公开(公告)号：US08554239B2

公开(公告)日：2013-10-08

申请号：US13259607

申请日：2010-06-01

申请人： Qing Zhang ,  Xu Yang

发明人： Qing Zhang ,  Xu Yang

IPC分类号： H04W72/00 ,  H04B1/38 ,  H04W4/00

CPC分类号： H04B1/0003 ,  H04L67/1034 ,  H04L69/40

摘要： A baseband pool device includes a control unit, and a plurality of baseband processing units which are connected one another. The control unit is configured to determine one or more baseband processing units participating in data processing according to a size of data received by the baseband pool device and baseband data processing capabilities of various baseband processing unit, and allocate an identifier of the baseband data to be processed to each baseband processing unit participating in the data processing to construct a data allocation relationship, and respectively transmit the data allocation relationship to the baseband processing units participating in the data processing. The baseband processing units receive the data allocation relationship; and, process the received data according to the data allocation relationship, or transmit the received data to other baseband processing units of the baseband pool device, or receive data processed and then forwarded by other baseband processing units. A method for implementing baseband data distributed switch is also provided. The present invention increases the baseband processing capacity and reduces the cost.

摘要翻译： 基带池装置包括控制单元和彼此连接的多个基带处理单元。 控制单元被配置为根据由基带池设备接收的数据的大小和各种基带处理单元的基带数据处理能力来确定参与数据处理的一个或多个基带处理单元，并且将基带数据的标识符分配为 处理到参与数据处理的每个基带处理单元以构成数据分配关系，并且分别将数据分配关系发送到参与数据处理的基带处理单元。 基带处理单元接收数据分配关系; 并根据数据分配关系处理接收到的数据，或者将接收到的数据发送到基带池设备的其他基带处理单元，或者接收其他基带处理单元处理后转发的数据。 还提供了一种实现基带数据分布式交换机的方法。 本发明增加了基带处理能力并降低了成本。

公开(公告)号：US20130202340A1

公开(公告)日：2013-08-08

申请号：US13367850

申请日：2012-02-07

申请人： Qing Zhang

发明人： Qing Zhang

IPC分类号： B41J5/12

CPC分类号： H01H13/705 ,  H01H2221/016 ,  H01H2221/03

摘要： A key device includes a casing having a base plate and a frame disposed on the base plate, and a key cap having a press plate and a limiter. The press plate is disposed between the frame and the base plate and exposed from an opening of the frame. The press plate has a pivotal side connected pivotally to the frame or base plate and is movable between unpressed and pressed positions. The limiter is disposed at or near a non-pivotal side of the press plate opposite to the pivotal side and engageable with the base plate or frame to prevent the non-pivotal side from escaping out of the casing. A resilient unit is disposed on the base plate to bias the press plate to the unpressed position.

摘要翻译： 关键装置包括具有基板和设置在基板上的框架的壳体和具有压板和限制器的键帽。 压板设置在框架和基板之间并且从框架的开口露出。 压板具有枢转地连接到框架或基板的枢转侧，并且可在未压制和按压位置之间移动。 限位器设置在压板的与枢转侧相对的非枢转侧或其附近，并与基板或框架接合，以防止非枢转侧从壳体中逸出。 弹性单元设置在基板上以将压板偏压到未压紧位置。

公开(公告)号：US08395053B2

公开(公告)日：2013-03-12

申请号：US11769296

申请日：2007-06-27

申请人： Yaojian Lin ,  Haijing Cao ,  Qing Zhang

发明人： Yaojian Lin ,  Haijing Cao ,  Qing Zhang

IPC分类号： H05K1/16

CPC分类号： H05K1/167 ,  H01L21/4846 ,  H01L23/49548 ,  H01L23/498 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/04941 ,  H05K3/467 ,  H05K2201/0195 ,  H05K2201/0317 ,  H05K2201/09436 ,  H05K2201/09672 ,  Y10T29/43 ,  Y10T428/12528 ,  H01L2224/05599

摘要： A circuit system comprising: forming a lower electrode over a substrate; forming a resistive film over the lower electrode; forming a multi-layered insulating stack over a portion of the resistive film; and forming an upper electrode over a portion of the multi-layered insulating stack.

