公开(公告)号：US20050016308A1

公开(公告)日：2005-01-27

申请号：US10663807

申请日：2003-09-17

申请人： Eiji Hayashi

发明人： Eiji Hayashi

IPC分类号： F16H25/22

CPC分类号： F16H25/2214 ,  Y10T74/19767

摘要： A tube guide for a ball screw having a screw shaft including a ball rolling groove; a nut including a ball rolling groove; a plurality of balls disposed in a ball rolling passage; and, a ball circulation tube and including a ball scooping portion in an end portion thereof, wherein the tube guide is used for mounting the ball circulation tube onto the nut, has an outer shape matched to the inner shape of a tube guide insertion hole formed in the nut so as to correspond to the insertion position of the ball scooping portion, and includes a scooping portion insertion hole consisting of a penetration hole formed so as to have an inner shape matched to the outer shape of the ball scooping portion, and wherein the tube guide is interposed between the ball scooping portion and the tube guide insertion hole.

摘要翻译： 一种用于滚珠丝杠的导管，其具有包括滚珠槽的螺杆轴; 一个包括滚珠槽的螺母; 设置在球滚动通道中的多个球; 以及球状循环管，在其端部包括球形舀取部，其中，所述导管用于将所述球循环管安装在所述螺母上，具有与形成的导管插入孔的内部形状相匹配的外形 在螺母中，与所述球形舀取部的插入位置对应，并且包括舀取部插入孔，所述舀取部插入孔由形成为具有与所述球舀取部的外形匹配的内部形状的贯通孔构成，并且其中， 管引导件插入在球勺部分和管引导件插入孔之间。

公开(公告)号：US06503633B2

公开(公告)日：2003-01-07

申请号：US09860914

申请日：2001-05-21

申请人： Michinori Nishikawa ,  Kouichi Hasegawa ,  Eiji Hayashi ,  Kinji Yamada

发明人： Michinori Nishikawa ,  Kouichi Hasegawa ,  Eiji Hayashi ,  Kinji Yamada

IPC分类号： C08G7716

CPC分类号： H01L21/02126 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  H01L21/316 ,  Y10T428/31663

摘要： A composition for film formation which, when used in the production of semiconductor devices and the like, can give interlayer insulating films which differ little in dielectric constant even when obtained through curing under different conditions and have excellent adhesion to substrates, a process for producing the composition, and a silica-based film obtained from the composition. The composition for film formation comprises: (A) a product of hydrolysis and condensation obtained by hydrolyzing and condensing (A-1) at least one compound selected from the group consisting of compounds represented by the following formula (1), compounds represented by the following formula (2), and compounds represented by the following formula (3), and (A-2) at least one compound represented by the following formula (4), in the presence of a catalyst and water; and (B) an organic solvent.

摘要翻译： 一种成膜用组合物，当用于半导体装置等的制造中时，即使在不同条件下固化而获得的介电常数几乎不相等且对基材的附着性优异，也可以制造出 组合物和由该组合物获得的二氧化硅基膜。 用于成膜的组合物包括：（A）通过水解和缩合获得的水解和缩合产物（A-1）至少一种选自由下式（1）表示的化合物的化合物，由 下述式（2）表示的化合物和下述式（3）所示的化合物和（A-2）至少一种下述式（4）所示的化合物在催化剂和水的存在下反应; 和（B）有机溶剂。

公开(公告)号：US06495264B2

公开(公告)日：2002-12-17

申请号：US09827902

申请日：2001-04-09

申请人： Eiji Hayashi ,  Kouichi Hasegawa ,  Youngsoo Seo

发明人： Eiji Hayashi ,  Kouichi Hasegawa ,  Youngsoo Seo

IPC分类号： B32B2520

CPC分类号： H01L21/02126 ,  C08G77/08 ,  C08G77/50 ,  C09D183/04 ,  C09D183/14 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122 ,  Y10T428/31663

摘要： A composition for film formation which comprises: (A) a product of hydrolysis and condensation obtained by hydrolyzing and condensing at least one silane compound selected from the group consisting of compounds represented by the formula (1), compounds represented by the formula (2), and compounds represented by the formula (3) in the presence of water and at least one compound selected from the group consisting of tetraalkylammonium hydoxides, alicyclic organic amines, and metal hydroxides, and (B) an organic solvent.

