Abstract:
A super-resolution optical recording medium includes a reflective layer formed on a substrate, a recording layer for recording information thereon, a super-resolution layer made of a chalcogenide semiconductor material, and a first and a second dielectric layers laminated on upper and lower surfaces of the super-resolution layer. The recording layer is made of a material that has a decomposition temperature higher than an information reproduction temperature and does not form bubble recording marks during recording, and the super-resolution layer contains one or more elements selected from the group consisting of nitrogen, oxygen, carbon, and boron.
Abstract:
In a multilayer structure and a method of forming the same, a conductive layer including a metal nitride and a dielectric layer positioned on a surface of the conductive layer and having a high dielectric constant. The metal nitride comprises one of niobium, vanadium and compositions thereof. Thus, the EOT and leakage current of the multilayer structure may be sufficiently improved.
Abstract:
A semiconductor memory device includes a first conductive line on a semiconductor substrate, an interlayer insulating layer on the first conductive line, a second conductive line on the interlayer insulating layer, and a memory cell in an hole through the interlayer insulating layer wherein the first and second conductive lines cross, the memory cell including a discrete resistive memory material region disposed in the hole and electrically connected between the first and second conductive lines. The resistive memory material region may be substantially contained within the hole. In some embodiments, contact between the resistive memory material region and the interlayer insulating layer is substantially limited to sidewalls of the interlayer insulating layer in the hole.
Abstract:
A vacuum type pickup apparatus may include an absorption pad having an absorption inlet for contacting and/or picking up an object. A pad holder may be connected to the absorption pad. The pad holder may also have a vacuum line. A separator may be provided in the pad holder for forcibly releasing the object from the absorption inlet of the absorption pad. During the forcible release of the object, the air around the absorption pad may be drawn into the pad holder, thus reducing or preventing the potential contamination by impurities of the object as well as the equipment around the object. Also, an additional vacuum extinguisher may not be required, thus simplifying the structure of the vacuum type pickup apparatus and reducing installation costs. Furthermore, the object may be picked up and released in a relatively expedient, safe, and accurate manner, despite the suction force of the vacuum that may be maintained in the pad holder.
Abstract:
In a method of forming a wiring having a carbon nanotube, a lower wiring is formed on a substrate, and a catalyst layer is formed on the lower wiring. An insulating interlayer is formed on the substrate to cover the catalyst layer, and an opening is formed through the insulating interlayer to expose an upper face of the catalyst layer. A carbon nanotube wiring is formed in the opening, and an upper wiring is formed on the carbon nanotube wiring and the insulating interlayer to be electrically connected to the carbon nanotube wiring. A thermal stress is generated between the carbon nanotube wiring and the upper wiring to produce a dielectric breakdown of a native oxide layer formed on a surface of the carbon nanotube wiring. A wiring having a reduced electrical resistance between the carbon nanotube wiring and the upper wiring may be obtained.
Abstract:
The present invention relates to a backlight assembly and a liquid crystal display (“LCD”) having the same. The backlight assembly includes a light source unit including a printed circuit board (“PCB”) and a plurality of light emitting diodes (“LEDs”) mounted on a side of the PCB, a receiving member including a base plate and a plurality of walls that extend from the base plate at an angle and receive the light source unit, and a plurality of through holes or uneven patterns formed in a region of the receiving member where at least the light source unit is disposed.
Abstract:
A data line layout includes column selection lines arranged in a first direction at a layer on a memory cell array region, and data lines arranged in the first direction at the layer, the data lines being connected between I/O sense amplifiers and I/O pads.
Abstract:
There is provided a multilayer type test board assembly for high-precision inspection. The multilayer test board assembly comprises: a plurality of test boards separated from each other according to their functions, having input/output signal terminals, and including at least one test board each having a first section where first mounting devices sensitive to an influence of electrical signals are mounted and a second section where second mounting devices insensitive to an influence of electrical signals are mounted; spacers that arrange the test boards in parallel by spacing apart the test boards by predetermined intervals; connection cables connected to the input/output signal terminals of the test boards; and a signal shielding fence formed on each of the at least one test board so as to protect the first mounting devices from electrical signals generated by the second mounting devices.
Abstract:
A display device comprises: a display panel including a first insulating substrate and a second insulating substrate that is arranged so as to deviate from the first insulating substrate; and an intermediate frame, wherein the intermediate frame includes: side walls that are arranged so as to correspond to four side surface of the display panel; a mounting portion which protrudes from the side walls inward and on which the first insulating substrate is mounted; and a supporting protrusion that protrudes from the mounting portion to the second insulating substrate and is arranged below the second insulating substrate and on the side of the first insulating substrate.