公开(公告)号：US20100283140A1

公开(公告)日：2010-11-11

申请号：US12692699

申请日：2010-01-25

申请人： Kyung-man KIM ,  In-ku Kang

发明人： Kyung-man KIM ,  In-ku Kang

IPC分类号： H01L23/498 ,  H01L21/50

CPC分类号： H01L23/49811 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/4911 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06562 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599

摘要： A package on package includes a lower semiconductor package including a plurality of stacked semiconductor chips, a connection portion including an electrically-conductive lead having a height lower than that of an encapsulation member, and an upper semiconductor package connected to the connection portion of the lower semiconductor package via a solder ball in a fan-in structure.

摘要翻译： 封装在封装上的是包括多个层叠的半导体芯片的下部半导体封装，包括高度低于封装构件的导电引线的连接部分，以及连接到下部的连接部分的上部半导体封装 半导体封装通过焊球以扇形结构。

公开(公告)号：US07830239B2

公开(公告)日：2010-11-09

申请号：US11426451

申请日：2006-06-26

申请人： Hee-man Kim ,  Atsuhisa Ogawa

发明人： Hee-man Kim ,  Atsuhisa Ogawa

IPC分类号： H01C7/10

CPC分类号： H01C7/102 ,  H01C1/148 ,  H01C7/10 ,  H05K1/0254 ,  H05K1/181

摘要： A device to protect against a surge voltage includes a body having a hexahedron shape and filled with a varistor material, a pair of input signal electrodes attached to a first side surface of the body along upward and downward directions, a pair of output signal electrodes attached to a second side surface of the body that faces the first side surface of the body in the upward and downward directions, a ground electrode attached to an upper surface of the body, at least one pair of signal connection electrode plates to connect the input signal electrodes and the output signal electrodes, and a ground plate to be connected to the ground electrode. Thus, the device can protect an electronic circuit from a surge voltage and match an impedance of a transmission line.

摘要翻译： 用于防止浪涌电压的装置包括具有六面体形状并填充有非线性电阻材料的主体，一对输入信号电极沿着上下方向附接到主体的第一侧表面，一对输出信号电极被连接 到主体的面向上下方向的第一侧面的第二侧面，安装在主体的上表面的接地电极，至少一对信号连接电极板，用于将输入信号 电极和输出信号电极，以及与接地电极连接的接地板。 因此，该装置可以保护电子电路免受浪涌电压并匹配传输线的阻抗。

公开(公告)号：US20100244227A1

公开(公告)日：2010-09-30

申请号：US12656086

申请日：2010-01-15

申请人： Kyung-man Kim ,  In-ku Kang ,  Ji-hyun Lee

发明人： Kyung-man Kim ,  In-ku Kang ,  Ji-hyun Lee

IPC分类号： H01L25/16 ,  H01L23/538

CPC分类号： H01L23/49 ,  H01L23/3128 ,  H01L24/00 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/18 ,  H01L2224/05554 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/484 ,  H01L2224/4911 ,  H01L2224/4917 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

摘要： Provided are semiconductor packages and electronic systems including the same. A first memory chip may be stacked on a first portion of a substrate. A controller chip may be stacked on a second portion of the substrate, which is different from the first portion. At least one first bonding wire may directly connect the first memory chip with the controller chip. At least one second bonding wire may directly connect the first memory chip with the substrate, and may be electrically connected with the at least one first bonding wire.

摘要翻译： 提供半导体封装和包括其的电子系统。 第一存储器芯片可以堆叠在衬底的第一部分上。 控制器芯片可以堆叠在与第一部分不同的基板的第二部分上。 至少一个第一接合线可以将第一存储器芯片与控制器芯片直接连接。 至少一个第二接合线可以将第一存储器芯片与衬底直接连接，并且可以与至少一个第一接合线电连接。

公开(公告)号：US20100237485A1

公开(公告)日：2010-09-23

申请号：US12700884

申请日：2010-02-05

申请人： KYUNG-MAN KIM ,  In-sang Song

发明人： KYUNG-MAN KIM ,  In-sang Song

IPC分类号： H01L25/11 ,  H01L21/50

CPC分类号： H01L23/49575 ,  H01L23/49555 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/525 ,  H01L24/48 ,  H01L24/73 ,  H01L25/105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2225/06565 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device includes a first semiconductor package having at least one first semiconductor chip and a first sealing member covering the at least one first semiconductor chip, a second semiconductor package stacked on the first semiconductor package, the second semiconductor package having at least one second semiconductor chip, leads electrically connected to the at least one second semiconductor chip, and a second sealing member covering the at least one second semiconductor chip, and at least one signal connection member disposed in the first sealing member of the first semiconductor package, the at least one signal connection member electrically connecting the at least one first semiconductor chip with the leads of the at least one second semiconductor chip.

