公开(公告)号：US07901997B2

公开(公告)日：2011-03-08

申请号：US12021664

申请日：2008-01-29

申请人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

发明人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

IPC分类号： H01L21/00

CPC分类号： H01L24/32 ,  H01L21/4853 ,  H01L21/563 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1146 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81026 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/0475 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solder 14 is formed, by a plating method, on a connecting surface 21A and a side surface 21B in a connecting pad 21 of a wiring board 11 which is opposed to a metal bump 13 formed on an electrode pad 31 of a semiconductor chip 12, and subsequently, the solder 14 is molten to form an accumulated solder 15 taking a convex shape on the connecting surface 21A of the connecting pad 21 and the metal bump 13 is then mounted on the connecting surface 21A of the connecting pad 21 on which the accumulated solder is formed, and the accumulated solder 15 and the metal bump 13 are thus bonded to each other.

摘要翻译： 在布线基板11的与半导体芯片12的电极焊盘31上形成的金属凸块13相对的连接焊盘21的连接面21A和侧面21B上，通过电镀法形成焊锡14 随后，焊料14熔化，形成在连接焊盘21的连接面21A上呈凸形的积聚焊料15，然后将金属凸块13安装在连接焊盘21的连接面21A上， 形成积累的焊料，并且积累的焊料15和金属凸块13因此彼此结合。

公开(公告)号：US20080188040A1

公开(公告)日：2008-08-07

申请号：US12021664

申请日：2008-01-29

申请人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

发明人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

IPC分类号： H01L21/60

CPC分类号： H01L24/32 ,  H01L21/4853 ,  H01L21/563 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1146 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81026 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/0475 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solder 14 is formed, by a plating method, on a connecting surface 21A and a side surface 21B in a connecting pad 21 of a wiring board 11 which is opposed to a metal bump 13 formed on an electrode pad 31 of a semiconductor chip 12, and subsequently, the solder 14 is molten to form an accumulated solder 15 taking a convex shape on the connecting surface 21A of the connecting pad 21 and the metal bump 13 is then mounted on the connecting surface 21A of the connecting pad 21 on which the accumulated solder is formed, and the accumulated solder 15 and the metal bump 13 are thus bonded to each other.

摘要翻译： 在布线基板11的与半导体芯片12的电极焊盘31上形成的金属凸块13相对的连接焊盘21的连接面21A和侧面21B上，通过电镀法形成焊锡14 随后，焊料14熔化，形成在连接焊盘21的连接面21A上呈凸形的积聚焊料15，然后将金属凸块13安装在连接焊盘21的连接面21A上， 形成积累的焊料，并且积累的焊料15和金属凸块13因此彼此结合。

公开(公告)号：US20090023281A1

公开(公告)日：2009-01-22

申请号：US12173985

申请日：2008-07-16

申请人： Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

发明人： Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

IPC分类号： H01L21/768

CPC分类号： H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/481 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/244 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/124

摘要： A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

摘要翻译： 一种在安装在多个焊盘上的导电球上进行回流处理从而形成焊料凸块的焊料凸点形成方法包括形成能够与焊盘上的增粘化合物发生化学反应的金属膜的金属膜形成步骤 有机粘贴层形成步骤，使含有所述增粘化合物的溶液与所述金属膜发生化学反应，从而在所述金属膜上形成有机粘附层;以及导电性球安装步骤， 在其上形成有机粘附层，由此通过金属膜将导电球安装在焊盘上。

公开(公告)号：US07264848B2

公开(公告)日：2007-09-04

申请号：US11226132

申请日：2005-09-14

申请人： Masaki Sanada ,  Masao Nakazawa ,  Kei Imafuji

发明人： Masaki Sanada ,  Masao Nakazawa ,  Kei Imafuji

IPC分类号： B05D1/18 ,  B05D3/10 ,  C23C18/18 ,  C23C18/32 ,  C23C18/42

CPC分类号： C23C18/54 ,  H05K3/244

摘要： The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—SH wherein n is 2 or 3 and X is SO3H or NH2, and having a pH value of 7 or less. The invention also provides a process for electroless gold plating using the non-cyanide electroless gold plating solution.

摘要翻译： 本发明提供一种不含氰化合物的非氰化物无电镀金液，其包含作为金的完成剂，由下述式表示的化合物或其盐：<？在线配方说明=“ 在线公式“end =”lead“？> X-（CH 2）2 -SH <？in-line-formula description =”In-line Formulas“ 末端=“尾”→其中n为2或3，X为SO 3 H或NH 2，pH值为7以下。 本发明还提供了使用非氰化物无电镀金镀液的无电镀金的方法。

公开(公告)号：US07807560B2

公开(公告)日：2010-10-05

申请号：US12173985

申请日：2008-07-16

申请人： Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

发明人： Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

IPC分类号： H01L21/44

CPC分类号： H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/481 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/244 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/124

摘要： A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

摘要翻译： 一种在安装在多个焊盘上的导电球上进行回流处理从而形成焊料凸块的焊料凸点形成方法包括形成能够与焊盘上的增粘化合物发生化学反应的金属膜的金属膜形成步骤 有机粘贴层形成步骤，使含有所述增粘化合物的溶液与所述金属膜发生化学反应，从而在所述金属膜上形成有机粘附层;以及导电性球安装步骤， 在其上形成有机粘附层，由此通过金属膜将导电球安装在焊盘上。

公开(公告)号：US20060062927A1

公开(公告)日：2006-03-23

申请号：US11226132

申请日：2005-09-14

申请人： Masaki Sanada ,  Masao Nakazawa ,  Kei Imafuji

发明人： Masaki Sanada ,  Masao Nakazawa ,  Kei Imafuji

IPC分类号： C23C18/31

CPC分类号： C23C18/54 ,  H05K3/244

摘要： The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—SH wherein n is 2 or 3 and X is SO3H or NH2, and having a pH value of 7 or less. The invention also provides a process for electroless gold plating using the non-cyanide electroless gold plating solution.

