公开(公告)号：US20240173752A1

公开(公告)日：2024-05-30

申请号：US18516821

申请日：2023-11-21

Applicant: SEMES CO., LTD.

Inventor： Junhee CHOI ,  Tae-keun KIM ,  Kang Sul KIM ,  Kyeong Min LEE ,  Yong Jun KIM

IPC: B08B3/08 ,  B08B3/02 ,  B08B3/12 ,  B08B5/02 ,  B08B13/00 ,  H01L21/02 ,  H01L21/67

CPC classification number: B08B3/08 ,  B08B3/02 ,  B08B3/12 ,  B08B5/02 ,  B08B13/00 ,  H01L21/02057 ,  H01L21/67051 ,  B08B2203/02

Abstract: Disclosed are a substrate processing apparatus and a substrate processing method that allow a chemical liquid to penetrate deeply into a gap between patterns of a substrate. The substrate processing apparatus includes a chamber having a processing space defined therein in which a substrate is processed; a chuck installed in the processing space and configured to support the substrate thereon; a chemical liquid supply formed on top of the chuck and configured to supply a chemical liquid droplet toward an upper surface of the substrate supported on the chuck; and a pressurizer formed on top of the chuck and configured to pressurize the chemical liquid droplet supplied on the upper surface of the substrate so that the pressed chemical liquid droplet fills a gap between patterns formed on the substrate.

公开(公告)号：US20240170305A1

公开(公告)日：2024-05-23

申请号：US18425816

申请日：2024-01-29

Applicant: SEMES CO., LTD.

Inventor： Jin Woo JUNG ,  Do Hyeon YOON ,  Yong Hee LEE

IPC: H01L21/67 ,  H01L21/02 ,  H01L21/677

CPC classification number: H01L21/67028 ,  H01L21/02101 ,  H01L21/67103 ,  H01L21/67248 ,  H01L21/67739

Abstract: A substrate processing apparatus includes a substrate cleaning unit cleaning a substrate, a substrate drying unit drying the substrate, and a transfer robot transferring the substrate between the substrate cleaning unit and the substrate drying unit. The substrate drying unit includes a substrate processing container having a substrate processing space accommodating the substrate, and the transfer robot includes a surface temperature measurement sensor measuring a surface temperature of the substrate processing container.

公开(公告)号：US20240160486A1

公开(公告)日：2024-05-16

申请号：US18380656

申请日：2023-10-17

Applicant: SEMES CO., LTD.

Inventor： Sang Hyun SON ,  Yeon Chul Song ,  Myeong Jun Lim ,  Ji Hoon Yoo ,  Kwang Sup Kim ,  Jong Min Lee ,  Young Ho Park ,  Jun Ho Oh ,  Joong Chol Shin ,  Hyun Cheol Cho

IPC: G06F9/50

CPC classification number: G06F9/5038 ,  G06F9/5072 ,  G06F2209/503 ,  G06F2209/505

Abstract: A computing resource management system using software modularization in a cluster computing environment in which computing devices are connected, including an application process running on each computing device and an algorithm processing process configured to run independently of the application process and perform task processing on the application process, the computing resource management system including: a task managing system configured to receive a task request message from an application process requiring a task from each computing device; a process managing system configured to confirm an algorithm processing process of computing devices connected to the cluster computing environment, and determine whether there is an algorithm processing process in an idle state to which the application process requested for a task will be assigned; and a performed managing system configured to confirm a result of an application process whose task is performed by the algorithm processing process.

公开(公告)号：US20240160214A1

公开(公告)日：2024-05-16

申请号：US18472877

申请日：2023-09-22

Applicant: SEMES CO., LTD.

Inventor： Jungwoo KIM ,  Jongwon JUNG ,  Seungju LEE

IPC: G05D1/02

CPC classification number: G05D1/0274 ,  G05D1/0214 ,  G05D1/024 ,  G05D1/0248 ,  G05D1/0287 ,  G05D2201/0216

Abstract: An autonomous driving device includes a plurality of vehicles configured to travel on the ceiling of a manufacturing line in which manufacturing equipment is arranged, a traveling rail arranged along the ceiling of the manufacturing line to provide a movement path for each of the plurality of vehicles, a measurement module mounted on each of the plurality of vehicles and including a LiDAR sensor and a 3-dimensional sensor, and a map generating module configured to receive information from the measurement module, wherein the map generating module is further configured to generate a 3-dimensional map that 3-dimensionally represents the manufacturing line.

公开(公告)号：US20240160119A1

公开(公告)日：2024-05-16

申请号：US18139381

申请日：2023-04-26

Applicant: SEMES CO., LTD.

Inventor： Nam Ki HONG ,  Ick Kyun KIM ,  Jae Wook LEE ,  Seung Kyu PARK ,  Tae Won YUN ,  Si Hwan YANG

IPC: G03F7/20 ,  B05B1/16 ,  B05B1/30 ,  B05B15/55 ,  H01L21/67

CPC classification number: G03F7/70925 ,  B05B1/16 ,  B05B1/30 ,  B05B15/55 ,  G03F7/70808 ,  H01L21/67051

Abstract: A home port for a semiconductor manufacturing nozzle head includes a body having a discharge space configured to receive treatment liquid discharged from a plurality of nozzles, discharge flow passages connected to be in communication with the discharge space and penetrating through the body so as to face the plurality of nozzles, and a cleaning liquid distribution system, which is formed to penetrate through the body, and is connected to transfer a cleaning liquid to the discharge flow passages. The cleaning liquid distribution system includes supply flow passages connected to supply the cleaning liquid to the discharge flow passages, and a lead-in passage connected to and which joins the supply flow passages, and connected to receive the cleaning liquid injected from the outside.

