公开(公告)号：US07901997B2

公开(公告)日：2011-03-08

申请号：US12021664

申请日：2008-01-29

申请人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

发明人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

IPC分类号： H01L21/00

CPC分类号： H01L24/32 ,  H01L21/4853 ,  H01L21/563 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1146 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81026 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/0475 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solder 14 is formed, by a plating method, on a connecting surface 21A and a side surface 21B in a connecting pad 21 of a wiring board 11 which is opposed to a metal bump 13 formed on an electrode pad 31 of a semiconductor chip 12, and subsequently, the solder 14 is molten to form an accumulated solder 15 taking a convex shape on the connecting surface 21A of the connecting pad 21 and the metal bump 13 is then mounted on the connecting surface 21A of the connecting pad 21 on which the accumulated solder is formed, and the accumulated solder 15 and the metal bump 13 are thus bonded to each other.

摘要翻译： 在布线基板11的与半导体芯片12的电极焊盘31上形成的金属凸块13相对的连接焊盘21的连接面21A和侧面21B上，通过电镀法形成焊锡14 随后，焊料14熔化，形成在连接焊盘21的连接面21A上呈凸形的积聚焊料15，然后将金属凸块13安装在连接焊盘21的连接面21A上， 形成积累的焊料，并且积累的焊料15和金属凸块13因此彼此结合。

公开(公告)号：US20080188040A1

公开(公告)日：2008-08-07

申请号：US12021664

申请日：2008-01-29

申请人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

发明人： Takashi Ozawa ,  Seiji Sato ,  Masao Nakazawa ,  Mitsuyoshi Imai ,  Masatoshi Nakamura ,  Kei Imafuji

IPC分类号： H01L21/60

CPC分类号： H01L24/32 ,  H01L21/4853 ,  H01L21/563 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1146 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81026 ,  H01L2224/81191 ,  H01L2224/8121 ,  H01L2224/814 ,  H01L2224/81815 ,  H01L2224/83051 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/1579 ,  H05K3/3436 ,  H05K3/3473 ,  H05K2201/10674 ,  H05K2203/043 ,  H05K2203/0475 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

摘要： A solder 14 is formed, by a plating method, on a connecting surface 21A and a side surface 21B in a connecting pad 21 of a wiring board 11 which is opposed to a metal bump 13 formed on an electrode pad 31 of a semiconductor chip 12, and subsequently, the solder 14 is molten to form an accumulated solder 15 taking a convex shape on the connecting surface 21A of the connecting pad 21 and the metal bump 13 is then mounted on the connecting surface 21A of the connecting pad 21 on which the accumulated solder is formed, and the accumulated solder 15 and the metal bump 13 are thus bonded to each other.

摘要翻译： 在布线基板11的与半导体芯片12的电极焊盘31上形成的金属凸块13相对的连接焊盘21的连接面21A和侧面21B上，通过电镀法形成焊锡14 随后，焊料14熔化，形成在连接焊盘21的连接面21A上呈凸形的积聚焊料15，然后将金属凸块13安装在连接焊盘21的连接面21A上， 形成积累的焊料，并且积累的焊料15和金属凸块13因此彼此结合。

公开(公告)号：US07807560B2

公开(公告)日：2010-10-05

申请号：US12173985

申请日：2008-07-16

申请人： Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

发明人： Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

IPC分类号： H01L21/44

CPC分类号： H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/481 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/244 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/124

摘要： A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

摘要翻译： 一种在安装在多个焊盘上的导电球上进行回流处理从而形成焊料凸块的焊料凸点形成方法包括形成能够与焊盘上的增粘化合物发生化学反应的金属膜的金属膜形成步骤 有机粘贴层形成步骤，使含有所述增粘化合物的溶液与所述金属膜发生化学反应，从而在所述金属膜上形成有机粘附层;以及导电性球安装步骤， 在其上形成有机粘附层，由此通过金属膜将导电球安装在焊盘上。

公开(公告)号：US20060062927A1

公开(公告)日：2006-03-23

申请号：US11226132

申请日：2005-09-14

申请人： Masaki Sanada ,  Masao Nakazawa ,  Kei Imafuji

发明人： Masaki Sanada ,  Masao Nakazawa ,  Kei Imafuji

IPC分类号： C23C18/31

CPC分类号： C23C18/54 ,  H05K3/244

摘要： The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—SH wherein n is 2 or 3 and X is SO3H or NH2, and having a pH value of 7 or less. The invention also provides a process for electroless gold plating using the non-cyanide electroless gold plating solution.