摘要翻译： 本发明提供一种不含氰化物的非氰化物无电镀金液，其包含作为金完成剂的由下述式表示的化合物或其盐

公开(公告)号：US20070029206A1

公开(公告)日：2007-02-08

申请号：US11543028

申请日：2006-10-05

申请人： Miwa Abe ,  Kei Imafuji

发明人： Miwa Abe ,  Kei Imafuji

IPC分类号： C25D3/48

CPC分类号： C25D3/48

摘要： A non-cyanogen type electrolytic solution, for plating gold, contains a gold salt as a supply source of gold and is added with a non-cyanogen type compound wherein the electrolytic plating solution is added with one selected from a group of thiouracil; 2-aminoethanethiol; N-methylthiourea, 3-amino-5-mercapto-1,2,4-triazole; 4,6-dihydroxy-2-mercaptopyrimidine; and mercapto-nicotinate; as a compound forming a complexing compound with gold. Chloroaurate or gold sulfite is preferably used as a gold salt.

摘要翻译： 用于镀金的非氰型电解液含有金盐作为金的供应源，并加入非氰化合物类型的化合物，其中电解电镀溶液中加入一种选自一组硫尿嘧啶; 2-氨基乙硫醇; N-甲基硫脲，3-氨基-5-巯基-1,2,4-三唑; 4,6-二羟基-2-巯基嘧啶; 和巯基烟酸酯; 作为与金形成络合化合物的化合物。 优选使用氯代牛磺酸盐或金亚硫酸盐作为金盐。

公开(公告)号：US07093356B2

公开(公告)日：2006-08-22

申请号：US10661530

申请日：2003-09-15

申请人： Kei Imafuji ,  Tadashi Kodaira ,  Takeshi Chino ,  Jyunichi Nakamura ,  Miwa Abe

发明人： Kei Imafuji ,  Tadashi Kodaira ,  Takeshi Chino ,  Jyunichi Nakamura ,  Miwa Abe

IPC分类号： B05D5/12 ,  C25D5/02 ,  H01L21/461 ,  H01L21/4763 ,  H05K3/20 ,  H05K3/34 ,  H05K3/36

CPC分类号： H01L21/6835 ,  H01L21/4857 ,  H01L23/49816 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/205 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/4644 ,  H05K2201/0367 ,  H05K2203/0338 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0726 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49156 ,  Y10T29/49165 ,  H01L2224/05599

摘要： A wiring substrate with bumps protruding from a surface of the substrate covers one side of a metallic base with an electrical insulating film thereon, having open holes exposing the base, etching the base through the open holes to form concavities in the base, electroplating the interior faces of the concavities to form a barrier metal film thereon filling the concavities with a bump material by electroplating, and forming a barrler layer on the bump material in each concavity. A stack of wiring patterns is formed on the insulating film, adjacent wiring patterns being separated by a respective intervening insulating layer and being electrically connected to each other through vias in the intervening insulating layer, and to the bump material filled in the concavities. Thereafter, the base and barrier metal film are removed.

摘要翻译： 具有从基板的表面突出的凸起的布线基板覆盖金属基底的一侧，其上具有电绝缘膜，具有暴露基底的开孔，通过开孔蚀刻基底，在基底中电镀电镀内部 凹面的表面在其上形成阻挡金属膜，通过电镀将凸起材料填充到凹部，并且在每个凹部中的凸块材料上形成一个滚筒层。 在绝缘膜上形成一叠布线图案，相邻的布线图案被相应的中间绝缘层隔开，并且通过中间绝缘层中的通孔彼此电连接，并且与填充在凹部中的凸块材料电连接。 此后，除去基底和阻挡金属膜。

公开(公告)号：US07261803B2

公开(公告)日：2007-08-28

申请号：US10661533

申请日：2003-09-15

申请人： Miwa Abe ,  Kei Imafuji

发明人： Miwa Abe ,  Kei Imafuji

IPC分类号： C25D3/48

CPC分类号： C25D3/48

摘要： A non-cyanogen type electrolytic solution, for plating gold, contains a gold salt as a supply source of gold and is added with a non-cyanogen type compound wherein the electrolytic plating solution is added with one selected from a group of thiouracil; 2-aminoethanethiol; N-methylthiourea, 3-amino-5-mercapto-1,2,4-triazole; 4,6-dihydroxy-2-mercaptopyrimidine; and mercapto-nicotinate; as a compound forming a complexing compound with gold. Chloroaurate or gold sulfite is preferably used as a gold salt.