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192 条记录 (耗时 0.015 秒)

    Bi-directional, single material thermal actuator
    62.
    发明授权
    Bi-directional, single material thermal actuator 有权
    双向单材料热传动器

    公开(公告)号：US06608714B2

    公开(公告)日：2003-08-19

    申请号：US09892616

    申请日：2001-06-28

    申请人： Heather Shannon Hanson ,  Joseph Nathan Mitchell

    发明人： Heather Shannon Hanson ,  Joseph Nathan Mitchell

    IPC分类号： G02B2600

    CPC分类号： B81B3/0024 ,  B81B2201/031 ,  B81B2201/11 ,  B81B2203/055 ,  H01H2061/008

    摘要： A thermal actuator includes a first arm having a proximal end and a distal end, a second arm, parallel to the first arm, having a proximal end and a distal end, and a third arm arranged between and parallel to the first and second arms, the third arm having a proximal end and a distal end. The third arm has at least one portion at the distal end of the third arm having a width that is substantially larger than a width of the first arm and a width of the second arm. The distal ends of the first, second and third arms are coupled together to form a distal end of the thermal actuator, and the first, second and third arms preferably are made of a single material. A number of thermal actuators can be arranged in an array. The thermal actuator or array of thermal actuators can be coupled to an applicator.

    摘要翻译： 热致动器包括具有近端和远端的第一臂，平行于第一臂的第二臂，具有近端和远端，以及布置在第一臂和第二臂之间并平行于第一臂的第三臂， 第三臂具有近端和远端。 第三臂具有在第三臂的远端处的至少一个部分，其宽度基本上大于第一臂的宽度和第二臂的宽度。 第一，第二和第三臂的远端联接在一起以形成热致动器的远端，并且第一，第二和第三臂优选地由单一材料制成。 许多热致动器可以排列成阵列。 热致动器或热致动器阵列可以耦合到施加器。

    Direct acting vertical thermal actuator with controlled bending
    63.
    发明申请
    Direct acting vertical thermal actuator with controlled bending 审中-公开
    具有受控弯曲的直接作用垂直热致动器

    公开(公告)号：US20030137389A1

    公开(公告)日：2003-07-24

    申请号：US10313621

    申请日：2002-12-09

    申请人： 3M Innovative Properties Company

    发明人： Billy L. Weaver ,  Douglas P. Goetz ,  Kathy L. Hagen ,  Mike E. Hamerly ,  Robert G. Smith ,  Silva K. Theiss

    IPC分类号： H01H061/00

    CPC分类号： B81B3/0024 ,  B81B3/0037 ,  B81B2201/031 ,  B81B2201/045 ,  B81B2203/0109 ,  B81B2203/0118 ,  B81B2203/058 ,  B82Y15/00 ,  H01H2061/006 ,  H01H2061/008

    摘要： A micrometer sized, single-stage, vertical thermal actuator with controlled bending capable of repeatable and rapid movement of a micrometer-sized optical device off the surface of a substrate. The vertical thermal actuator is constructed on a surface of a substrate. At least one hot arm has a first end anchored to the surface and a free end located above the surface. A cold arm has a first end anchored to the surface and a free end. The cold arm is located above the hot arm relative to the surface. The cold arm is adapted to provide controlled bending near the first end thereof. A member mechanically and electrically couples the free ends of the hot and cold arms such that the actuator bends generally at the flexure so that the member moves away from the substrate when current is applied to at least the hot arm.

    摘要翻译： 具有受控弯曲的微米尺寸的单级垂直热致动器，其能够将微米尺寸的光学器件重复并快速移动离开衬底的表面。 垂直热致动器构造在基板的表面上。 至少一个热臂具有锚固在表面上的第一端和位于表面上方的自由端。 冷臂具有锚固在表面上的第一端和自由端。 冷臂相对于表面位于热臂上方。 冷臂适于在其第一端附近提供受控的弯曲。 机构和电气耦合热臂和冷臂的自由端，使得致动器大体上弯曲弯曲，使得当电流施加到至少热臂时，构件移动离开衬底。

    Trilayered beam MEMS device and related methods
    64.
    发明申请
    Trilayered beam MEMS device and related methods 有权
    三层梁MEMS器件及相关方法

    公开(公告)号：US20030119221A1

    公开(公告)日：2003-06-26

    申请号：US10290920

    申请日：2002-11-08

    申请人： Coventor, Inc.

