公开(公告)号：US20110076348A1

公开(公告)日：2011-03-31

申请号：US12993836

申请日：2009-05-19

申请人： Reiko Kuroda ,  Higuchi Hiroaki ,  Narise Atsushi ,  Katsumasa Shimizu ,  Kenji Osawa

发明人： Reiko Kuroda ,  Higuchi Hiroaki ,  Narise Atsushi ,  Katsumasa Shimizu ,  Kenji Osawa

IPC分类号： A61K36/38 ,  A61P37/06 ,  A61P17/02

CPC分类号： A61K36/38 ,  A23K20/111 ,  A23K20/121 ,  A23K50/30 ,  A23K50/40 ,  A23L33/105 ,  A23V2002/00 ,  A23V2250/21 ,  A23V2200/304

摘要： To provide a prophylactic and/or therapeutic agent for atopic dermatitis with minimal concerns of adverse drug reactions and high safety, various researches were conducted. As a result, it was found that an extract extracted from a mangosteen (Garcinia mangostana L.) peel with a polar solvent prevented or healed atopic dermatitis. That is, the present invention provides a prophylactic and/or therapeutic agent for atopic dermatitis comprising an extract extracted from a mangosteen peel with a polar solvent. Furthermore, the present invention provides a food containing the above-mentioned prophylactic and/or therapeutic agent for atopic dermatitis.

摘要翻译： 为了提供特应性皮炎的预防和/或治疗药物，药物反应不良和安全性高的问题，进行了各种研究。 结果发现，从山竹果（Garcinia mangostana L.）剥离的极性溶剂提取物提取物防止或治愈特应性皮炎。 也就是说，本发明提供了特应性皮炎的预防和/或治疗剂，其包括用极性溶剂从山竹果皮提取的提取物。 此外，本发明提供含有上述用于特应性皮炎的预防和/或治疗剂的食品。

公开(公告)号：US20070170598A1

公开(公告)日：2007-07-26

申请号：US10556139

申请日：2004-05-10

申请人： Tomoo Iijima ,  Kenji Osawa ,  Kimitaka Endo ,  Yoshiaki Echigo ,  Akira Shigeta ,  Kazuyoshi Kobayashi ,  Kenichiro Hanamura

发明人： Tomoo Iijima ,  Kenji Osawa ,  Kimitaka Endo ,  Yoshiaki Echigo ,  Akira Shigeta ,  Kazuyoshi Kobayashi ,  Kenichiro Hanamura

IPC分类号： H01L23/48

CPC分类号： H05K3/4626 ,  H01L2924/0002 ,  H05K1/0393 ,  H05K3/386 ,  H05K3/4617 ,  H05K3/4635 ,  H05K3/4647 ,  H05K2201/0154 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/0355 ,  H05K2203/0384 ,  H05K2203/1189 ,  H01L2924/00

摘要： There is provided a flexible circuit board 22 that, when deposited on another flexible circuit board 40, causes no gap to occur between wiring films 4a, 4a, of the flexible circuit board 40. Moreover, a plurality of flexible circuit boards are deposited on one another to provide a flexible multi-layer wiring circuit board having no gaps between the flexible circuit boards and having less bowing. In the flexible circuit board 22, the thickness of a bonding layer 16, 16a, on the opposed side of a bowing metallic member 2, of an inter-layer insulating film 10 where which bumps 6 are formed is greater than the thickness of a bonding layer on the side of metallic member 2. When the flexible circuit board 22 is deposited on the other flexible circuit board 40 to form a flexible multi-layer wiring circuit board 50, the bonding layer 16, 16a can be filled between the wiring films 4a, 4a, so that the flexible multi-layer wiring circuit board 50 has no gaps and a less bowing.

摘要翻译： 提供了一种柔性电路板22，其在沉积在另一柔性电路板40上时，在柔性电路板40的布线膜4a，4a之间不产生间隙。 此外，多个柔性电路板彼此沉积，以提供柔性电路板之间没有间隙并具有较少弯曲的柔性多层布线电路板。 在柔性电路板22中，形成有凸块6的层间绝缘膜10的弯曲金属构件2的相对侧的接合层16,16a的厚度大于 接合层在金属构件2的侧面上。 当柔性电路板22沉积在另一个柔性电路板40上以形成柔性多层布线电路板50时，可以在布线膜4a，4a之间填充结合层16,16a，使得 柔性多层布线电路板50无间隙和较少弯曲。