摘要翻译： 一种电路系统，包括：在衬底上形成下电极; 在下电极上形成电阻膜; 在所述电阻膜的一部分上形成多层绝缘堆叠; 以及在所述多层绝缘堆叠的一部分上形成上电极。

公开(公告)号：US08380526B2

公开(公告)日：2013-02-19

申请号：US13111834

申请日：2011-05-19

申请人： Chen Hu ,  Zexin Liu ,  Lei Miao ,  Longyin Chen ,  Qing Zhang ,  Wei Xiao ,  Herve Marcel Taddei

发明人： Chen Hu ,  Zexin Liu ,  Lei Miao ,  Longyin Chen ,  Qing Zhang ,  Wei Xiao ,  Herve Marcel Taddei

IPC分类号： G10L19/00 ,  G10L19/12

CPC分类号： G10L21/00 ,  G10L19/24

摘要： A method, device and system for signal encoding and decoding are disclosed. The method includes: encoding a core layer signal to obtain a core layer signal code; selecting an enhancement sample point that requires enhancement layer signal encoding according to the core layer signal code and the number of bits that can be used by an enhancement layer; obtaining an enhancement layer signal code of the enhancement sample point; and outputting a bit stream, where the bit stream includes the core layer signal code and the enhancement layer signal code. In embodiments of the present invention, according to the number of bits that can be used by the enhancement layer, the enhancement sample point that requires enhancement layer signal encoding is selected; the enhancement layer signal of the selected enhancement sample point is encoded and decoded; when no sufficient bits are available for the enhancement layer, the enhancement quality of the core layer can be improved.

摘要翻译： 公开了用于信号编码和解码的方法，装置和系统。 该方法包括：编码核心层信号以获得核心层信号码; 选择需要根据核心层信号码的增强层信号编码和增强层可以使用的位数的增强采样点; 获得增强采样点的增强层信号码; 并输出比特流，其中比特流包括核心层信号码和增强层信号码。 在本发明的实施例中，根据增强层可以使用的比特数，选择需要增强层信号编码的增强采样点; 所选择的增强采样点的增强层信号被编码和解码; 当没有足够的比特可用于增强层时，可以提高核心层的增强质量。

公开(公告)号：US08309452B2

公开(公告)日：2012-11-13

申请号：US12826365

申请日：2010-06-29

申请人： Yaojian Lin ,  Haijing Cao ,  Qing Zhang

发明人： Yaojian Lin ,  Haijing Cao ,  Qing Zhang

IPC分类号： H01L21/44 ,  H01L21/60

CPC分类号： H01L23/5227 ,  H01L23/645 ,  H01L24/03 ,  H01L24/05 ,  H01L24/48 ,  H01L28/10 ,  H01L2224/02166 ,  H01L2224/04042 ,  H01L2224/056 ,  H01L2224/451 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2224/45099

摘要： A semiconductor device has a substrate with an inductor formed on its surface. First and second contact pads are formed on the substrate. A passivation layer is formed over the substrate and first and second contact pads. A protective layer is formed over the passivation layer. The protective layer is removed over the first contact pad, but not from the second contact pad. A conductive layer is formed over the first contact pad. The conductive layer is coiled on the surface of the substrate to produce inductive properties. The formation of the conductive layer involves use of a wet etchant. The second contact pad is protected from the wet etchant by the protective layer. The protective layer is removed from the second contact pad after forming the conductive layer over the first contact pad. An external connection is formed on the second contact pad.

摘要翻译： 半导体器件具有在其表面上形成有电感器的基板。 第一和第二接触垫形成在基板上。 在衬底和第一和第二接触焊盘之上形成钝化层。 在钝化层上形成保护层。 保护层在第一接触垫上移除，但不从第二接触垫移除。 导电层形成在第一接触焊盘上。 导电层被卷绕在基板的表面上以产生电感性质。 导电层的形成涉及使用湿蚀刻剂。 第二接触垫被保护层从湿蚀刻剂保护。 在第一接触垫上形成导电层之后，从第二接触焊盘去除保护层。 在第二接触垫上形成外部连接。

公开(公告)号：US08304904B2

公开(公告)日：2012-11-06

申请号：US12700114

申请日：2010-02-04

申请人： Yaojian Lin ,  Qing Zhang ,  Haijing Cao

发明人： Yaojian Lin ,  Qing Zhang ,  Haijing Cao

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L24/11 ,  H01L24/03 ,  H01L24/05 ,  H01L2224/0231 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05647 ,  H01L2224/11009 ,  H01L2224/11019 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/16 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/14 ,  H01L2224/13099 ,  H01L2224/05552