公开(公告)号：US20240157391A1

公开(公告)日：2024-05-16

申请号：US18382525

申请日：2023-10-22

Applicant: SEMES CO., LTD.

Inventor： Sung Jin BANG ,  Chang Suk OH

IPC: B05C5/02

CPC classification number: B05C5/027 ,  B05C5/0208

Abstract: Proposed is a substrate treating apparatus. The substrate treating apparatus includes a treating container having a treating space therein, a support unit supporting and rotate a substrate in the treating space, and a liquid supply unit supplying a treating liquid onto the substrate, wherein the liquid supply unit may include a nozzle member and an actuator for moving the nozzle member, wherein the nozzle member may include nozzles arranged along a first direction so that the nozzles form a first row and nozzles coupled to the body and arranged along the first direction so that the nozzles form a second row, wherein the first row and the second row may be spaced apart from each other in a second direction perpendicular to the first direction when viewed from above. At this time, the nozzles constituting the nozzle member may be observed as a whole from the front.

公开(公告)号：US20240153831A1

公开(公告)日：2024-05-09

申请号：US18382042

申请日：2023-10-19

Applicant: SEMES CO., LTD.

Inventor： Yong Jun SEO ,  Su Jin CHAE ,  Sang Hyun SON ,  Sang Min HA ,  Young Sik BANG ,  Jeong Mo HWANG ,  Dong Ok AHN

IPC: H01L21/66 ,  G01F1/684 ,  G01F1/688 ,  G01F1/696

CPC classification number: H01L22/34 ,  G01F1/6845 ,  G01F1/6888 ,  G01F1/6965

Abstract: An apparatus and method for measuring air currents on the surface of a substrate, which can accurately measure the magnitude and direction of air currents on the surface of a wafer with wafer-type air current measurement sensors, are provided. The apparatus includes: a first air current measurement module measuring a magnitude of air currents on a surface of a first substrate, which is processed in accordance with a semiconductor manufacturing process; a second air current measurement module measuring a movement direction of the air currents; and a power module supplying power to the first and second air current measurement modules, wherein the first air current measurement module, the second air current measurement module, and the power module are mounted on a second substrate, which has the same shape as the first substrate.

公开(公告)号：US20240149308A1

公开(公告)日：2024-05-09

申请号：US18487554

申请日：2023-10-16

Applicant: SEMES CO., LTD.

Inventor： Seungtae YANG ,  Sangwoo PARK ,  Youngjoon HAN ,  Seonghyeon KIM ,  Gi Hun CHOI

IPC: B08B3/02 ,  B05C5/02 ,  B05C11/10 ,  B08B3/08

CPC classification number: B08B3/022 ,  B05C5/0225 ,  B05C11/1013 ,  B08B3/08 ,  H01L21/67051

Abstract: Provided is a liquid chemical supply module and a substrate processing apparatus including the same, the liquid chemical supply module including a main supplier for supplying a liquid chemical from a liquid chemical tank to at least one substrate processing apparatus, and at least one distribution supplier for connecting between the main supplier and any one substrate processing apparatus to distribute the liquid chemical supplied through the main supplier to the any one substrate processing apparatus, wherein the distribution supplier includes a distribution line branched from a main line of the main supplier, a first circulation line branched from the distribution line and connecting between the distribution line and the main line, and a second circulation line branched from the distribution line connecting between the distribution line and the main line.

公开(公告)号：US20240145263A1

公开(公告)日：2024-05-02

申请号：US18099856

申请日：2023-01-20

Applicant: SEMES CO., LTD.

Inventor： Seung Hoon OH ,  Ki Bong KIM ,  Jong Doo LEE ,  Young Hun LEE ,  Mi So PARK ,  Jin Se PARK ,  Yong Sun KO

IPC: H01L21/67

CPC classification number: H01L21/67034

Abstract: According to an aspect of the present disclosure, there is provided a substrate treating apparatus comprising: a vessel part having a substrate treatment region formed therein and including a supply port through which a treating fluid is supplied to the substrate treatment region and an exhaust port through which the treating fluid is exhausted from the substrate treatment region; a fluid supply unit configured to supply the treating fluid to the substrate treatment region; an exhaust unit configured to exhaust the treating fluid from the vessel part. The exhaust unit comprises: a main line connected to the exhaust port; an extension line branched from at least one of first and second nodes of the main line and including at least one of a first orifice or a first check valve to control an exhaust speed; and an auxiliary line branched from a third node of the main line, where an orifice and a check valve are not formed. During a first process time, the treating fluid is discharged through the extension line, and the treating fluid is not discharged through the auxiliary line, and during a second process time, the treating fluid is discharged through the auxiliary line.

公开(公告)号：US20240136157A1

公开(公告)日：2024-04-25

申请号：US18381151

申请日：2023-10-16

Applicant: SEMES CO., LTD.

Inventor： Je Ho KIM ,  Tae Suk JUNG

IPC: H01J37/32 ,  H01L21/67 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01J37/32633 ,  H01J37/3244 ,  H01L21/67069 ,  H01L21/67103 ,  H01L21/6833 ,  H01L21/68742 ,  H01J2237/334

Abstract: Proposed is a substrate processing apparatus, including a housing configured to provide a processing space therein, a substrate support unit configured to support a substrate within the processing space, and a baffle unit provided to surround a circumference of the substrate support unit. The baffle unit includes a baffle plate provided to surround the circumference of the substrate support unit and having at least one slit therein, and a drive member that lifts and moves the baffle plate, and the housing is provided in a shape capable of changing a size of a space between the processing space and the baffle plate according to a lifting movement of the baffle plate.