叉的方向移动，并且所述超声波振动从所述至少一个接触构件施加到所述飞行 导致将相应的飞行引线超声波地结合到衬底焊盘。

公开(公告)号：US20060065697A1

公开(公告)日：2006-03-30

申请号：US11019623

申请日：2004-12-23

申请人： Kenji Kobae ,  Takashi Kubota

发明人： Kenji Kobae ,  Takashi Kubota

IPC分类号： B23K1/06

CPC分类号： H01L24/81 ,  B23K20/10 ,  B23K20/106 ,  B23K2101/42 ,  H01L24/75 ,  H01L2224/16 ,  H01L2224/75 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2224/0401

摘要： Changes in the form of a pressure welding part of a bonding tool for ultrasonic bonding due to abrasion of the pressure welding part and/or accumulation of foreign matter, such as plating material, on the pressure welding part during use of the bonding tool are prevented, so that the bonding tool can carry out ultrasonic bonding stably. A plurality of protrusions with curved outer surfaces are formed on the pressure welding part that contacts the bonded part during ultrasonic bonding. The protrusions can be formed with spherical outer surfaces by forming concave grooves in a grid in an end surface of the bonding tool and then sandblasting the end surface of the bonding tool.

摘要翻译： 防止了在焊接工具的使用过程中由于压焊部分的磨损引起的超声波接合用焊接工具的压接部件形状变化和电镀材料等异物堆积在压焊部上 ，使粘合工具能够稳定地进行超声波接合。 具有弯曲外表面的多个突起形成在超声波接合期间与接合部接触的压焊部上。 突起可以通过在接合工具的端面中的网格中形成凹槽，然后对结合工具的端面进行喷砂而形成球形外表面。

公开(公告)号：US08381963B2

公开(公告)日：2013-02-26

申请号：US12818554

申请日：2010-06-18

申请人： Kimio Nakamura ,  Yoshiyuki Satoh ,  Kenji Kobae

发明人： Kimio Nakamura ,  Yoshiyuki Satoh ,  Kenji Kobae

IPC分类号： B23K37/04 ,  B29C65/02

CPC分类号： H01L24/97 ,  H01L21/563 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75305 ,  H01L2224/75315 ,  H01L2224/7598 ,  H01L2224/81203 ,  H01L2224/81903 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83862 ,  H01L2224/9211 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A compression-bonding apparatus includes a support stage and a pressing tool. The pressing tool includes a pressing stage, an elastic member and a plurality of bonding heads. The elastic member is held by the pressing stage. The plurality of bonding heads includes an upper surface attached to the elastic member and a lower surface facing an upper surface of the support stage.

摘要翻译： 压接装置包括支撑台和按压工具。 按压工具包括加压台，弹性件和多个接合头。 弹性部件由压制台保持。 多个接合头包括附接到弹性构件的上表面和面向支撑台的上表面的下表面。

公开(公告)号：US08062926B2

公开(公告)日：2011-11-22

申请号：US12265209

申请日：2008-11-05

申请人： Hiroshi Kobayashi ,  Kenji Kobae

发明人： Hiroshi Kobayashi ,  Kenji Kobae

IPC分类号： H04L21/00

CPC分类号： G06K19/07749 ,  G06K19/07728 ,  G06K19/0775 ,  H01L21/56 ,  H01L21/568 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27013 ,  H01L2224/29012 ,  H01L2224/29034 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75252 ,  H01L2224/81005 ,  H01L2224/81191 ,  H01L2224/83051 ,  H01L2224/83192 ,  H01L2224/83194 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  Y10T29/49149 ,  H01L2924/00012 ,  H01L2924/00

摘要： An RFID tag manufacturing method is including application process in which a heat-curable adhesive is applied to an area where a circuit chip is placed on a base to which antennae are wired so as to be connected with the circuit chip, placement process in which the circuit chip is placed where the adhesive is applied, and thereby the circuit chip is connected with the antennae, covering process in which the circuit chip placed on the base is covered with a sheet member having an adhesive layer on its surface, such that the adhesive layer faces the base, and heat and pressure applying process in which pressure is applied to the sheet member toward the base, and heat and pressure are applied to the circuit chip from above the sheet member, thereby curing the adhesive and fixing the circuit chip and the sheet member on the base.