摘要： A semiconductor device has a first conductive layer formed over a substrate. A first insulating layer is formed over the substrate and first conductive layer. A second conductive layer is formed over the first conductive layer and first insulating layer. A second insulating layer is formed over the first insulating layer and second conductive layer. The second insulating layer has a sidewall between a surface of the second insulating material and surface of the second conductive layer. A protective layer is formed over the second insulating layer and surface of the second conductive layer. The protective layer follows a contour of the surface and sidewall of the second insulating layer and second conductive layer. A bump is formed over the surface of the second conductive layer and a portion of the protective layer adjacent to the second insulating layer. The protective layer protects the second insulating layer.

摘要翻译： 半导体器件具有形成在衬底上的第一导电层。 第一绝缘层形成在衬底和第一导电层上。 在第一导电层和第一绝缘层上形成第二导电层。 在第一绝缘层和第二导电层上形成第二绝缘层。 第二绝缘层在第二绝缘材料的表面和第二导电层的表面之间具有侧壁。 在第二绝缘层和第二导电层的表面上形成保护层。 保护层遵循第二绝缘层和第二导电层的表面和侧壁的轮廓。 在第二导电层的表面上形成凸块，并且与第二绝缘层相邻的部分形成保护层。 保护层保护第二绝缘层。

公开(公告)号：US20120277897A1

公开(公告)日：2012-11-01

申请号：US13098257

申请日：2011-04-29

申请人： Huanbo Zhang ,  Garrett Ho Yee Sin ,  King Yi Heung ,  Nathan Bohannon ,  Qing Zhang

发明人： Huanbo Zhang ,  Garrett Ho Yee Sin ,  King Yi Heung ,  Nathan Bohannon ,  Qing Zhang

IPC分类号： G06F19/00

CPC分类号： B24B37/005 ,  B24B37/042 ,  G05B19/182 ,  G05B2219/45232 ,  G05D16/20

摘要： Values are selected for a plurality of controllable parameters of a chemical mechanical polishing system that includes a carrier head with a plurality of zones to apply independently controllable pressures on a substrate. Data is stored relating variation in removal profile on a front surface of the substrate to variation in the controllable parameters, the data including removal at a plurality of positions on the front surface of the substrate, there being a greater number of positions than chambers. A value is determined for each parameter of the plurality of controllable parameters to minimize a difference between a target removal profile and an expected removal profile calculated from the data relating variation in removal profile on a front surface of the substrate to variation in the parameters. The value for each parameter of the plurality of controllable parameters is stored.

摘要翻译： 为化学机械抛光系统的多个可控参数选择值，其包括具有多个区域的载体头，以在基底上施加独立的可控压力。 存储数据存储在基板的前表面上的去除轮廓的变化，以改变可控参数，包括在基板的前表面上的多个位置处的去除的数据，存在比腔更多的位置数量。 为多个可控参数的每个参数确定一个值，以最小化目标去除曲线与根据数据相关的预期去除曲线之间的差异，该数据与基板的前表面上的去除曲线的变化相关，参数的变化。 存储多个可控参数的每个参数的值。

公开(公告)号：US20120211881A9

公开(公告)日：2012-08-23

申请号：US12763378

申请日：2010-04-20

申请人： Yaojian Lin ,  Haijing Cao ,  Qing Zhang

发明人： Yaojian Lin ,  Haijing Cao ,  Qing Zhang

IPC分类号： H01L23/538

CPC分类号： H01L24/10 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05572 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/30105 ,  H01L2924/00014 ,  H01L2224/05552 ,  H01L2924/00 ,  H01L2924/013

摘要： A flip chip semiconductor device has a substrate with a plurality of active devices formed thereon. A contact pad is formed on the substrate in electrical contact with the plurality of active devices. A passivation layer is formed over the substrate and intermediate conduction layer. An adhesive layer is formed over the passivation layer. A barrier layer is formed over the adhesive layer. A wetting layer is formed over the barrier layer. The barrier layer and wetting layer in a first region are removed, while the barrier layer, wetting layer, and adhesive layer in a second region are maintained. The adhesive layer over the passivation layer in the first region are maintained until the solder bumps are formed. By keeping the adhesive layer over the passivation layer until after formation of the solder bumps, less cracking occurs in the passivation layer.

