公开(公告)号：US08523990B2

公开(公告)日：2013-09-03

申请号：US12999233

申请日：2009-06-15

申请人： Shigeaki Tanaka ,  Keiichi Tateishi ,  Takashi Ozawa

发明人： Shigeaki Tanaka ,  Keiichi Tateishi ,  Takashi Ozawa

IPC分类号： C09D11/02

CPC分类号： C09B44/105 ,  C09B7/00 ,  C09B43/16 ,  C09B56/08 ,  C09B56/20 ,  C09B67/0041 ,  C09B67/0055 ,  C09D11/328 ,  Y10T428/24802

摘要： An ink composition having a suitably-adjusted hue and causing no decomposition of dyes during storage is provided. The ink composition contains a compound (a) represented by the following formula (1), an ingredient (c) and moisture-retentive agents, characterized by being from 0.1 mass % to lower than 7.0 mass % in content of the compound represented by the formula (1), 10.0 mass % or lower in content of a moisture-retentive agent having 3 or more hydroxyl groups (b) and lower than 30.0 in molar ratio of the moisture-retentive agent having 3 or more hydroxyl groups to the compound represented by the formula (1): wherein each of Ar1 and Ar2 preferably represents an aromatic heterocyclic group, each of A1 and A2 represents a hydrogen atom or a substituent, Y represents —OM or —NR1R2, M represents a hydrogen atom or a metal ion and each of R1 and R2 represents a hydrogen atom, an alkyl group, an aryl group, a heterocyclic group or the like. The ingredient (c) is at least one compound selected from C.I. Direct Yellow 59, id. 86, id. 132 or the like.

摘要翻译： 提供了具有适当调节的色调并且在储存期间不会分解染料的油墨组合物。 油墨组合物含有由下式（1）表示的化合物（a），成分（c）和保湿剂，其特征在于，由以下化合物表示的化合物的含量为0.1质量％以上且低于7.0质量％ 式（1），具有3个以上羟基（b）且低于30.0的具有3个以上羟基的保湿剂的保湿剂相对于所表示的化合物的保湿剂的含量为10.0质量％以下 式（1）中，Ar 1和Ar 2优选表示芳香族杂环基，A 1和A 2分别表示氢原子或取代基，Y表示-OM或-NR 1 R 2，M表示氢原子或金属离子 R 1和R 2各自表示氢原子，烷基，芳基，杂环基等。 成分（c）是选自C.I.的至少一种化合物。 直接黄色59，id。 86，id。 132等。

公开(公告)号：US08378482B2

公开(公告)日：2013-02-19

申请号：US12465964

申请日：2009-05-14

申请人： Takashi Ozawa

发明人： Takashi Ozawa

IPC分类号： H01L23/34

CPC分类号： H01L23/49822 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/32 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/83051 ,  H01L2224/83385 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H05K3/305 ,  H05K3/3452 ,  H05K2201/0989 ,  H05K2201/10674 ,  H05K2201/10977 ,  H01L2924/00012 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/0665 ,  H01L2224/05599

摘要： A wiring board between which and a chip to be mounted a resin is filled includes: a substrate body on which a conductor portion to be connected to an electrode terminal of the chip is formed; and an insulating protection film formed on the substrate body and having an opening portion formed therein to expose the conductor portion. The opening portion is formed in such a manner that the edge thereof is positioned along and outside the outer shape of the chip except for a specific corner portion, and that the edge in the specific corner portion is positioned on a side of or inside the outer shape of the chip.

摘要翻译： 填充有树脂的芯片与布线基板之间的布线板包括：形成与芯片的电极端子连接的导体部的基板主体; 以及形成在所述基板主体上并具有形成在其中以使所述导体部分露出的开口部的绝缘保护膜。 开口部形成为除了特定的角部以外，除了特定的角部之外，其边缘位于芯片的外形外侧，并且特定角部的边缘位于外侧的外侧 形状的芯片。

公开(公告)号：US08232641B2

公开(公告)日：2012-07-31

申请号：US12782054

申请日：2010-05-18

申请人： Takashi Ozawa ,  Seiji Sato

发明人： Takashi Ozawa ,  Seiji Sato

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/17 ,  H01L21/563 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/81121 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A wiring substrate includes: a semiconductor chip on which a plurality of bumps are mounted, and a plurality of connection pads which are joined to the bumps mounted on the semiconductor chip in a flip chip method, wherein the connection pads of a peripheral portion of the wiring substrate are formed in a non-solder mask defined structure, and the connection pads of a center portion of the wiring substrate are formed in a solder mask defined structure.