摘要翻译： RFID标签制造方法包括以下步骤：将可热固化粘合剂施加到电路芯片放置在与天线连接的基底上的区域以便与电路芯片连接的应用过程，其中， 将电路芯片放置在施加粘合剂的位置，由此电路芯片与天线连接，其中放置在基座上的电路芯片被其表面上具有粘合剂层的片状部件覆盖的覆盖过程，使得粘合剂 层向基部施加压力施加过程，其中压力施加到片状部件朝向基部，并且热和压力从片状部件的上方施加到电路芯片，从而固化粘合剂并固定电路芯片，并且 基座上的片材。

公开(公告)号：US20100327435A1

公开(公告)日：2010-12-30

申请号：US12822656

申请日：2010-06-24

申请人： Kimio Nakamura ,  Takayoshi Matsumura ,  Yoshiyuki Satoh ,  Kuniko Ishikawa ,  Kenji Kobae

发明人： Kimio Nakamura ,  Takayoshi Matsumura ,  Yoshiyuki Satoh ,  Kuniko Ishikawa ,  Kenji Kobae

IPC分类号： H01L23/488 ,  H01L21/60

CPC分类号： H01L23/49811 ,  H01L23/49816 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/812 ,  H01L2224/81801 ,  H01L2224/83192 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15153 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： An electronic component includes a package substrate, a plurality of conductive pads, an insulating material and a semiconductor device. The plurality of conductive pads is disposed on the package substrate. The insulating material is disposed between the plurality of conductive pads. The insulating material includes a top surface located on an identical plane to an upper surface of the plurality of conductive pads. The semiconductor device includes a conductive bump aligned on a corresponding conductive pad of the plurality of conductive pads.

摘要翻译： 电子部件包括封装基板，多个导电焊盘，绝缘材料和半导体器件。 多个导电焊盘设置在封装衬底上。 绝缘材料设置在多个导电焊盘之间。 绝缘材料包括位于与多个导电焊盘的上表面相同的平面上的顶表面。 半导体器件包括对准在多个导电焊盘的相应导电焊盘上的导电凸块。

公开(公告)号：US20070184582A1

公开(公告)日：2007-08-09

申请号：US11435851

申请日：2006-05-18

申请人： Kimio Nakamura ,  Kenji Kobae ,  Takashi Kubota

发明人： Kimio Nakamura ,  Kenji Kobae ,  Takashi Kubota

IPC分类号： H01L21/00

CPC分类号： H01L24/75 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/75304 ,  H01L2224/75744 ,  H01L2224/83139 ,  H01L2224/8314 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/3511 ,  H01L2924/00

摘要： A method of flip-chip mounting can reliably and stably mount a semiconductor chip to a mounting substrate while avoiding problems such as damage to the semiconductor chip due to a difference in thermal expansion coefficients between the semiconductor chip and the mounting substrate. The method of flip-chip mounting a semiconductor chip supports a mounting substrate on a stage in a state where a resin material has been supplied onto a chip mounting surface of the mounting substrate and presses the semiconductor chip toward the mounting substrate using a pressure/heat applying head to bond the semiconductor chip to the mounting substrate and thermally harden the resin material. A concave part is provided in a support surface of the stage that supports the semiconductor chip, and the semiconductor chip is bonded to the mounting substrate by pressing the semiconductor chip toward the mounting substrate using the pressure/heat applying head in a state where the mounting substrate is bent toward the concave part.

