摘要:
A method of fabricating a microelectronic package having a direct contact heat spreader, a package formed according to the method, a die-heat spreader combination formed according to the method, and a system incorporating the package. The method comprises metallizing a backside of a microelectronic die to form a heat spreader body directly contacting and fixed to the backside of the die thus yielding a die-heat spreader combination. The package includes the die-heat spreader combination and a substrate bonded to the die.
摘要:
A system includes an electrochemically functional membrane, and a support structure constructed and arranged so as to support the membrane while leaving within the membrane a chemically active area having an area utilization of at least about 50%. In some embodiments, the support structure may include a plurality of grids that are sized and shaped so that the contact area between the grids and the membrane is reduced to less than about 40%. In some embodiments, the support structure may include aerogels, for example PVA-reinforced CNT aerogels having a conductivity that is increased by pyrolysis. The system may be a gas separation system; a gas production system; a gas purification system; or an energy generation system such as an SOFC.
摘要:
Phase transitions (such as metal-insulator transitions) are induced in oxide structures (such as vanadium oxide thin films) by applying an electric field. The electric field-induced phase transitions are achieved in VO2 structures that scale down to nanometer range. In some embodiments, the optical and/or dielectric properties of the oxide structures are actively tuned by controllably varying the applied electric field. Applying a voltage to a single-phase oxide material spontaneously leads to the formation of insulating and conducting regions within the active oxide material. The dimensions and distributions of such regions can be dynamically tuned by varying the applied electric field and/or the temperature. In this way, oxide materials with dynamically tunable optical and/or dielectric properties are created.
摘要:
The embodiments of the invention relate to a device having a first substrate comprising a transistor; a second substrate; an insulating layer in between and adjoining the first and second substrates; and an opening within the second substrate, the opening being aligned with the transistor; wherein the transistor is configured to detect an electrical charge change within the opening. Other embodiments relate to a method including providing a substrate comprising a first part, a second part, and an insulating layer in between and adjoining the first and second parts; fabricating a transistor on the first part; and fabricating an opening within the second part, the opening being aligned with the transistor; wherein the transistor is configured to detect an electrical charge change within the opening.
摘要:
Embodiments of the invention provide a first component with a compliant interconnect bonded to a second component with a land pad by a metal to metal bond. In some embodiments, the first component may be a microprocessor die and the second component a package substrate.
摘要:
In one embodiment, the present invention includes a hybrid device having a first die including a semiconductor device and a second die coupled to the first die, where the second die includes a magnetic structure. The first die may be a semiconductor substrate, while the second die may be a magnetic substrate, and the first die may be stacked on the second die, in one embodiment. Other embodiments are described and claimed.
摘要:
A microelectronic assembly is provided, having thermoelectric elements formed on a die so as to pump heat away from the die when current flows through the thermoelectric elements. In one embodiment, the thermoelectric elements are integrated between conductive interconnection elements on an active side of the die. In another embodiment, the thermoelectric elements are on a backside of the die and electrically connected to a carrier substrate on a front side of the die. In a further embodiment, the thermoelectric elements are formed on a secondary substrate and transferred to the die.