摘要翻译： 半导体器件包括具有至少一个第一半导体芯片和覆盖该至少一个第一半导体芯片的第一密封元件的第一半导体封装，堆叠在第一半导体封装上的第二半导体封装，该第二半导体封装具有至少一个第二半导体 芯片，电连接到所述至少一个第二半导体芯片的引线，以及覆盖所述至少一个第二半导体芯片的第二密封构件以及设置在所述第一半导体封装的所述第一密封构件中的至少一个信号连接构件， 一个信号连接构件将所述至少一个第一半导体芯片与所述至少一个第二半导体芯片的引线电连接。

公开(公告)号：US20100224977A1

公开(公告)日：2010-09-09

申请号：US12656294

申请日：2010-01-25

申请人： Kyung-Man Kim

发明人： Kyung-Man Kim

IPC分类号： H01L25/065 ,  H01L23/538

CPC分类号： H01L21/76898 ,  H01L25/0657 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05554 ,  H01L2224/0557 ,  H01L2224/05572 ,  H01L2224/13009 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2225/06513 ,  H01L2225/06527 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01078 ,  H01L2224/05552

摘要： Provided are a semiconductor device and a method for fabricating the same. The semiconductor device may include a substrate including a cell area and a scribe lane area defining the cell area, at least one pad on the cell area, at least one through electrode penetrating the substrate and electrically connected to the at least one pad, and at least one dummy through electrode penetrating the substrate and spaced apart from the at least one through electrode. The semiconductor device may further include at least one conductive pattern on the substrate electrically connecting the at least one through electrode to the at least one dummy through electrode.

摘要翻译： 提供一种半导体器件及其制造方法。 半导体器件可以包括衬底，其包括限定单元区域的单元区域和划线通道区域，单元区域中的至少一个焊盘，穿过基板的至少一个贯通电极，并电连接到该至少一个焊盘，并且在 至少一个虚拟穿透电极穿透基底并与至少一个贯通电极间隔开。 所述半导体器件还可以包括至少一个导电图案，所述至少一个导电图案在所述基板上电连接所述至少一个贯通电极与所述至少一个虚拟通孔电极。

公开(公告)号：US20100201704A1

公开(公告)日：2010-08-12

申请号：US12659829

申请日：2010-03-23

申请人： Mi-jung Jang ,  Kyeong-man Kim ,  Hyun-soo Oh

发明人： Mi-jung Jang ,  Kyeong-man Kim ,  Hyun-soo Oh

IPC分类号： G09G5/02

CPC分类号： G09G5/02 ,  G06T11/001 ,  G09G2320/0606 ,  G09G2320/0666

摘要： Disclosed are a color management method, an apparatus thereof and a color management computer program for executing the method that enable a user to conveniently and easily select and/or change colors desired by the user in diverse ways. The color management method includes displaying a color scheme list that is a list of color schemes for providing a standard for converting the colors that constitute an image, and if a selection manipulation of one among the color schemes that constitute the displayed color scheme list is input, storing the color scheme selected by the selection manipulation.

公开(公告)号：US20100199597A1

公开(公告)日：2010-08-12

申请号：US12670716

申请日：2008-07-29

申请人： Kwang Man Kim ,  Sang Mun Yun

发明人： Kwang Man Kim ,  Sang Mun Yun

IPC分类号： E04B1/04

CPC分类号： E04G11/22 ,  E04B1/3516 ,  E04G11/20

摘要： A method of forming multiple horizontal structural members is disclosed. The method includes building a vertical structural member by a sliding construction method, lifting a horizontal form frame unit using sliding construction equipment, installing a frame support structure under the horizontal form frame unit, casting concrete into the horizontal form frame unit to form a horizontal structural member, and simultaneously building the horizontal structural members to several stories.

摘要翻译： 公开了一种形成多个水平结构构件的方法。 该方法包括：通过滑动施工方法建立垂直结构构件，使用滑动施工设备提升水平框架单元，在水平框架单元下安装框架支撑结构，将混凝土浇注成水平框架单元以形成水平结构 成员，同时建设水平结构成员几个故事。

公开(公告)号：US20100196350A1

公开(公告)日：2010-08-05

申请号：US12438354

申请日：2007-08-23

申请人： Hyo Jeong Hong ,  Jung-Whoi Lee ,  Jin Man Kim ,  Yeon Sung Son ,  Eung Suck Lee

发明人： Hyo Jeong Hong ,  Jung-Whoi Lee ,  Jin Man Kim ,  Yeon Sung Son ,  Eung Suck Lee