摘要翻译： 布线基板包括：半导体芯片，其上安装有多个凸块;以及多个连接焊盘，其以倒装芯片方法接合到安装在半导体芯片上的凸块，其中，连接焊盘的周边部分 布线基板形成为非阻焊掩模限定结构，并且布线基板的中心部分的连接焊盘形成为焊料掩模限定结构。

公开(公告)号：US20120126423A1

公开(公告)日：2012-05-24

申请号：US13301154

申请日：2011-11-21

申请人： Yukinori Hatori ,  Takashi Ozawa

发明人： Yukinori Hatori ,  Takashi Ozawa

IPC分类号： H01L23/48 ,  H01L21/56

CPC分类号： H01L23/3128 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L23/49811 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2224/81 ,  H01L2924/00

摘要： According to an aspect of the present invention, there is provided a semiconductor device manufacturing method, including: preparing a support plate having a mounting portion on which a mounting terminal is mountable; preparing a circuit board having a mounting surface on which a semiconductor chip is mounted and a connection pad is formed; bringing the support plate to face the mounting surface of the circuit board, and connecting the support plate to the connection pad through the mounting terminal; forming a resin layer between the support plate and the mounting surface of the circuit board to cover the mounting terminal; and removing the support plate, thereby faulting a via in the resin layer along a shape of the mounting portion so as to expose the mounting terminal therethrough.

摘要翻译： 根据本发明的一个方面，提供了一种半导体器件制造方法，包括：准备具有可安装安装端子的安装部分的支撑板; 准备具有其上安装有半导体芯片的安装表面和形成连接焊盘的电路板; 使支撑板面向电路板的安装表面，并通过安装端子将支撑板连接到连接垫; 在支撑板和电路板的安装表面之间形成树脂层以覆盖安装端子; 并且移除支撑板，从而沿着安装部分的形状使树脂层中的通孔发生故障，从而使安装端子暴露在其中。

公开(公告)号：US07901997B2

公开(公告)日：2011-03-08

申请号：US12021664

申请日：2008-01-29

申请人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

发明人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

IPC分类号： H01L21/00

CPC分类号： H01L24/32 ,  H01L21/4853 ,  H01L21/563 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1146 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81026 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/0475 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solder 14 is formed, by a plating method, on a connecting surface 21A and a side surface 21B in a connecting pad 21 of a wiring board 11 which is opposed to a metal bump 13 formed on an electrode pad 31 of a semiconductor chip 12, and subsequently, the solder 14 is molten to form an accumulated solder 15 taking a convex shape on the connecting surface 21A of the connecting pad 21 and the metal bump 13 is then mounted on the connecting surface 21A of the connecting pad 21 on which the accumulated solder is formed, and the accumulated solder 15 and the metal bump 13 are thus bonded to each other.

摘要翻译： 在布线基板11的与半导体芯片12的电极焊盘31上形成的金属凸块13相对的连接焊盘21的连接面21A和侧面21B上，通过电镀法形成焊锡14 随后，焊料14熔化，形成在连接焊盘21的连接面21A上呈凸形的积聚焊料15，然后将金属凸块13安装在连接焊盘21的连接面21A上， 形成积累的焊料，并且积累的焊料15和金属凸块13因此彼此结合。

公开(公告)号：US07884482B2

公开(公告)日：2011-02-08

申请号：US11957866

申请日：2007-12-17

申请人： Takashi Ozawa ,  Yasushi Araki ,  Masatoshi Nakamura ,  Seiji Sato

发明人： Takashi Ozawa ,  Yasushi Araki ,  Masatoshi Nakamura ,  Seiji Sato

IPC分类号： H01L23/48 ,  H01L23/52

CPC分类号： H05K1/111 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/0554 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05647 ,  H01L2224/10175 ,  H01L2224/814 ,  H01L2924/00014 ,  H05K3/3452 ,  H05K2201/09381 ,  H05K2201/0989 ,  H05K2201/09909 ,  H05K2201/10674 ,  Y02P70/611 ,  H01L2924/014 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： It is a flip-chip mounting substrate according to the invention has a wiring pattern in which bonding pads and predetermined parts of lead wires continuously extending from the bonding pads are exposed from an insulating layer or a solder resist. In the flip-chip mounting substrate, exposed parts of the wiring pattern are formed in to a plurality of different shapes. The exposed parts are formed so that the areas of the bonding pads are substantially equal to one another, and that the total areas of predetermined parts of the lead wires continuously extending from the bonding pads are substantially equal to one another.

摘要翻译： 根据本发明的倒装芯片安装基板具有布线图案，其中从焊盘连续延伸的焊盘和引线的预定部分从绝缘层或阻焊剂露出。 在倒装芯片安装基板中，布线图案的露出部分形成为多种不同的形状。 露出的部分形成为使得接合焊盘的面积基本上彼此相等，并且从接合焊盘连续延伸的引线的预定部分的总面积基本相等。

公开(公告)号：US07847417B2

公开(公告)日：2010-12-07

申请号：US11613753

申请日：2006-12-20

申请人： Yasushi Araki ,  Seiji Sato ,  Masatoshi Nakamura ,  Takashi Ozawa

发明人： Yasushi Araki ,  Seiji Sato ,  Masatoshi Nakamura ,  Takashi Ozawa

IPC分类号： H01L23/02

CPC分类号： H05K3/3452 ,  H01L21/563 ,  H01L23/3171 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/02 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/0401 ,  H01L2224/10175 ,  H01L2224/11 ,  H01L2224/1132 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16237 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81385 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H05K2201/09381 ,  H05K2201/099 ,  H05K2201/10674 ,  H01L2924/00 ,  H01L2924/00014

摘要： A solder resist and a central pad to which a central Au bump provided on a semiconductor chip is flip-chip bonded are formed on a substrate main body. In a flip-chip mounting substrate where an underfill resin is provided after the semiconductor chip is mounted, a central opening portion for exposing the central pad is formed in the solder resist, and also, an edge portion forming the central opening portion of the solder resist is partially overlapped with the outer peripheral portion of the central pad.