    发明人： Shawn Jay Cunningham ,  Svetlana Tatic-Lucic

    IPC分类号： H01L021/00 ,  H01L029/82

    CPC分类号： B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

    摘要： Trilayered Beam MEMS Device and Related Methods. According to one embodiment, a method for fabricating a trilayered beam is provided. The method can include depositing a sacrificial layer on a substrate and depositing a first conductive layer on the sacrificial layer. The method can also include forming a first conductive microstructure by removing a portion of the first conductive layer. Furthermore, the method can include depositing a structural layer on the first conductive microstructure, the sacrificial layer, and the substrate and forming a via through the structural layer to the first conductive microstructure. Still furthermore, the method can include the following: depositing a second conductive layer on the structural layer and in the via; forming a second conductive microstructure by removing a portion of the second conductive layer, wherein the second conductive microstructure electrically communicates with the first conductive microstructure through the via; and removing a sufficient amount of the sacrificial layer so as to separate the first conductive microstructure from the substrate, wherein the structural layer is supported by the substrate at a first end and is freely suspended above the substrate at an opposing second end.

    摘要翻译： 三层梁MEMS器件及相关方法。 根据一个实施例，提供一种制造三层梁的方法。 该方法可以包括在衬底上沉积牺牲层并在牺牲层上沉积第一导电层。 该方法还可以包括通过去除第一导电层的一部分来形成第一导电微结构。 此外，该方法可以包括在第一导电微结构，牺牲层和衬底上沉积结构层，并且通过结构层将通孔形成到第一导电微结构。 此外，该方法可以包括以下：在结构层和通孔中沉积第二导电层; 通过去除所述第二导电层的一部分来形成第二导电微结构，其中所述第二导电微结构通过所述通孔与所述第一导电微结构电连通; 以及去除足够量的牺牲层以便将第一导电微结构与衬底分开，其中结构层在第一端由衬底支撑并且在相对的第二端处自由地悬挂在衬底上方。

    Microelectromechanical systems including thermally actuated beams on heaters that move with the thermally actuated beams
    67.
    发明授权
    Microelectromechanical systems including thermally actuated beams on heaters that move with the thermally actuated beams 失效
    微机电系统包括加热器上的热致动梁，其与热致动梁一起移动

    公开(公告)号：US06333583B1

    公开(公告)日：2001-12-25

    申请号：US09537588

    申请日：2000-03-28

    申请人： Ramaswamy Mahadevan ,  Edward A. Hill ,  Robert L. Wood ,  Allen Cowen

    发明人： Ramaswamy Mahadevan ,  Edward A. Hill ,  Robert L. Wood ,  Allen Cowen

    IPC分类号： H01N1000

    CPC分类号： B81B3/0024 ,  B81B2201/031 ,  B81B2203/0109 ,  B81B2203/051 ,  F03G7/06 ,  H01H1/0036 ,  H01H61/02 ,  H01H2001/0068 ,  H01H2061/006

    摘要： Improved microelectromechanical structures include spaced-apart supports on a microelectronic substrate and a beam that extends between the spaced-apart supports and that expands upon application of heat thereto to thereby cause displacement of the beam between the spaced-apart supports. A heater, located on the beam, applies heat to the beam and displaces with the beam as the beam displaces. Therefore, heat can be directly applied to the arched beam, thereby reducing thermal loss between the heater and the arched beam. Furthermore, an air gap between the heater and arched beam may not need to be heated, thereby allowing improved transient thermal response. Moreover, displacing the heater as the arched beam displaces may further reduce thermal loss and transient thermal response by reducing the separation between the heater and the arched beam as the arched beam displaces.

    摘要翻译： 改进的微机电结构包括微电子衬底上的间隔开的支撑件和在间隔开的支撑件之间延伸的梁，并且在施加热量时膨胀，从而导致梁在间隔开的支撑件之间的位移。 位于梁上的加热器对梁施加热量，并随着梁的移位而与梁一起移位。 因此，可以将热量直接施加到拱形梁上，从而减少加热器与拱形梁之间的热损失。 此外，加热器和拱形梁之间的空气间隙可能不需要被加热，从而允许改善的瞬态热响应。 此外，当拱形梁移位时移动加热器可以通过当拱形梁移位时减小加热器和拱形梁之间的间隔来进一步减少热损失和瞬态热响应。