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公开(公告)号：US08203351B2
公开(公告)日：2012-06-19
申请号：US12782904
申请日：2010-05-19
CPC分类号： G01R1/18 , G01R1/07307 , G01R31/2889
摘要： A probing apparatus can comprise a substrate, conductive signal traces, probes, and electromagnetic shielding. The substrate can have a first surface and a second surface opposite the first surface, and the electrically conductive first signal traces can be disposed on the first surface of the first substrate. The probes can be attached to the first signal traces, and the electromagnetic shielding structures can be disposed about the signal traces.
摘要翻译： 探测装置可以包括衬底，导电信号迹线，探针和电磁屏蔽。 基板可以具有与第一表面相对的第一表面和第二表面，并且导电的第一信号迹线可以设置在第一基板的第一表面上。 探针可以附着到第一信号迹线上，并且电磁屏蔽结构可以围绕信号迹线设置。
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公开(公告)号：US20120007626A1
公开(公告)日：2012-01-12
申请号：US13172001
申请日：2011-06-29
申请人： Benjamin N. Eldridge
发明人： Benjamin N. Eldridge
CPC分类号： G01R31/2884 , G01R31/2889
摘要： Techniques for testing an electronic device with through-device vias can include using a probe card assembly with probes for contacting connection structures of the electronic device including ends of through-device vias of the electronic device. A pair of the probes can be electrically connected in the probe card assembly and can thus contact and form a direct return loop from one through-device via to another through-device via of a pair of the through-device vias with which the pair of probes is in contact. The electronic device can include test circuitry for driving a test signal onto the one of the through-device vias and a receiver for detecting the test signal on the other of the through-device vias.
摘要翻译： 用于测试具有通孔设备通孔的电子设备的技术可以包括使用具有探针的探针卡组件，用于接触电子设备的连接结构，包括电子设备的通过设备通孔的端部。 一对探头可以电连接在探针卡组件中，并且因此可以通过一对穿通装置通孔接触并形成从一个穿通装置通道到另一个通过装置通道的直接返回环， 探针接触。 电子设备可以包括用于将测试信号驱动到通过设备通孔中的一个通路的测试电路和用于检测通孔设备通孔中另一个上的测试信号的接收器。
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公开(公告)号：US07897435B2
公开(公告)日：2011-03-01
申请号：US11420403
申请日：2006-05-25
IPC分类号： H01L21/00
CPC分类号： B81C1/00214 , B81B7/04 , B81C3/002 , B81C2203/051 , G01R1/06711 , G01R1/06744 , G01R1/07314 , G01R1/07342 , G01R3/00 , H01L23/49827 , H01L2924/0002 , H01L2924/15174 , Y10T29/49004 , Y10T29/49126 , Y10T29/4913 , Y10T29/49147 , Y10T29/49151 , Y10T29/49204 , H01L2924/00
摘要： Methods of fabricating an array of aligned microstructures on a substrate are disclosed. The microstructures may be spring contacts or other microelements. The methods disclosed include construction of an alignment substrate, alignment of die elements with the alignment substrate, and fixation of the aligned die elements to a backing substrate.
摘要翻译： 公开了在衬底上制造排列的微结构阵列的方法。 微结构可以是弹簧触点或其他微量元件。 所公开的方法包括对准基板的构造，模具元件与对准基板的对准以及将对准的模具元件固定到背衬基板上。
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公开(公告)号：US07868632B2
公开(公告)日：2011-01-11
申请号：US11697603
申请日：2007-04-06
IPC分类号： G01R31/02
CPC分类号： G01R31/2887 , G01R1/06705 , G01R31/2886
摘要： An electronic device is moved into a first position with respect to probes for making electrical contact with the device. The electronic device is then moved into a second position in which the electronic device is pressed against the probes, compressing the probes. The movement into the second position includes two components. One component of the movement tends to press the electronic device against the probes, compressing the probes and inducing a stress in the probes. The second movement tends to reduce that stress. Test data are then communicated to and from the electronic device through the probes.
