公开(公告)号：US06974358B2

公开(公告)日：2005-12-13

申请号：US10462275

申请日：2003-06-16

申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Rao V. Vallabhaneni

IPC分类号： H01F1/09 ,  H01F41/02 ,  H01J1/62 ,  H01J29/64 ,  H01J29/68

CPC分类号： H01J29/68

摘要： The present invention relates generally to a new dielectric forming metal/ceramic laminate magnet and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area laminate magnet with a significant number of holes, integrated dielectric forming metal plate(s) and electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display and electron beam source and methods of manufacture thereof.

摘要翻译： 本发明一般涉及一种新的电介质形成金属/陶瓷层叠磁体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积层压磁体，用于电子和电子束控制的集成电介质形成金属板和电极的新方法。 本发明还涉及磁矩阵显示器和电子束源及其制造方法。

公开(公告)号：US06955777B2

公开(公告)日：2005-10-18

申请号：US10338093

申请日：2003-01-07

申请人： Govindarajan Natarajan ,  Umar Ahmad ,  Raschid J. Bezama ,  James N. Humenik ,  John U. Knickerbocker ,  Rao V. Vallabhaneni

发明人： Govindarajan Natarajan ,  Umar Ahmad ,  Raschid J. Bezama ,  James N. Humenik ,  John U. Knickerbocker ,  Rao V. Vallabhaneni

IPC分类号： B01L3/00 ,  B29C65/00 ,  B32B18/00 ,  C03B29/00 ,  C04B33/34 ,  C04B37/00

CPC分类号： B32B18/00 ,  B01J2219/00286 ,  B01J2219/00317 ,  B01L3/502707 ,  B01L3/5085 ,  B01L2200/12 ,  B01L2300/0816 ,  B01L2300/0819 ,  B01L2300/0887 ,  B01L2300/12 ,  B81B2203/0338 ,  B81B2203/0353 ,  B81C1/00119 ,  C04B35/645 ,  C04B2235/6567 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/62 ,  C04B2237/704

摘要： A plate for use in mixing and testing materials in the pharmaceutical industry is formed by a method in which apertures in a set of greensheets are formed by a material removal process, at least some of the apertures being filled with a fugitive material that escapes during sintering.

摘要翻译： 在制药工业中用于混合和测试材料的板材是通过一种方法形成的，其中通过材料去除工艺形成一组绿叶片中的孔，至少一些孔被填充有在烧结过程中逸出的逃逸材料 。

公开(公告)号：US20050214508A1

公开(公告)日：2005-09-29

申请号：US11137957

申请日：2005-05-26

申请人： Govindarajan Natarajan

发明人： Govindarajan Natarajan

IPC分类号： H01L21/48 ,  H05K1/03 ,  H05K3/00 ,  B32B3/10

CPC分类号： H01L21/481 ,  H01L21/486 ,  H05K1/0306 ,  H05K3/005 ,  H05K2201/2018 ,  H05K2203/0156 ,  Y10T83/0481 ,  Y10T156/1056 ,  Y10T156/1057 ,  Y10T156/1062 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24347

摘要： Methods for forming and the intermediate greensheet products formed are provided by attaching a removable support film to a first surface of a greensheet and a frame to a second surface of the greensheet. The support film is preferably a peelable support film cast to the first surface of the greensheet for providing strength thereto. A plurality of openings are formed in the greensheet by punching into the support film, through the support film and then through the greensheet. During this process, the support film provides added strength to the greensheet therein significantly reducing embossing and deformation of such greensheet. A second support film may be attached to the removable support film using an adhesive layer, which, is extruded into the openings upon attachment. The support film(s) may be peeled off the greensheet with little or no impact on via locations as a metal frame continues to support the greensheet.