公开(公告)号：US06492199B2

公开(公告)日：2002-12-10

申请号：US09773653

申请日：2001-01-31

申请人： Kenji Osawa ,  Kazuhiro Sato ,  Makoto Ito

发明人： Kenji Osawa ,  Kazuhiro Sato ,  Makoto Ito

IPC分类号： H01L2148

CPC分类号： H01L23/24 ,  H01L23/495 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method of manufacturing a semiconductor chip that has electrode pads on the chip front surface and disposed inside a conductive outer ring. A film circuit is disposed on the chip front surface side. External connection thermals are formed on the film circuit so as to project there from. First leads electrically connect part of the electrode pads to part of the external connection terminals. A second lead electrically connects a grounding or power supply electrode pad to the outer ring, and a third lead electrically connects a grounding or power supply external connection terminal to the outer ring.

摘要翻译： 一种制造半导体芯片的方法，该半导体芯片在芯片前表面上具有设置在导电外圈内部的电极焊盘。 薄片电路设置在芯片正面侧。 在薄膜电路上形成外部连接热量，从而在其上突出。 第一引线将电极焊盘的一部分电连接到外部连接端子的一部分。 第二引线将接地或电源电极焊盘电连接到外环，而第三引线将接地或电源外部连接端子电连接到外环。

公开(公告)号：US20110129554A1

公开(公告)日：2011-06-02

申请号：US12999896

申请日：2009-06-17

申请人： Yuuichi Maeda ,  Atsushi Narise ,  Sanae Kikuchi ,  Kenji Osawa

发明人： Yuuichi Maeda ,  Atsushi Narise ,  Sanae Kikuchi ,  Kenji Osawa

IPC分类号： A61K36/61 ,  A61P43/00 ,  B01D3/00

CPC分类号： A23G3/48 ,  A23G3/34 ,  A23L33/105 ,  A61K36/14 ,  A61K36/61

摘要： A method for preparing a Eucalyptus extract which decreases the Eucalyptus-specific odor and obtains the effective ingredient in high purity and high yield as a physiologically-active ingredient. An essential oil constituent is removed from the Eucalyptus plant and the residue is extracted with water or an organic solvent aqueous solution. Next, the obtained extraction residue is further extracted with an organic solvent aqueous solution or an organic solvent, whereby Macrocarpal A, Macrocarpal B, and Macrocarpal C contained in the Eucalyptus as a physiological active substance are prepared in higher content than using conventional methods. Further, the extract has improved good taste, appearance, and other desirable properties.

摘要翻译： 一种制备桉树提取物的方法，其降低桉树特异性气味，并获得作为生理活性成分的高纯度和高产率的有效成分。 从桉树植物中除去精油成分，残留物用水或有机溶剂水溶液萃取。 接下来，用有机溶剂水溶液或有机溶剂进一步提取所得提取残渣，由此制备作为生理活性物质的桉树中的Macrocarpal A，Macrocarpal B和Macrocarpal C的含量高于使用常规方法。 此外，提取物具有改善的良好味道，外观和其它期望的性质。

公开(公告)号：US20050224256A1

公开(公告)日：2005-10-13

申请号：US11085108

申请日：2005-03-22

申请人： Kenji Osawa ,  Masayuki Osawa ,  Tomokazu Shimada ,  Kimitaka Endo ,  Tomoo Iijima

发明人： Kenji Osawa ,  Masayuki Osawa ,  Tomokazu Shimada ,  Kimitaka Endo ,  Tomoo Iijima

IPC分类号： H01L21/4763 ,  H01L21/48 ,  H01L21/60 ,  H01L23/50 ,  H05K1/11 ,  H05K1/16 ,  H05K3/40 ,  H05K3/42 ,  H05K3/46

CPC分类号： H05K3/4614 ,  H01L2924/0002 ,  H05K3/423 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/10378 ,  H05K2203/0384 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1152 ,  H01L2924/00

摘要： To increase the dimensional accuracy of an interlayer member used for producing a multilayer wiring board which is inserted between two wiring layers to establish interlayer insulation and interlayer electrical connection between the wiring layers, to thereby increase a layout density. A mask film is formed on a main surface of a sheet-like carrier layer. A metal column for interlayer connection is formed on the main surface of the carrier layer by plating a copper using the mask film as a mask. The mask film is removed. An interlayer insulating layer and a protective sheet are laminated on the main surface of the carrier layer in such a manner that the metal column for interlayer connection penetrates them. The interlayer insulating layer and the protective sheet are polished until the upper surface of the metal column for interlayer connection is exposed. Then, the carrier layer is removed. Furthermore, the protective sheet is removed.