摘要翻译： 电子设备相对于用于与设备电接触的探针移动到第一位置。 然后将电子设备移动到第二位置，其中电子设备被压靠在探针上，压缩探针。 进入第二位置的运动包括两个部件。 移动的一个组件倾向于将电子装置压靠在探针上，压缩探针并在探针中引起应力。 第二动作往往会减轻压力。 然后通过探头将测试数据传送到电子设备和从电子设备传送。
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公开(公告)号：US20100224303A1
公开(公告)日：2010-09-09
申请号：US12783967
申请日：2010-05-20
IPC分类号： B29C65/52
CPC分类号： G01R3/00 , G01R1/06716 , G01R1/06744 , H01L24/80 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/1461 , Y10T29/49117 , Y10T29/49147 , Y10T156/10 , Y10T428/12347 , Y10T428/12375 , Y10T428/12535 , Y10T428/12542 , Y10T428/12556 , Y10T428/12569 , Y10T428/31681 , H01L2924/00
摘要： A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated foundation structure in an adhesive polymer material, such as epoxy. Components, such as spring probes, can then be constructed on the plated foundation. The adhesive polymer material better assures the adhesion of the metal foundation structure to the substrate surface by counteracting forces applied to an element, such as a spring probe, attached to the plated foundation.
摘要翻译： 提供坚固的机械结构以防止形成在基板上的小基础结构从基板表面分离。 强化结构通过在种子层上电镀基础金属层，然后将镀覆的基础结构嵌入诸如环氧树脂的粘合剂聚合物材料中而形成。 然后可以在镀覆的基础上构造诸如弹簧探针的组件。 粘合剂聚合物材料通过抵抗附着在镀覆基底上的诸如弹簧探针的元件的抵抗力，更好地保证金属基础结构与基底表面的粘附。
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公开(公告)号：US07733106B2
公开(公告)日：2010-06-08
申请号：US11532494
申请日：2006-09-15
申请人： Thomas H. Dozier, II , Benjamin N. Eldridge , David S. Hsu , Igor Y. Khandros , Charles A. Miller
发明人： Thomas H. Dozier, II , Benjamin N. Eldridge , David S. Hsu , Igor Y. Khandros , Charles A. Miller
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R31/2893 , G01R31/31905
摘要： An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to allow interchangeable interfaces to different testers to be attached to and detached from the carrier. The carrier can also be configured as a shipping container for the dies.
摘要翻译： 公开了一种示例性的模具载体。 在一些实施例中，模具载体可以在测试模具的同时保持多个单个模具。 模具可以以对模具进行测试的模式布置在载体上。 载体可以被配置为允许不同的测试仪的可互换的接口被附接到载体上并与载体分离。 载体也可以被配置为模具的运输容器。
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公开(公告)号：US07731503B2
公开(公告)日：2010-06-08
申请号：US11466039
申请日：2006-08-21
IPC分类号： H01R12/00
CPC分类号： G01R1/06755 , H01R13/03 , Y10T29/49204
摘要： A carbon nanotube contact structure can be used for making pressure connections to a DUT. The contact structure can be formed using a carbon nanotube film or with carbon nanotubes in solution. The carbon nanotube film can be grown in a trench in a sacrificial substrate in which a contact structure such as a beam or contact element is then formed by metal plating. The film can also be formed on a contact element and have metal posts dispersed therein to provide rigidity and elasticity. Contact structures or portions thereof can also be plated with a solution containing carbon nanotubes. The resulting contact structure can be tough, and can provide good electrical conductivity.
摘要翻译： 可以使用碳纳米管接触结构来与DUT进行压力连接。 可以使用碳纳米管膜或溶液中的碳纳米管来形成接触结构。 碳纳米管膜可以在牺牲基板中的沟槽中生长，其中通过金属电镀形成诸如光束或接触元件的接触结构。 膜也可以形成在接触元件上，并且金属柱分散在其中以提供刚性和弹性。 接触结构或其部分也可以镀有含有碳纳米管的溶液。 所得到的接触结构可以是韧性的，并且可以提供良好的导电性。
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公开(公告)号：US20100120267A1
公开(公告)日：2010-05-13
申请号：US12689397
申请日：2010-01-19
IPC分类号： H01R12/00
CPC分类号： G01R1/07378 , G01R1/07307 , H01L2924/0002 , H01L2924/00
摘要： Double-sided interposer assemblies and methods for forming and using them. In one example of the invention, an interposer comprises a substrate having a first surface and a second surface opposite of said first surface, a first plurality of contact elements disposed on said first side of said substrate, and a second plurality of contact elements disposed on said second surface of said substrate, wherein said interposer connects electronic devices via said first and said second plurality of contact elements.