摘要翻译： 在衬底主体上形成阻焊剂和设置在半导体芯片上的中心Au凸块倒装芯片接合的中心焊盘。 在安装半导体芯片之后设置底部填充树脂的倒装芯片安装基板中，在阻焊层中形成用于暴露中心焊盘的中心开口部分，并且还形成形成焊料的中心开口部分的边缘部分 抗蚀剂部分地与中心焊盘的外周部分重叠。

公开(公告)号：US20100295174A1

公开(公告)日：2010-11-25

申请号：US12782054

申请日：2010-05-18

申请人： Takashi Ozawa ,  Seiji Sato

发明人： Takashi Ozawa ,  Seiji Sato

IPC分类号： H01L23/485

CPC分类号： H01L24/17 ,  H01L21/563 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/81 ,  H01L2223/54426 ,  H01L2223/54473 ,  H01L2224/1134 ,  H01L2224/13144 ,  H01L2224/16237 ,  H01L2224/81121 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2224/13099

摘要： A wiring substrate includes: a semiconductor chip on which a plurality of bumps are mounted, and a plurality of connection pads which are joined to the bumps mounted on the semiconductor chip in a flip chip method, wherein the connection pads of a peripheral portion of the wiring substrate are formed in a non-solder mask defined structure, and the connection pads of a center portion of the wiring substrate are formed in a solder mask defined structure.

摘要翻译： 布线基板包括：半导体芯片，其上安装有多个凸块;以及多个连接焊盘，其以倒装芯片方法接合到安装在半导体芯片上的凸块，其中，连接焊盘的周边部分 布线基板形成为非阻焊掩模限定结构，并且布线基板的中心部分的连接焊盘形成为焊料掩模限定结构。

公开(公告)号：US07510605B2

公开(公告)日：2009-03-31

申请号：US10573117

申请日：2005-02-03

申请人： Toru Harada ,  Yoshiharu Yabuki ,  Takashi Ozawa ,  Keiichi Tateishi

发明人： Toru Harada ,  Yoshiharu Yabuki ,  Takashi Ozawa ,  Keiichi Tateishi

IPC分类号： C09D11/00 ,  C09D11/02 ,  C09B31/143

CPC分类号： B41M5/385 ,  B41M5/388 ,  C09B33/12 ,  C09B35/03 ,  C09B35/34 ,  C09D11/328 ,  G03G9/091 ,  G03G9/0914 ,  G03G9/0922

摘要： To provide a dye which has a good hue, which can form an image showing a high fastness under various using conditions and environmental conditions, and which is particularly suited for an ink, the dye is represents by formula (1):wherein R1 and R2 each independently represents a monovalent group, Z represents a nitrogen atom or a carbon atom to which a hydrogen atom or a monovalent group is bonded, and M represents a hydrogen atom or a cation, provided that the dye has two azo groups.

摘要翻译： 为了提供具有良好色调的染料，其可以在各种使用条件和环境条件下形成显示高牢度的图像，并且特别适合于油墨，染料由式（1）表示：其中R1和R2 各自独立地表示一价基团，Z表示氮原子或氢原子或一价基团键合的碳原子，M表示氢原子或阳离子，条件是该染料具有两个偶氮基。

公开(公告)号：US20080188040A1

公开(公告)日：2008-08-07

申请号：US12021664

申请日：2008-01-29

申请人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

发明人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

IPC分类号： H01L21/60

CPC分类号： H01L24/32 ,  H01L21/4853 ,  H01L21/563 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1146 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81026 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/0475 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solder 14 is formed, by a plating method, on a connecting surface 21A and a side surface 21B in a connecting pad 21 of a wiring board 11 which is opposed to a metal bump 13 formed on an electrode pad 31 of a semiconductor chip 12, and subsequently, the solder 14 is molten to form an accumulated solder 15 taking a convex shape on the connecting surface 21A of the connecting pad 21 and the metal bump 13 is then mounted on the connecting surface 21A of the connecting pad 21 on which the accumulated solder is formed, and the accumulated solder 15 and the metal bump 13 are thus bonded to each other.

摘要翻译： 在布线基板11的与半导体芯片12的电极焊盘31上形成的金属凸块13相对的连接焊盘21的连接面21A和侧面21B上，通过电镀法形成焊锡14 随后，焊料14熔化，形成在连接焊盘21的连接面21A上呈凸形的积聚焊料15，然后将金属凸块13安装在连接焊盘21的连接面21A上， 形成积累的焊料，并且积累的焊料15和金属凸块13因此彼此结合。