摘要翻译： 为了提高用于制造插入在两个布线层之间的多层布线板的层间构件的尺寸精度，以​​建立布线层之间的层间绝缘和层间电连接，从而增加布局密度。 在片状载体层的主表面上形成掩模膜。 通过使用掩模膜作为掩模将铜电镀形成在载体层的主表面上的用于层间连接的金属柱。 去除掩模膜。 层间绝缘层和保护片层叠在载体层的主表面上，使得用于层间连接的金属柱穿透它们。 抛光层间绝缘层和保护片，直到露出用于层间连接的金属柱的上表面。 然后，移除载体层。 此外，去除保护片。

公开(公告)号：US06700184B1

公开(公告)日：2004-03-02

申请号：US09009248

申请日：1998-01-20

申请人： Kenji Osawa ,  Haruhiko Makino

发明人： Kenji Osawa ,  Haruhiko Makino

IPC分类号： H01L23495

CPC分类号： H01L24/50 ,  H01L23/3114 ,  H01L23/3142 ,  H01L23/49541 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12044 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

摘要： There is provided a semiconductor device and a lead frame that form a stable external ring structure wherein bonding strength and mechanical strength between the external ring and sealing resin is improved. A semiconductor device (1) is formed which comprises a semiconductor chip (2) having a plurality of electrode pads (3) formed at the periphery of a front surface thereof, a wiring film (5) located and formed on the front surface side of the semiconductor chip (2) by laminating an insulation film (7) on a lead pattern (6), outer connection terminals (8) formed so as to protrude above the wiring film (5), a plurality of leads (9) extending form the wiring film (5) and connected to the electrode pads (3) on the semiconductor chip (2) at extended tip ends thereof, an external ring (11) provided so as to surround the semiconductor chip (2) and formed with a plurality of through holes or blind holes (15), and a sealing resin (12) filled between the semiconductor chip (2) and the external ring (11).

摘要翻译： 提供形成稳定的外环结构的半导体器件和引线框架，其中提高了外环和密封树脂之间的结合强度和机械强度。 形成半导体器件（1），其包括：半导体芯片（2），其具有形成在其前表面周围的多个电极焊盘（3）;布线膜（5），位于并形成在其前表面 半导体芯片（2）通过在引线图案（6）上层叠绝缘膜（7），形成为突出在布线膜（5）上方的外部连接端子（8），多个引线（9）延伸形成 布线膜（5），并且在其延伸的末端与半导体芯片（2）上的电极焊盘（3）连接，设置为围绕半导体芯片（2）并形成多个的外部环（11） 的通孔或盲孔（15）以及填充在半导体芯片（2）和外部环（11）之间的密封树脂（12）。

公开(公告)号：US06319749B1

公开(公告)日：2001-11-20

申请号：US09562750

申请日：2000-05-02

申请人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

发明人： Hiroyuki Shigeta ,  Kenji Osawa ,  Kazuhiro Sato ,  Haruhiko Makino ,  Makoto Ito

IPC分类号： H01L2144

CPC分类号： H01L23/3107 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48472 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15184 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00015 ,  H01L2224/05599 ,  H01L2924/00012

摘要： In a lead frame with a reinforcing ring surrounding a semiconductor element which are electrically connected to leads through electrodes is integrally formed through suspending portions, reinforcing portions for reinforcing the suspending portions are provided on the suspending portions. Upon application of a lead frame forming technique in which a laminate plate of three or more layers is used as a base, and inner leads are formed at one side while outer leads are formed by the surface layer at the other side, the lead frame is formed by forming a ring in place of outer leads, for example. A semiconductor package is formed by mounting the lead frame on a semiconductor chip.

摘要翻译： 在具有电连接到引线通过电极的半导体元件周围的加强环的引线框架通过悬挂部分一体地形成，用于加强悬挂部分的加强部分设置在悬挂部分上。 在使用三层以上的层叠板作为基底的引线框架成形技术的应用中，并且在一侧形成内部引线，而在另一侧由表面层形成外部引线，引线框架 例如，通过形成环代替外引线形成。 通过将引线框架安装在半导体芯片上来形成半导体封装。

公开(公告)号：US6153925A

公开(公告)日：2000-11-28

申请号：US48550

申请日：1998-03-26

申请人： Kazuhiro Sato ,  Kenji Osawa

发明人： Kazuhiro Sato ,  Kenji Osawa

IPC分类号： H01L21/60 ,  H01L23/12 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498