摘要翻译： 双面插入器组件及其形成和使用方法。 在本发明的一个示例中，插入器包括具有第一表面和与所述第一表面相对的第二表面的基板，设置在所述基板的所述第一侧上的第一多个接触元件和设置在所述第一表面上的第二多个接触元件 所述基板的所述第二表面，其中所述插入件经由所述第一和第二多个接触元件连接电子器件。
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69.发明申请公开(公告)号：US20100065963A1
公开(公告)日：2010-03-18
申请号：US12500495
申请日：2009-07-09
IPC分类号： H01L23/48
CPC分类号： B23K20/004 , B23K2101/40 , H01L23/13 , H01L23/49811 , H01L23/50 , H01L24/45 , H01L24/48 , H01L24/78 , H01L24/85 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/78301 , H01L2224/85043 , H01L2224/85045 , H01L2224/85099 , H01L2224/85203 , H01L2224/85205 , H01L2224/85207 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01014 , H01L2924/01015 , H01L2924/01018 , H01L2924/01019 , H01L2924/01023 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01075 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/07802 , H01L2924/10253 , H01L2924/10329 , H01L2924/12041 , H01L2924/12044 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/30107 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/20752 , H01L2924/20753 , H01L2924/20755 , H01L2924/00015 , H01L2924/2075 , H01L2924/20754 , H01L2924/013 , H01L2924/00013
摘要： Contact structures for a variety of electronic components can be formed to have primarily elastic properties. The contact structures can be free standing, and can be coupled to a variety of different electronic components such as a probe card assembly, a semiconductor wafer or dies, an interposer, or the like. Tips of the contact structures can have a topology that facilities contact with another electronic component.
摘要翻译： 可以形成各种电子部件的接触结构以具有主要的弹性特性。 接触结构可以是独立的，并且可以耦合到各种不同的电子部件，例如探针卡组件，半导体晶片或管芯，插入件等。 接触结构的提示可以具有设备与另一电子部件接触的拓扑。
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70.发明授权公开(公告)号：US07659736B2
公开(公告)日：2010-02-09
申请号：US11761912
申请日：2007-06-12
申请人： Benjamin N. Eldridge , Barbara Vasquez , Makarand S. Shinde , Gaetan L. Mathieu , A. Nicholas Sporck
发明人： Benjamin N. Eldridge , Barbara Vasquez , Makarand S. Shinde , Gaetan L. Mathieu , A. Nicholas Sporck
IPC分类号： G01R31/02
CPC分类号： G01R31/2889 , G01R1/0416 , G01R1/07307
摘要： A wafer test assembly includes multiple probe head substrates arranged like tiles with connectors attached to one side and probes supported on the opposing side. In one embodiment, flexible cable connectors directly connect the connectors on the probe head tile to a test head, while in another embodiment the flexible cables connect the probe head tile to a PCB providing horizontal routing to test head connectors. In one embodiment, leveling pins provide a simplified support structure connecting to a retaining element attached to the tiles to provide for applying a push-pull leveling force. A test head connector interface frame enables rearrangement of connectors between the test head and the probe card to provide for both full wafer contact or partial wafer contact. The test head connectors are rearranged by being slidable on rails, or pluggable and unpluggable enabling movement over a range of positions.
摘要翻译： 晶片测试组件包括多个探针头基底，其布置成瓦片，其中连接器连接到一侧，探针支撑在相对侧上。 在一个实施例中，柔性电缆连接器将探头头瓦片上的连接器直接连接到测试头，而在另一个实施例中，柔性电缆将探头头瓦片连接到PCB，从而向测试头连接器提供水平布线。 在一个实施例中，调平销提供连接到附接到瓦片的保持元件以提供施加推挽平整力的简化支撑结构。 测试头连接器接口框架能够重新布置测试头和探针卡之间的连接器，以提供完整的晶片接触或部分晶片接触。 测试头连接器通过在轨道上滑动来重新布置，或者可插拔和可拔出，使得能够在一定范围的位置上移动。
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