摘要翻译： 一种倒装芯片安装方法可以可靠且稳定地将半导体芯片安装到安装基板，同时避免由于半导体芯片和安装基板之间的热膨胀系数的差异而导致对半导体芯片的损坏等问题。 半导体芯片的倒装芯片的安装方法在将树脂材料供给到安装基板的芯片安装面上的状态下，将载置基板支撑在载台上，并使用压力/热量将半导体芯片朝向安装基板 施加头部以将半导体芯片粘合到安装基板上并使树脂材料热硬化。 在支撑半导体芯片的载物台的支撑面上设置有凹部，半导体芯片通过使用压力/加热头将半导体芯片压向安装基板而与安装基板接合， 基板向凹部弯曲。

公开(公告)号：US08308071B2

公开(公告)日：2012-11-13

申请号：US12756487

申请日：2010-04-08

申请人： Shuichi Takeuchi ,  Kenji Kobae ,  Takayoshi Matsumura ,  Tetsuya Takahashi

发明人： Shuichi Takeuchi ,  Kenji Kobae ,  Takayoshi Matsumura ,  Tetsuya Takahashi

IPC分类号： G06K19/06

CPC分类号： G06K19/07749 ,  G06K19/07724 ,  G06K19/07728 ,  Y10T156/10

摘要： An RFID tag includes an inlet on which an antenna pattern serving as an antenna for communication and an IC chip electrically connected to the antenna pattern are mounted. The RFID tag also includes an exterior body that encloses the inlet from outside and a hollow space that is formed by the inlet and the exterior body and that is filled with gas or a gel material.

摘要翻译： RFID标签包括其上安装用作通信用天线的天线图案和与天线图案电连接的IC芯片的入口。 RFID标签还包括从外部包围入口的外部主体和由入口和外部主体形成并且填充有气体或凝胶材料的中空空间。

公开(公告)号：US08081081B2

公开(公告)日：2011-12-20

申请号：US12191539

申请日：2008-08-14

申请人： Hiroshi Kobayashi ,  Kenji Kobae ,  Takashi Kubota

发明人： Hiroshi Kobayashi ,  Kenji Kobae ,  Takashi Kubota

IPC分类号： G08B13/14 ,  G08B23/00 ,  H01L23/02

CPC分类号： G06K19/07749 ,  G06K19/02 ,  G06K19/027 ,  G06K19/07728 ,  G06K19/07758 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/1815 ,  Y10T428/2462 ,  H01L2924/00

摘要： The electronic apparatus includes a base sheet; a conductive pattern formed on the base sheet; a circuit chip mounted on the base sheet and connected to the conductive pattern; and plural protrusions arranged on at least one of a frontside and a backside of the base sheet to overlap at least a portion of the conductive pattern. The plural protrusions protrude in a direction away from the base sheet.

摘要翻译： 电子设备包括基片; 形成在基片上的导电图案; 电路芯片，安装在基片上并连接到导电图案; 以及布置在所述基片的前侧和后侧中的至少一个上的多个突起，以与所述导电图案的至少一部分重叠。 多个突起在远离基片的方向上突出。

公开(公告)号：US20100328917A1

公开(公告)日：2010-12-30

申请号：US12821938

申请日：2010-06-23

申请人： Takayoshi MATSUMURA ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

发明人： Takayoshi MATSUMURA ,  Kenji Kobae ,  Shuichi Takeuchi ,  Tetsuya Takahashi

IPC分类号： H05K7/00 ,  H01L23/498

CPC分类号： H01L24/11 ,  H01L24/45 ,  H01L25/0657 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/13644 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/45144 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2224/13099 ,  H01L2224/48 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A multichip module includes a package substrate, a first semiconductor device, a second semiconductor device and a conductive bump. The first semiconductor device is flip-chip bonded to the package substrate. The first semiconductor device includes a first chip pad on a surface thereof. The second semiconductor device is mounted on the first semiconductor device. The second semiconductor device includes a second chip pad facing the first chip pad. The conductive bump connects the first chip pad to the second chip pad. The conductive bump includes a first metallic body that has a first diffusion rate and a second metallic body that has a second diffusion rate lower than the first diffusion rate.

摘要翻译： 多芯片模块包括封装基板，第一半导体器件，第二半导体器件和导电凸块。 第一半导体器件被倒装芯片结合到封装衬底。 第一半导体器件包括在其表面上的第一芯片焊盘。 第二半导体器件安装在第一半导体器件上。 第二半导体器件包括面向第一芯片焊盘的第二芯片焊盘。 导电凸块将第一芯片焊盘连接到第二芯片焊盘。 导电凸块包括具有第一扩散速率的第一金属体和具有低于第一扩散速率的第二扩散速率的第二金属体。