公开(公告)号：US06790515B2

公开(公告)日：2004-09-14

申请号：US10411906

申请日：2003-04-11

申请人： John U. Knickerbocker ,  Govindarajan Natarajan

发明人： John U. Knickerbocker ,  Govindarajan Natarajan

IPC分类号： B32B300

CPC分类号： B32B18/00 ,  B32B37/22 ,  B32B38/04 ,  B32B2038/042 ,  B32B2305/38 ,  B32B2305/77 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/38 ,  C04B2237/50 ,  C04B2237/56 ,  C04B2237/561 ,  C04B2237/567 ,  C04B2237/62 ,  C04B2237/66 ,  C04B2237/68 ,  C04B2237/702 ,  C04B2237/704 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/00 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/0169 ,  Y10T156/1052 ,  Y10T156/1057 ,  Y10T156/108 ,  Y10T428/161 ,  Y10T428/23 ,  Y10T428/24793 ,  Y10T428/24926

摘要： A method of processing greensheets for use as microelectronic substrates comprises providing a greensheet having a width, a length and a thickness, bonding to the greensheet, within the greensheet width and length, a frame adapted to constrain movement of the greensheet within the frame, processing the greensheet and bonded frame, and removing the frame from the processed greensheet. The processing of the greensheet and bonded frame may include punching vias in the greensheet, filling the vias in the greensheet with conductive material, patterning the greensheet by applying conductive paste to the vias and greensheet surface, stacking the patterned greensheet and bonded frame with at least one other patterned greensheet and bonded frame, and laminating the greensheets. The frame is preferably removed from the processed greensheet after laminating the greensheets, and before the laminated greensheets are subsequently sintered. The bonding of the frame to the greensheet may be by lamination or by an adhesive, or by other means. Preferably, the frame has a thickness less than the greensheet thickness. The frame preferably has a plurality of members subdividing the greensheet into a plurality of areas, with each area being completely surrounded by frame members. The frame may be applied to one side of the greensheet, and pressed into the greensheet side such that the frame and greensheet side are substantially coplanar.

摘要翻译： 处理用作微电子基板的纸屑的方法包括在毛坯宽度和长度内提供具有宽度，长度和厚度粘合到毛坯上的毛坯，适于限制毛坯在框架内的移动的框架，加工 毛坯和粘合框架，并从加工的毛坯上移除框架。 毛坯和粘合框架的加工可以包括毛坯中的穿孔，用导电材料填充毛坯中的通孔，通过将导电浆涂布到通孔和毛坯表面来图案化毛坯，至少堆叠图案化的毛坯和粘合的框架 一个其他图案化的毛坯和粘合框架，并且层压绿叶片。 在层压毛坯之后，并且在随后烧结层压的刮板之前，优选地将骨架从加工的毛坯板上去除。 框架与毛坯的接合可以通过层压或通过粘合剂或其它方式进行。 优选地，框架具有小于毛坯厚度的厚度。 框架优选地具有将毛坯细分成多个区域的多个构件，每个区域被框架构件完全包围。 框架可以施加到毛坯的一侧，并且被压入毛坯一侧，使得框架和毛坯面基本上共面。

公开(公告)号：US06607780B1

公开(公告)日：2003-08-19

申请号：US09578580

申请日：2000-05-25

申请人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Robert W. Pasco

发明人： Govindarajan Natarajan ,  John U. Knickerbocker ,  Robert W. Pasco

IPC分类号： B05D512

CPC分类号： H01L21/486 ,  H05K1/0306 ,  H05K3/4061 ,  H05K3/4614 ,  H05K3/4629 ,  H05K2201/09581 ,  H05K2203/0152 ,  H05K2203/0156 ,  Y10T29/49126 ,  Y10T156/1057 ,  Y10T428/24917 ,  Y10T428/24926

摘要： The present invention relates generally to a new ceramic structure and process thereof. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-layer ceramic products using very thin green sheets and/or green sheets with very dense electrically conductive patterns on top of a stronger support sheet. The structure and method of the present invention enables the screening, stacking and handling of very thin green sheets and/or green sheets with very dense metallized patterns in the manufacture of multi-layer ceramic packages. The thin green sheets were tacked/bonded to thicker and stronger support sheets to form a sub-structure which had excellent stability in screening and enabled further processing. The sheets are anchored or pinned in such a way as to allow the processing of the green sheet with the subsequent easy removal of the support sheet.