摘要翻译： 一种成膜用组合物，其特征在于，包括：（A）水解缩合得到的水解和缩合产物，所述产物通过水解和缩合至少一种选自由式（1）表示的化合物，式（2）表示的化合物， ，和由式（3）表示的化合物在水和至少一种选自氢氧化四烷基铵，脂环族有机胺和金属氢氧化物的化合物的存在下，和（B）有机溶剂。

公开(公告)号：US06265244B1

公开(公告)日：2001-07-24

申请号：US09440515

申请日：1999-11-15

申请人： Eiji Hayashi ,  Yoshihiro Tomita

发明人： Eiji Hayashi ,  Yoshihiro Tomita

IPC分类号： H01L2144

CPC分类号： H01L24/11 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/81801 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K3/3436 ,  H01L2924/00

摘要： A method for mounting semiconductor elements without lowering the reliability of connection due to the residue of flux in the connection of the semiconductor elements to the wiring substrate. A part of the oxide film of a solder bump 3 can previously be broken by previously heating a semiconductor element 1 and a wiring substrate 2 to a predetermined preheating temperature, and pressure-welding the semiconductor element 1 to the wiring substrate 2. Furthermore, since the oxide film covering the surface of the solder bump 3 can be absorbed in the solder bump 3 by rhythmically moving the solder bump in a predetermined direction in the state where the solder bump is melted by heating the solder bump on the semiconductor element and the wiring substrate to a temperature above the melting point of solder, bonding can be performed without using flux. Furthermore, since the surface of the solder bump 3 formed on the semiconductor element 1 and/or the wiring substrate 2 can be prevented from oxidation, or the oxide film can be reduced by the inert gas or reducing gas 7 in the above-described air isolation box 6, the connection between the semiconductor element 1 and the wiring substrate 2 can further be stabilized.

摘要翻译： 一种用于安装半导体元件的方法，而不会由于在半导体元件到布线基板的连接中的磁通残留而降低连接的可靠性。 通过将半导体元件1和布线基板2预先加热到预定的预热温度，可以预先破坏焊料凸块3的氧化膜的一部分，并且将半导体元件1压接到布线基板2.此外，由于 覆盖焊料凸块3的表面的氧化膜可以通过在焊料凸起熔化的状态下通过加热半导体元件上的焊料凸块和布线而在预定方向上有条不紊地移动焊料凸块3而被吸收在焊料凸块3中 衬底到高于焊料熔点的温度，可以在不使用焊剂的情况下进行接合。 此外，由于可以防止形成在半导体元件1和/或布线基板2上的焊料凸块3的表面氧化，或者可以通过上述空气中的惰性气体或还原气体7来还原氧化膜 隔离盒6，可以进一步稳定半导体元件1和布线基板2之间的连接。

公开(公告)号：US5828225A

公开(公告)日：1998-10-27

申请号：US674916

申请日：1996-07-03

申请人： Tadashi Obikane ,  Eiji Hayashi ,  Ryoichiro Koshi

发明人： Tadashi Obikane ,  Eiji Hayashi ,  Ryoichiro Koshi

IPC分类号： G01R1/067 ,  G01R31/28 ,  G01R31/02

CPC分类号： G01R1/06705 ,  G01R31/2886

摘要： A probing apparatus has an apparatus body and a test head detachable from the apparatus body. A probe card having a plurality of probe needles to be brought into contact with a semiconductor wafer is supported by the test head. Three engaging rods are disposed on the test head around the probe card to receive the load of the test head in a distributed manner. A vertically movable work table is disposed on the apparatus body to place a substrate thereon. Two first support mechanisms and one second support mechanism are disposed on the apparatus body around the work table to support the test head such that the probe card opposes the work table. The support mechanisms detachably engage with the engaging rods and support the test head through the engaging rods. The first support mechanisms have elevating mechanisms for moving the test head in the vertical direction through the engaging rods. When the test head is moved by the elevating mechanisms, the inclination of the probe card with respect to the wafer placed on the work table is adjusted.

