Abstract:
High frequency noise is decoupled from a bus conductor which supplies power to an integrated circuit by providing a metalized ceramic chip either on top of an integrated circuit or on the back side of a circuit board in direct alignment with an integrated circuit. The ceramic chip is provided with a pair of rectangular leads, connected to respective of the metalized opposite surfaces thereof, which are respectively connected to the power supply leads of the integrated circuit.
Abstract:
A double-sided flexible electronic circuit module is provided having a flexible printed circuit board. The flexible circuit board has a plurality of conductive paths on each surface and a plurality of conductively plated-through apertures being connected to the conductive paths. One side of the flexible circuit board is adapted to carry components with leads; the other side of the flexible circuit board is adapted to receive components without leads. A carrier member, larger than the flexible circuit board and of a size and shape sufficient to accommodate the placement of at least one flexible circuit board, is also provided. The carrier member has a plurality of apertures which are in alignment with the apertures of the flexible circuit board, and a plurality of elongated slots in predetermined positions which extend the entire width of the flexible circuit board which is temporarily affixed onto the carrier member. All of the components are soldered to the flexible circuit board, the carrier member acting as a support member to the components having leads.
Abstract:
Finished electrical components having wire lead terminals are converted to elements having planar terminations by placing end caps or shoes over the ends of an existing component. A finished film capacitor having radial wire leads that is presently on a distributor's shelf, ready for shipment, may be converted to a capacitor for solder reforming by the use of these conversion caps. The capacitor may then be secured in a planar fashion to a substrate.
Abstract:
Electrical components (10 or 30) are fastened to a mounting surface (16) of a printed circuit board (11) by forming a plurality of thermoplastic pins (20, 35) projecting from the mounting surface of the board adjacent to positions where components are to be located. The component is placed on the board so that portions of the component are located adjacent to portions of the pins, following which portions of the pins are heated and formed about portions of the component to form plastic locking sections (22 or 37) that fasten the component to the board in a desired position. The mounting surface (16) of the board may be formed with a pocket (18 or 33) that receives and positions the component at the desired location, so that component leads (17 or 32) extend along the mounting surface to positions overlapping lead-contact areas (14, 34) of printed contact patterns deposited on the mounting surface, after which the leads are attached to the contact areas, as by reflow soldering.
Abstract:
This invention relates to an arrangement for attaching discrete electrical components to a generally flat layer of sheet material. Both mechanical and electrical connections are provided by the attachment elements of the present invention. One form of the invention is directed to a membrane switch keyboard wherein one of the layers of the membrane switch has a tail extending therefrom. The tail has a free end which is adhesively secured to some portion of the keyboard. Conductive traces are formed on the tail and extend to the free end where they contact the leads of an electrical component. The component is held between the tail and the keyboard. In another aspect, which may be applied to the membrane switch keyboard just described, the invention includes a sheet material having two or more slits cut therein for each of the component's leads. The slits are cut in a portion of the sheet having conductive traces formed thereon. The leads of the component are then interlaced through the tabs created by the slits to both mechanically and electrically connect the component to the sheet.
Abstract:
Two terminals are disposed on the body of an electrical component such that each terminal is adapted to be in contact with an exclusive one of a pair of circuit interconnection terminals whenever the body is oriented in a first direction with respect to the two interconnection terminals. One of the two component terminals is further adapted to be in contact with both circuit interconnection terminals whenever the body is oriented in a second direction with respect to the two interconnection terminals. As such, in the first direction the component is electrically operable in the associated circuit, and in the second direction the component is bypassed.
Abstract:
A method of fabricating a folded printed wiring board assembly includes the steps of cutting an aperture into a rigid board; bonding a flexible circuit tape to one side of the board so that the tape bridges the aperture; perforating a plurality of holes through the board and flexible tape; inserting leads of electrical components through the holes; conductively bonding the leads to conductors on the flexible circuit tape; cutting two edges of the board through the aperture; and folding the assembly in the area of the aperture.
Abstract:
The lead configuration of an electrical component is such that one of the leads locks into position in an aperture of a wiring board when the unit is inserted therein with nominal pressure. This configuration allows the unit to slide only so far into the aperture before it locks in place, thereby prohibiting the unit from being inserted any further, or from falling out of position if the board were inverted. These units remain locked in an upright position on the wiring board for the purpose of being further secured thereon, as by wave soldering.