摘要翻译： 本发明一般涉及一种新的陶瓷结构及其工艺。 基本上，本发明涉及一种用于形成层压结构的结构和方法，更具体地涉及一种使用非常薄的生坯片和/或具有非常致密导电图案的生片在多层陶瓷产品的顶部制造多层陶瓷产品的结构和方法 更强的支撑板。 本发明的结构和方法能够在制造多层陶瓷封装中筛选，堆叠和处理具有非常密集金属化图案的非常薄的生片和/或生片。 薄的生片被粘合到较厚和更坚固的支撑片上以形成在筛选中具有优异稳定性并能够进一步加工的亚结构。 这些片材以这样的方式锚定或固定，以便随后可以容易地移除支撑片材来处理生片。

公开(公告)号：US06423174B1

公开(公告)日：2002-07-23

申请号：US08668291

申请日：1996-06-21

申请人： Jon A. Casey ,  Govindarajan Natarajan ,  Robert W. Pasco ,  Vincent P. Peterson

发明人： Jon A. Casey ,  Govindarajan Natarajan ,  Robert W. Pasco ,  Vincent P. Peterson

IPC分类号： B32B3120

CPC分类号： B32B18/00 ,  B32B37/0023 ,  B32B2038/042 ,  B32B2309/12 ,  B32B2315/02 ,  C04B35/10 ,  C04B35/581 ,  C04B35/6455 ,  C04B2235/658 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/62 ,  C04B2237/64 ,  H01L21/4807

摘要： The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavities in semiconductor substrates wherein a coated membrane sheet is placed over the cavity prior to lamination and caused to conform to the contour of the cavity, thus preventing collapse of, or damage to, the cavity shelves during the lamination process. After the lamination process, the coated membrane is conveniently removed without causing damage to the cavity shelves or paste pull-outs.

摘要翻译： 本发明一般涉及一种用于在半导体衬底中形成空腔的新装置和方法，而不需要使用插入件。 更具体地，本发明包括一种用于在半导体衬底中制造空腔的装置和方法，其中在层压之前将涂覆的膜片放置在空腔上方并使其符合空腔的轮廓，从而防止凹陷或损坏， 层压过程中的腔架。 在层压处理之后，方便地去除涂覆的膜，而不会损坏腔架或糊状物拉出。

公开(公告)号：US06413339B1

公开(公告)日：2002-07-02

申请号：US09470457

申请日：1999-12-22

申请人： Govindarajan Natarajan ,  Jon A. Casey ,  Martin E. Klepeis ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Robert A. Rita ,  Subhash L. Shinde

发明人： Govindarajan Natarajan ,  Jon A. Casey ,  Martin E. Klepeis ,  John U. Knickerbocker ,  Srinivasa S. N. Reddy ,  Robert A. Rita ,  Subhash L. Shinde

IPC分类号： B32B3116

CPC分类号： C04B35/2683 ,  C04B35/64 ,  H01F1/0027 ,  H01F41/0253 ,  Y10T156/1056 ,  Y10T156/1057

摘要： The present invention relates generally to a new metal/magnetic-ceramic laminate with through-holes and process thereof. More particularly, the invention encompasses a new process for fabrication of a large area ceramic laminate magnet with a significant number of holes, integrated metal plate(s) and co-sintered electrodes for electron and electron beam control. The present invention also relates to a magnetic matrix display (MMD), and electron beam source, and methods of manufacture thereof.

摘要翻译： 本发明一般涉及具有通孔的新的金属/磁陶瓷层压体及其工艺。 更具体地，本发明包括用于制造具有大量孔的大面积陶瓷层压体磁体的新方法，用于电子和电子束控制的集成金属板和共烧结电极。 本发明还涉及磁矩阵显示器（MMD）和电子束源，及其制造方法。

公开(公告)号：US06406778B1

公开(公告)日：2002-06-18

申请号：US09621796

申请日：2000-07-21

申请人： Govindarajan Natarajan ,  Krishna G. Sachdev ,  Abubaker S. Shagan

发明人： Govindarajan Natarajan ,  Krishna G. Sachdev ,  Abubaker S. Shagan

IPC分类号： B32B1706

CPC分类号： B32B18/00 ,  C04B2235/785 ,  C04B2237/341 ,  C04B2237/343 ,  C04B2237/366 ,  H01L21/4857 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4664 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/2495 ,  H01L2924/00

摘要： The present invention relates generally to using at least one green sheet that is originally very thin with the help of at least one thicker green sheet. An adhesion barrier to build multi-layer ceramic laminates and process thereof is also disclosed. Basically, the present invention relates to a structure and method for forming laminated structures and more particularly to a structure and method for fabricating multi-density, multi-layer ceramic products using at least one very thin green sheet and/or at least one green sheet with very dense electrically conductive patterns on top of at least one thicker green sheet.