摘要翻译： 本发明提供一种不含氰化物的非氰化物无电镀金液，其包含作为金完成剂的由下述式表示的化合物或其盐

公开(公告)号：US07264848B2

公开(公告)日：2007-09-04

申请号：US11226132

申请日：2005-09-14

申请人： Masaki Sanada ,  Masao Nakazawa ,  Kei Imafuji

发明人： Masaki Sanada ,  Masao Nakazawa ,  Kei Imafuji

IPC分类号： B05D1/18 ,  B05D3/10 ,  C23C18/18 ,  C23C18/32 ,  C23C18/42

CPC分类号： C23C18/54 ,  H05K3/244

摘要： The present invention provides a non-cyanide electroless gold plating solution free from a cyanide compound, comprising, as a completing agent of gold, a compound represented by the formula shown below or a salt thereof: X—(CH2)n—SH wherein n is 2 or 3 and X is SO3H or NH2, and having a pH value of 7 or less. The invention also provides a process for electroless gold plating using the non-cyanide electroless gold plating solution.

摘要翻译： 本发明提供一种不含氰化合物的非氰化物无电镀金液，其包含作为金的完成剂，由下述式表示的化合物或其盐：<？在线配方说明=“ 在线公式“end =”lead“？> X-（CH 2）2 -SH <？in-line-formula description =”In-line Formulas“ 末端=“尾”→其中n为2或3，X为SO 3 H或NH 2，pH值为7以下。 本发明还提供了使用非氰化物无电镀金镀液的无电镀金的方法。

公开(公告)号：US20090023281A1

公开(公告)日：2009-01-22

申请号：US12173985

申请日：2008-07-16

申请人： Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

发明人： Kei Imafuji ,  Masao Nakazawa ,  Masaki Sanada ,  Sachiko Oda ,  Tadashi Kodaira ,  Kinji Nagata ,  Masaru Yamazaki ,  Kenjiro Enoki

IPC分类号： H01L21/768

CPC分类号： H05K3/3478 ,  B23K1/0016 ,  B23K3/0623 ,  B23K2101/42 ,  H01L21/4853 ,  H01L23/481 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K3/244 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/124

摘要： A solder bump forming method of carrying out a reflow treatment over a conductive ball mounted on a plurality of pads, thereby forming a solder bump, includes a metal film forming step of forming a metal film capable of chemically reacting to a tackifying compound on the pads, an organic sticking layer forming step of causing a solution containing the tackifying compound to chemically react to the metal film, thereby forming an organic sticking layer on the metal film, and a conductive ball mounting step of supplying the conductive ball on the pads having the organic sticking layer formed thereon, thereby mounting the conductive ball on the pads through the metal film.

摘要翻译： 一种在安装在多个焊盘上的导电球上进行回流处理从而形成焊料凸块的焊料凸点形成方法包括形成能够与焊盘上的增粘化合物发生化学反应的金属膜的金属膜形成步骤 有机粘贴层形成步骤，使含有所述增粘化合物的溶液与所述金属膜发生化学反应，从而在所述金属膜上形成有机粘附层;以及导电性球安装步骤， 在其上形成有机粘附层，由此通过金属膜将导电球安装在焊盘上。

公开(公告)号：US07695638B2

公开(公告)日：2010-04-13

申请号：US11739332

申请日：2007-04-24

申请人： Norikazu Nakamura ,  Masao Nakazawa ,  Hidekazu Miyamoto ,  Kenji Miyazawa ,  Manabu Saito

发明人： Norikazu Nakamura ,  Masao Nakazawa ,  Hidekazu Miyamoto ,  Kenji Miyazawa ,  Manabu Saito

IPC分类号： C23F1/02

CPC分类号： H05K3/0055 ,  B01J19/006 ,  B01J19/18 ,  B01J19/1825 ,  B01J2219/00038 ,  B01J2219/00162 ,  B01J2219/00768 ,  C01G45/1207 ,  C01P2006/80 ,  H05K2203/0796

摘要： In a reaction chamber (20), a used alkaline permanganate etching solution (12) is accommodated and an alkaline earth hydroxide (14) such as calcium hydroxide is added in the reaction chamber, a liquid inside of the reaction chamber is agitated, the liquid is exhausted from a side portion or a top portion of the reaction chamber through a filter (28), a precipitate (26) adhered to the filter is scraped off, and a precipitate containing a hardly soluble or insoluble matter incapable of passing through the filter and accumulated on a bottom portion of the reaction chamber is exhausted from the reaction chamber.