摘要翻译： 探测装置具有可从装置主体拆卸的装置本体和测试头。 具有与半导体晶片接触的多个探针的探针卡被测试头支撑。 三个接合杆设置在探针卡周围的测试头上，以分布的方式接收测试头的负载。 一个垂直移动的工作台设置在装置本体上以在其上放置基板。 两个第一支撑机构和一个第二支撑机构设置在工作台周围的装置主体上，以支撑测试头，使得探针卡与工作台相对。 支撑机构可拆卸地与接合杆接合并且通过接合杆支撑测试头。 第一支撑机构具有用于通过接合杆在垂直方向上移动测试头的升降机构。 当通过升降机构移动测试头时，调整探针卡相对于放置在工作台上的晶片的倾斜度。

公开(公告)号：US5476934A

公开(公告)日：1995-12-19

申请号：US294353

申请日：1994-08-23

申请人： Haruhiko Fukaya ,  Takashi Abe ,  Eiji Hayashi ,  Yoshio Hayakawa

发明人： Haruhiko Fukaya ,  Takashi Abe ,  Eiji Hayashi ,  Yoshio Hayakawa

IPC分类号： C07D207/10 ,  C07C407/00 ,  C07C409/40 ,  C07D211/36 ,  C07D211/38 ,  C07D241/04 ,  C07D263/04 ,  C07D265/30 ,  C07D295/00 ,  C08K5/34 ,  C08K5/35 ,  C07D207/04 ,  C07D211/30 ,  C07D405/12

CPC分类号： C07D263/04 ,  C07D265/30 ,  C08K5/34 ,  C08K5/35

摘要： A nitrogen-containing perfluoroalkanoyl peroxide is provided which is represented by the formula: ##STR1## wherein Rf.sub.1 and Rf.sub.2 independently stand for an alkyl group of 1 to 5 carbon atoms, provided that Rf.sub.1 and Rf.sub.2 are joined to each other in one of the three patterns of union, 1) direct union, 2) union through the medium of an oxygen atom or 3) union through the medium of a nitrogen atom to form one of the three rings, i.e. five-membered ring, six-membered ring or seven-membered ring. The nitrogen-containing perfluoroalkanoyl peroxide is produced by a method which comprises oxidizing a compound represented by the following formula: ##STR2##

摘要翻译： 提供含氮全氟烷酰基过氧化物，其由下式表示：其中Rf1和Rf2独立地代表1至5个碳原子的烷基，条件是Rf1和Rf2在三种之一中彼此连接 联合模式，1）直接联合，2）通过氧原子的介质结合，或3）通过氮原子的介质结合形成三个环之一，即五元环，六元环或七 记忆戒指 含氮全氟烷酰基过氧化物是通过包括氧化由下式表示的化合物的方法制备的：＆lt; IMAGE＆gt;

公开(公告)号：US5256825A

公开(公告)日：1993-10-26

申请号：US997360

申请日：1992-12-28

申请人： Haruhiko Fukaya ,  Takashi Abe ,  Eiji Hayashi ,  Yoshio Hayakawa

发明人： Haruhiko Fukaya ,  Takashi Abe ,  Eiji Hayashi ,  Yoshio Hayakawa

IPC分类号： C07D263/04 ,  C07D265/30 ,  C08K5/34 ,  C08K5/35 ,  C07C211/15

CPC分类号： C07D263/04 ,  C07D265/30 ,  C08K5/34 ,  C08K5/35

摘要： A nitrogen-containing perfluoroalkanoyl peroxide is provided which is represented by the formula: ##STR1## wherein Rf.sub.1 and Rf.sub.2 independently stand for an alkyl group of 1 to 5 carbon atoms, provided that Rf.sub.1 and Rf.sub.2 are joined to each other in one of the three patterns of union, 1) direct union, 2) union through the medium of an oxygen atom or 3) union through the medium of a nitrogen atom to form one of the three rings, i.e. five membered ring, six-membered ring or seven-membered ring. The nitrogen-containing perfluoroalkanoyl peroxide is produced by a method which comprises oxidizing a compound represented by the following formula: ##STR2##

摘要翻译： 提供含氮全氟烷酰基过氧化物，其由下式表示：其中Rf1和Rf2独立地代表1至5个碳原子的烷基，条件是Rf1和Rf2在三种之一中彼此连接 联合模式，1）直接联合，2）通过氧原子的介质结合，或3）通过氮原子的介质结合形成三个环之一，即五元环，六元环或七元环， 元环。 含氮全氟烷酰基过氧化物是通过包括氧化由下式表示的化合物的方法制备的：＆lt; IMAGE＆gt;