CPC分类号： H01L23/3107 ,  H01L23/495 ,  H01L23/4985 ,  H01L24/50 ,  Y10S438/977

摘要： A reinforcing ring surrounding a semiconductor element connected electrically to respective interconnecting portions through electrodes is provided as one body through suspending portions. A film circuit is produced by forming a ring in place of an outer lead for instance by applying a lead frame forming technique in which a laminate of three layers or more is used as a base, an inner lead is formed on one side and an outer lead is formed by a surface layer on another side. In this manner, in a film circuit composed of an insulating film and a plurality of interconnecting portions (leads) electrically connecting between electrodes and other electronic components of a semiconductor element on at least one principal plane of the insulating film, it is made possible to align a ring surrounding a semiconductor element with respect to the semiconductor element only by placing the film circuit on the semiconductor element, and in its turn to reduce assembly mandays of a semiconductor device.

摘要翻译： 围绕通过电极的电连接到互连部分的半导体元件的加强环通过悬挂部分设置为一体。 通过使用例如通过使用三层以上的层叠体作为基底的引线框架成形技术来形成环来代替外部引线来制造膜电路，在一侧形成内部引线 引线由另一侧的表面层形成。 以这种方式，在由绝缘膜和在绝缘膜的至少一个主平面上电连接电极和半导体元件的其他电子部件的多个互连部分（引线）的薄膜电路中， 仅通过将薄膜电路放置在半导体元件上而相对于半导体元件对准半导体元件周围的环，并且依次降低半导体器件的组装要求。

公开(公告)号：US20110135787A1

公开(公告)日：2011-06-09

申请号：US13058420

申请日：2009-08-04

申请人： Takahito Takase ,  Atsushi Narise ,  Sanae Kikuchi ,  Kenji Osawa

发明人： Takahito Takase ,  Atsushi Narise ,  Sanae Kikuchi ,  Kenji Osawa

IPC分类号： A23L1/30 ,  A23G4/06 ,  A23G3/36

CPC分类号： A23G4/06 ,  A23G3/36 ,  A23L2/52 ,  A23L27/84 ,  A23L29/06 ,  A23L33/105

摘要： Provided are a deodorizing composition which contains a highly safe natural plant extract that can be used in foods without anxiety as an active ingredient, and has a high deodorization effect even under a neutral condition, and a food and drink article containing the deodorizing composition. The deodorizing composition is characterized by containing a plant belonging to the genus Rubus in the family Rosaceae and peroxidase.

摘要翻译： 本发明提供一种除臭组合物，其含有可以无焦虑地食用的高度安全的天然植物提取物作为活性成分，并且即使在中性条件下也具有高的除臭效果，以及含有除臭组合物的食品和饮料制品。 除臭组合物的特征在于在家蔷薇科和过氧化物酶中含有属于Rubus属的植物。

公开(公告)号：US20110002859A1

公开(公告)日：2011-01-06

申请号：US12920734

申请日：2009-02-17

申请人： Yuuichi Maeda ,  Takahito Takase ,  Atsushi Narise ,  Kenji Osawa

发明人： Yuuichi Maeda ,  Takahito Takase ,  Atsushi Narise ,  Kenji Osawa

IPC分类号： A61K8/97 ,  A61K9/68 ,  A61P43/00 ,  A61P31/04 ,  A61Q11/00

CPC分类号： A61K36/61 ,  A23G4/06 ,  A23G4/068 ,  A61K8/347 ,  A61K8/97 ,  A61K9/0058 ,  A61K31/11 ,  A61K47/26 ,  A61K47/36 ,  A61Q11/00

摘要： It is an object of the present invention to provide a chewing gum, by which an effect of preventing periodontal disease is obtained through mastication without performance required for a chewing gum being impaired, such as taste, appearance, and physical properties and storage stability as a product. A chewing gum containing Eucalyptus extract of the present invention is characterized by containing at least one kind of macrocarpal A, macrocarpal B, and macrocarpal C, contents of the macrocarpal A, the macrocarpal B, and the macrocarpal C being 0.001 to 0.0045% by weight, 0.003 to 0.0045% by weight, and 0.0015 to 0.0045% by weight with respect to a total weight of the chewing gum, respectively.

摘要翻译： 本发明的目的是提供一种口香糖，其通过咀嚼而获得预防牙周病的效果，而不影响口香糖所需的性能，例如味道，外观和物理性能以及储存稳定性，如 产品。 含有本发明的桉树提取物的口香糖的特征在于，含有至少一种宏观眼A，宏观眼睛B和眼睑C，宏观眼A，宏观眼睛B，眼睑C的含量为0.001〜0.0045重量％ ，0.003〜0.0045重量％，相对于口香糖总重量为0.0015〜0.0045重量％。