摘要翻译： 在反应室（20）中，容纳碱式高锰酸盐蚀刻溶液（12），在反应室中加入氢氧化钙等碱土金属氢氧化物（14），搅拌反应室内部的液体 通过过滤器（28）从反应室的侧部或顶部排出，刮去附着在过滤器上的沉淀物（26），并且含有难以溶解或不溶解的物质的沉淀物不能通过过滤器 并且积聚在反应室的底部的部分从反应室排出。

公开(公告)号：US07445965B2

公开(公告)日：2008-11-04

申请号：US11096058

申请日：2005-03-31

申请人： Masatoshi Akagawa ,  Masao Nakazawa ,  Hideto Nakazawa

发明人： Masatoshi Akagawa ,  Masao Nakazawa ,  Hideto Nakazawa

IPC分类号： H01L21/00

CPC分类号： H01L23/3736 ,  H01L21/4882 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152

摘要： A method of manufacturing a radiating plate using In as a thermal conducting bonding material 20 provided between a semiconductor device and a radiating plate 14 and serving to bond a back surface of the semiconductor device to the radiating plate, includes the steps of carrying out a cleaning treatment for cleaning a surface of the radiating plate 14, supplying the In to the radiating plate 14, heating and melting the In and hermetically adhering the In 18 to the radiating plate, thereby obtaining an In integral type radiating plate.

摘要翻译： 使用In制作作为设置在半导体器件与散热板14之间并用于将半导体器件的后表面粘合到散热板上的导热接合材料20的散热板的制造方法包括以下步骤： 用于清洁散热板14的表面的处理，将In供应到散热板14中，对In进行加热和熔化，并将In 18气密地粘附到散热板上，从而获得In积分型散热板。

公开(公告)号：US06755957B2

公开(公告)日：2004-06-29

申请号：US09772457

申请日：2001-01-30

申请人： Kenji Nakamura ,  Masao Nakazawa

发明人： Kenji Nakamura ,  Masao Nakazawa

IPC分类号： C25D502

CPC分类号： C25D7/123 ,  C25D5/18 ,  C25D5/34 ,  H05K3/423 ,  H05K3/4644 ,  H05K2201/09563 ,  Y10S205/917

摘要： A method of plating for filling via holes, in which each via hole is formed in an insulation layer covering a substrate so as to expose, at its bottom, part of a conductor layer located on the substrate. A copper film is formed on the top surface of the insulation layer covering the substrate, and the side walls and bottoms of the respective via holes. A strike plating of copper is provided on the copper film, and the substrate is immersed in an aqueous solution containing a plating promoter to thereby deposit the plating promoter on the surface of the copper strike. The plating promoter is removed from the copper strike plating located on the top surface insulation layer while leaving the plating promoter on the side walls and bottoms of the respective via holes. The substrate is subsequently electroplated with copper to fill the via holes.

摘要翻译： 一种用于填充通孔的电镀方法，其中每个通孔形成在覆盖基板的绝缘层中，以便在其底部暴露位于基板上的导体层的一部分。 在覆盖基板的绝缘层的顶表面和相应通孔的侧壁和底部上形成铜膜。 在铜膜上设置铜的触击电镀，将基板浸渍在含有电镀促进剂的水溶液中，从而在铜冲击的表面上沉积电镀促进剂。 电镀促进剂从位于顶表面绝缘层上的铜冲击镀层中除去，同时将电镀促进剂留在相应通孔的侧壁和底部。 随后用铜电镀衬底以填充通孔。

公开(公告)号：US5961565A

公开(公告)日：1999-10-05

申请号：US716710

申请日：1996-09-12

申请人： Taketoshi Kawabe ,  Osamu Isobe ,  Masao Nakazawa ,  Ikurou Notsu ,  Sadahiro Takahashi

发明人： Taketoshi Kawabe ,  Osamu Isobe ,  Masao Nakazawa ,  Ikurou Notsu ,  Sadahiro Takahashi

IPC分类号： B60K31/00 ,  B60K28/16 ,  F02D29/02 ,  F02D45/00

CPC分类号： B60K28/16 ,  B60K28/165

摘要： A drive torque of a vehicle drive wheel is controlled so that a slip ratio between the drive wheel and a road surface is equal to a target value. A determining function of which the sign varies when the slip ratio is equal to the target value, and a switching function comprising a time integral of the determining function, are set, and the drive torque target value is set such that it is directly proportional to the switching function. Alternatively, the drive torque target value is set based on the switching function which is set equal to the determining function and corrected based on an angular acceleration of the drive wheel.

摘要翻译： 控制车辆驱动轮的驱动扭矩，使得驱动轮和路面之间的滑移比等于目标值。 当滑移率等于目标值时，符号变化的确定功能，并且设置包括确定功能的时间积分的切换功能，并且将驱动转矩目标值设定为与 切换功能。 或者，基于设定为等于确定功能并根据驱动轮的角加速度进行校正的切换功能来设定驱动转矩目标值。