公开(公告)号：US08314495B2

公开(公告)日：2012-11-20

申请号：US13367029

申请日：2012-02-06

申请人： Eiji Hayashi ,  Kyo Go ,  Kozo Harada ,  Shinji Baba

发明人： Eiji Hayashi ,  Kyo Go ,  Kozo Harada ,  Shinji Baba

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/49827 ,  H01L21/4853 ,  H01L21/563 ,  H01L21/6835 ,  H01L23/3142 ,  H01L23/3157 ,  H01L23/36 ,  H01L23/373 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/562 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/743 ,  H01L24/81 ,  H01L2021/6015 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05009 ,  H01L2224/05022 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05025 ,  H01L2224/05124 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81193 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2224/81909 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/15174 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15724 ,  H01L2924/15747 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/0366 ,  H05K3/4602 ,  H05K2201/029 ,  H01L2924/0132 ,  H01L2924/01014 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/0665 ,  H01L2924/00014

摘要： Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained.As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.

摘要翻译： 即使省略了加强件，也可以获得能够防止布线基板发生扭曲和变形的半导体装置。 对于具有布线基板的半导体器件，通过其与布线基板进行倒装芯片接合的半导体芯片和粘附到半导体芯片的背面的散热器，并且省略了用于加强布线的加强件 基板并且保持散热器的表面平滑度，布线基板具有分别形成直径不同的通孔的多个绝缘基板，并且每个绝缘基板包含玻璃布。

公开(公告)号：US07759793B2

公开(公告)日：2010-07-20

申请号：US11792955

申请日：2004-12-13

申请人： Eiji Hayashi

发明人： Eiji Hayashi

IPC分类号： H01L23/488

CPC分类号： H01L24/10 ,  H01L21/563 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/05666 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16195 ,  H01L2924/181 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3463 ,  H01L2924/00 ,  H01L2924/00014

摘要： Regarding a semiconductor device, especially the present invention suppresses disconnection of the connection structure concerned in the semiconductor device which has the electric and mechanical connection structure using solder, and aims at improving connection reliability. And to achieve the above objects, the semiconductor device has the solder bump which electrically connects a semiconductor chip and a package substrate, the under-filling resin with which it filled up between the semiconductor chip and the package substrate, and a solder ball which electrically connects a package substrate with the outside, and the solder bump's elastic modulus is made lower than the elastic modulus of a solder ball.

摘要翻译： 关于半导体器件，特别是本发明抑制了使用焊料的具有电气和机械连接结构的半导体器件中的连接结构的断开，并且旨在提高连接可靠性。 为了实现上述目的，半导体器件具有将半导体芯片和封装基板电连接的焊料凸块，其填充在半导体芯片和封装基板之间的填充不足的树脂，以及电焊 将封装衬底与外部连接，并且使焊料凸块的弹性模量低于焊球的弹性模量。

公开(公告)号：US07619765B2

公开(公告)日：2009-11-17

申请号：US10900077

申请日：2004-07-27

申请人： Yoshio Kimura ,  Eiji Hayashi

发明人： Yoshio Kimura ,  Eiji Hayashi

IPC分类号： G06F15/00 ,  G06K1/00

CPC分类号： G06F3/1286 ,  G06F3/1204 ,  G06F3/1205 ,  G06F3/126

摘要： A client server system which enables the user of a client computer to obtain the optimum printing result only by designating desired print settings, and to perform printing according to common print settings even if printers are modified or a new printer is added on a network. A favorite display module displays a print setting designating screen relating a printer. A data sending and receiving module transmits the print settings designated on the print setting designating screen by a user and an ID of a client computer to a server. A data sending and receiving module receives a printer driver adapted to the printer and print setting information from the server. A favorite setting changing module changes print settings of the printer driver according to the print setting information sent from the server. A favorite setting completion display module indicates that the changing of the print settings has been completed.

摘要翻译： 一种客户端服务器系统，其使得客户端计算机的用户仅通过指定期望的打印设置来获得最佳打印结果，并且即使打印机被修改或者在网络上添加了新的打印机，也可以根据通常的打印设置进行打印。 最喜欢的显示模块显示与打印机相关的打印设置指定画面。 数据发送和接收模块将由用户在打印设置指定画面上指定的打印设置和客户计算机的ID发送到服务器。 数据发送和接收模块接收适用于打印机的打印机驱动程序，并从服务器打印设置信息。 最喜欢的设置更改模块根据从服务器发送的打印设置信息更改打印机驱动程序的打印设置。 喜好的设置完成显示模块指示打印设置的改变已经完成。