摘要翻译： 本发明一般涉及至少使用至少一种较薄的生坯片，该生片最初是非常薄的，借助于至少一个较厚的生片。 还公开了构建多层陶瓷层压体的粘合屏障及其工艺。 基本上，本发明涉及一种用于形成叠层结构的结构和方法，更具体地涉及使用至少一个非常薄的生片和/或至少一个生坯片来制造多密度多层陶瓷产品的结构和方法 在至少一个更厚的生片上方具有非常密集的导电图案。

公开(公告)号：US06358439B1

公开(公告)日：2002-03-19

申请号：US08466562

申请日：1995-06-06

申请人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

发明人： Farid Youssif Aoude ,  Lawrence Daniel David ,  Renuka Shastri Divakaruni ,  Shaji Farooq ,  Lester Wynn Herron ,  Hal Mitchell Lasky ,  Anthony Mastreani ,  Govindarajan Natarajan ,  Srinivasa S. N. Reddy ,  Vivek Madan Sura ,  Rao Venkateswara Vallabhaneni ,  Donald Rene Wall

IPC分类号： H01B122

CPC分类号： H05K1/092 ,  H01L21/486 ,  H01L23/49883 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/31678 ,  H01L2924/00

摘要： A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achieve grain size and shrinkage control of the via and thick film copper produced by sintering. The shrinkage of the copper material during sintering is closely matched to that of the ceramic substrate.

摘要翻译： 公开了一种用于在半导体芯片器件的陶瓷衬底封装上填充通孔并形成导电表面图案的铜基膏。 该浆料含有适当粒度和重量比的铝酸铝粉末，以实现烧结产生的通孔和厚膜铜的晶粒尺寸和收缩率控制。 烧结过程中铜材的收缩与陶瓷基体的收缩密切相关。

公开(公告)号：US06245185B1

公开(公告)日：2001-06-12

申请号：US09354223

申请日：1999-07-15

申请人： Raschid J. Bezama ,  Dinesh Gupta ,  Govindarajan Natarajan

发明人： Raschid J. Bezama ,  Dinesh Gupta ,  Govindarajan Natarajan

IPC分类号： B32B3118

CPC分类号： B32B18/00 ,  C04B2237/123 ,  C04B2237/124 ,  C04B2237/127 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/567 ,  H01L21/4857 ,  H05K1/0306 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4667 ,  H05K2201/0191 ,  H05K2201/096 ,  Y10T156/1056

摘要： Disclosed is a method of making a multilayer ceramic product with thin layers, the method including the steps of: (a) providing a thick ceramic greensheet and a plurality of thin ceramic greensheets; (b) aligning and stacking the thin ceramic greensheet on the thick ceramic greensheet; (c) bonding the thin ceramic greensheet to the thick ceramic greensheet; (d) aligning and stacking one thin ceramic greensheet on the previous thin ceramic greensheet; (e) bonding the thin ceramic greensheet in step (d) to the previous thin ceramic greensheet; and (f) simultaneously forming at least one unfilled via in the stack of thick and thin ceramic greensheets.

摘要翻译： 公开了一种制备具有薄层的多层陶瓷产品的方法，所述方法包括以下步骤：（a）提供厚陶瓷毛坯和多个薄陶瓷片; （b）在厚陶瓷毛坯上对准和堆叠薄陶瓷毛坯; （c）将薄陶瓷毛坯粘合到厚陶瓷毛坯上; （d）在先前的薄陶瓷毛坯上对准和堆叠一个薄陶瓷毛坯; （e）将步骤（d）中的薄陶瓷毛坯粘合到先前的薄陶瓷毛坯上; 和（f）同时在厚而薄的陶瓷片堆叠中形成至少一个未填充的通孔。