IPC分类号： A61K39/395 ,  A61K31/7088 ,  A61P35/00 ,  G01N33/53

CPC分类号： C07K16/2803 ,  A61K2039/505 ,  C07K14/70503 ,  C07K2317/73 ,  C07K2317/76 ,  C12N15/1138 ,  C12N2310/14

摘要： Disclosed herein are a pharmaceutical composition for inhibiting the growth or metastasis of cholangiocarcinoiria, comprising a L1CAM activity inhibitor or expression suppressor and a treatment method using the composition. This is based on the finding that L1CAM is overexpressed on cholangiocarcinoma and plays an important role in the growth and metastasis of cholangiocarcinoma and the mortality of cholangiocarcinoma patients increases as the expression rate of L1CAM increases. Also, antibodies inhibitory of the activity of L1CAM, or siRNAs suppressing the expression of L1CAM, are found to reduce the growth and invasion of cholangiocarcinoma cells. Mouse monoclonal antibodies, recognizing the L1CAM protein on the cholangiocarcinoma cell surface and binding specifically to cholangiocarcinoma tissues, or siRNAs, antisense oligonucleotides or shRNAs, may be useful in the treatment of cholangiocarcinoma by inhibiting the growth, invasion and migration of cholangiocarcinoma cell.

摘要翻译： 本文公开了一种用于抑制胆管癌细胞生长或转移的药物组合物，其包含L1CAM活性抑制剂或表达抑制剂以及使用该组合物的治疗方法。 这是基于L1CAM在胆管癌上过表达的发现，并且在胆管癌的生长和转移中起重要作用，胆管癌患者的死亡率随着L1CAM的表达增加而升高。 此外，发现抑制L1CAM的活性的抗体或抑制L1CAM的表达的siRNA减少胆管癌细胞的生长和侵袭。 识别胆管癌细胞表面上的L1CAM蛋白并特异性结合胆管癌组织或siRNA，反义寡核苷酸或shRNA的小鼠单克隆抗体可用于通过抑制胆管癌细胞的生长，侵袭和迁移来治疗胆管癌。

公开(公告)号：US20100182619A1

公开(公告)日：2010-07-22

申请号：US12645943

申请日：2009-12-23

申请人： Se-eun KIM ,  Kyeong-man KIM ,  Hyun-soo OH

发明人： Se-eun KIM ,  Kyeong-man KIM ,  Hyun-soo OH

IPC分类号： G06F15/00 ,  G06K9/00

CPC分类号： H04N1/6072

摘要： A color compensation apparatus, a color compensation method, an image forming apparatus, and a computer readable recording medium are provided. The color compensation apparatus includes a color scheme analyzing unit to classify an input image into one or more objects and to compute average color values for each of the classified one or more objects, a storage unit to store a color table proposed for color compensation, and a color compensating unit to compensate the average color values computed for each of the classified one or more objects using colors of the stored color table which match the computed average color values.

摘要翻译： 提供了一种颜色补偿装置，颜色补偿方法，图像形成装置和计算机可读记录介质。 颜色补偿装置包括：颜色方案分析单元，用于将输入图像分类为一个或多个对象，并计算分类的一个或多个对象中的每一个的平均颜色值;存储单元，存储针对颜色补偿提出的颜色表;以及 颜色补偿单元，用于使用与所计算的平均颜色值匹配的所存储的颜色表的颜色来补偿针对分类的一个或多个对象中的每一个计算的平均颜色值。

公开(公告)号：US20100171121A1

公开(公告)日：2010-07-08

申请号：US12724843

申请日：2010-03-16

申请人： Sung-Man Kim ,  Young-Goo Song ,  Hyang-Shik Kong ,  Dong-Hyun Ki ,  Seong-Young Lee ,  Joo-Ae Yoon ,  Jong-Woong Chang

发明人： Sung-Man Kim ,  Young-Goo Song ,  Hyang-Shik Kong ,  Dong-Hyun Ki ,  Seong-Young Lee ,  Joo-Ae Yoon ,  Jong-Woong Chang

IPC分类号： H01L33/08 ,  H01L33/16

CPC分类号： H01L27/016 ,  G02F1/13458 ,  G02F1/136227 ,  H01L27/12 ,  H01L27/1244 ,  H01L27/1248 ,  H01L27/1288 ,  H01L27/3244 ,  H01L29/456 ,  H01L29/4908

摘要： A thin film array panel is provided, which includes: a plurality of signal lines including contact parts for contact with an external device; a plurality of thin film transistors connected to the signal lines; an insulating layer formed on the signal lines and the thin film transistors; and a plurality of pixel electrodes formed on the insulating layer and connected to the thin film transistors, wherein the insulating layer includes a contact portion disposed on the contact parts of the signal lines and having a thickness smaller than other portions and the contact portion of the insulating layer includes an inclined portion having an inclination angle smaller than about 45 degrees.

摘要翻译： 提供一种薄膜阵列面板，其包括：多条信号线，包括用于与外部装置接触的接触部分; 连接到信号线的多个薄膜晶体管; 形成在信号线和薄膜晶体管上的绝缘层; 以及形成在所述绝缘层上并连接到所述薄膜晶体管的多个像素电极，其中所述绝缘层包括设置在所述信号线的接触部分上并具有小于其它部分的厚度的接触部分，并且所述接触部分 绝缘层包括具有小于约45度的倾斜角度的倾斜部分。