摘要翻译： 倒装芯片半导体器件具有在其上形成有多个有源器件的衬底。 接触焊盘形成在与多个有源器件电接触的衬底上。 在衬底和中间导电层上形成钝化层。 在钝化层上形成粘合剂层。 在粘合剂层上形成阻挡层。 在阻挡层上形成润湿层。 去除第一区域中的阻挡层和润湿层，同时维持第二区域中的阻挡层，润湿层和粘合剂层。 保持第一区域中的钝化层上的粘合剂层直到形成焊料凸点。 通过将粘合剂层保持在钝化层上方直到形成焊料凸点，在钝化层中发生较少的破裂。

公开(公告)号：US08214218B2

公开(公告)日：2012-07-03

申请号：US13162309

申请日：2011-06-16

申请人： Zexin Liu ,  Lei Miao ,  Chen Hu ,  Wenhai Wu ,  Yue Lang ,  Qing Zhang

发明人： Zexin Liu ,  Lei Miao ,  Chen Hu ,  Wenhai Wu ,  Yue Lang ,  Qing Zhang

IPC分类号： G10L19/00

CPC分类号： G10L19/24 ,  G10L19/22 ,  G10L19/26

摘要： A method and an apparatus for switching speech or audio signals, wherein the method for switching speech or audio signals includes when switching of a speech or audio, weighting a first high frequency band signal of a current frame of speech or audio signal and a second high frequency band signal of the previous M frame of speech or audio signals to obtain a processed first high frequency band signal, where M is greater than or equal to 1, and synthesizing the processed first high frequency band signal and a first low frequency band signal of the current frame of speech or audio signal into a wide frequency band signal. In this way, speech or audio signals with different bandwidths can be smoothly switched, thus improving the quality of audio signals received by a user.

摘要翻译： 一种用于切换语音或音频信号的方法和装置，其中用于切换语音或音频信号的方法包括：当切换语音或音频时，加权当前语音或音频信号帧的第一高频带信号， 先前的M帧语音或音频信号的频带信号，以获得经处理的第一高频带信号，其中M大于或等于1，并且合成经处理的第一高频带信号和第一低频带信号 将当前的语音帧或音频信号转换成宽频带信号。 以这种方式，可以平滑地切换具有不同带宽的语音或音频信号，从而提高用户接收的音频信号的质量。

公开(公告)号：US08140343B2

公开(公告)日：2012-03-20

申请号：US13210127

申请日：2011-08-15

申请人： Chen Hu ,  Zexin Liu ,  Lei Miao ,  Longyin Chen ,  Qing Zhang ,  Wei Xiao ,  Herve Marcel Taddei

发明人： Chen Hu ,  Zexin Liu ,  Lei Miao ,  Longyin Chen ,  Qing Zhang ,  Wei Xiao ,  Herve Marcel Taddei

IPC分类号： G10L19/00 ,  G10L21/04

CPC分类号： G10L21/00 ,  G10L19/24

摘要： A method, device and system for signal encoding and decoding, the method comprising: encoding a core layer signal to obtain a core layer signal code; selecting an enhancement sample point that requires enhancement layer signal encoding according to the core layer signal code and the number of bits that can be used by an enhancement layer; obtaining an enhancement layer signal code of the enhancement sample point; and outputting a bit stream, where the bit stream includes the core layer signal code and the enhancement layer signal code. In embodiments of the present invention, according to the number of bits that can be used by the enhancement layer, the enhancement sample point that requires enhancement layer signal encoding is selected; the enhancement layer signal of the selected enhancement sample point is encoded and decoded; when no sufficient bits are available for the enhancement layer, the enhancement quality of the core layer can be improved.

摘要翻译： 一种用于信号编码和解码的方法，装置和系统，所述方法包括：对核心层信号进行编码以获得核心层信号码; 选择需要根据核心层信号码的增强层信号编码和增强层可以使用的位数的增强采样点; 获得增强采样点的增强层信号码; 并输出比特流，其中比特流包括核心层信号码和增强层信号码。 在本发明的实施例中，根据增强层可以使用的比特数，选择需要增强层信号编码的增强采样点; 所选择的增强采样点的增强层信号被编码和解码; 当没有足够的比特可用于增强层时，可以提高核心层的增强质量。