Abstract:
Memory device including a controller configured to cause the memory device to generate a first clock edge of a first clock signal in response to a first clock edge of a second clock signal, to generate a second, opposite, clock edge of the first clock signal immediately following the first clock edge of the first clock signal in response to a second, opposite, clock edge of the second clock signal immediately following the first clock edge of the second clock signal, and to latch data for output from the memory device in response to the second clock edge of the first clock signal.
Abstract:
In an example, a method of operating a memory device to latch data for output from the memory device may include generating a first clock edge of a first clock signal in response to a first clock edge of a second clock signal, generating a second, opposite, clock edge of the first clock signal immediately following the first clock edge of the first clock signal in response to a second, opposite, clock edge of the second clock signal immediately following the first clock edge of the second clock signal, and latching the data in response to the second clock edge of the first clock signal for output from the memory device.
Abstract:
Memories and methods for programming memories with multi-step programming pulses are provided. One method includes applying a plurality of programming pulses to cells of the memory device to be programmed, with each programming pulse of the plurality of programming pulses being configured to contribute towards programming a cell of the plurality of cells to each data state of a plurality of programmed data states. A first portion of each programming pulse is used to program certain cells towards a target data state associated with a first threshold voltage level, and a later portion of each programming pulse is used to program other cells towards a target data state associated with a second threshold voltage level that is lower than the first threshold voltage level.
Abstract:
Apparatuses and methods for mixed charge pumps with voltage regulator circuits is disclosed. An example apparatus comprises a first charge pump circuit configured to provide a first output, a second charge pump circuit configured to provide a second output, a plurality of coupling circuits configured to voltage couple and current couple the first output and the second output to a common node to provide a regulated voltage, and a feedback circuit configured to regulate the first output and the second output based on the regulated voltage.
Abstract:
Apparatus include a data bus and a signal driver circuit having pluralities of first and second termination devices connected in parallel between a voltage node and an output node. Each of the termination devices is configured to be deactivated in response to control signals having a particular set of logic levels, and to be activated in response to control signals having a set of logic levels other than the particular set of logic levels. Activated second termination devices each exhibit respective resistances greater than a particular resistance of each activated first termination device. Methods include connecting a node of an apparatus to a first voltage node through a reference resistance, connecting the node to a second voltage node through a termination device, and comparing a resulting voltage level to a reference voltage different than half-way between voltage levels of the first and second voltage nodes.
Abstract:
Apparatuses and methods for reducing read disturb are described herein. An example apparatus may include a first memory subblock including a first select gate drain (SGD) switch and a first select gate source (SGS) switch, a second memory subblock including a second SGD switch and a second SGS switch, and an access line associated with the first and second memory subblocks. The apparatus may include a control unit configured to enable the first and second SGD switches and the first and second SGS switches during a first portion of a read operation and to provide a first voltage on the access line during the first portion. The control unit may be configured to disable the first SGD switch and the first SGS switches during a second portion of the read operation and to provide a second voltage on the access line during the second portion.
Abstract:
Apparatuses and methods for threshold voltage (Vt) distribution determination are described. A number of apparatuses can include sense circuitry configured to determine a first current on a source line of an array of memory cells, the first current corresponding to a first quantity of memory cells of a group of memory cells that conducts in response to a first sensing voltage applied to an access line and determine a second current on the source line, the second current corresponding to a second quantity of memory cells of the group that conducts in response to a second sensing voltage applied to the access line. The number of apparatuses can include a controller configured to determine at least a portion of a Vt distribution corresponding to the group of memory cells based, at least in part, on the first current and the second current.
Abstract:
Semiconductor devices, such as three-dimensional memory devices, include a memory array including a stack of conductive tiers and a stair step structure. The stair step structure is positioned between first and second portions of the memory array and includes contact regions for respective conductive tiers of the stack of conductive tiers. The first portion of the memory array includes a first plurality of select gates extending in a particular direction over the stack. The second portion of the memory array includes a second plurality of select gates also extending in the particular direction over the stack of conductive tiers. Methods of forming and methods of operating such semiconductor devices, including vertical memory devices, are also disclosed.
Abstract:
A memory device includes a plurality of input/output (I/O) nodes, a circuit, a latch, a memory, and control logic. The plurality of I/O nodes receive a predefined data pattern. The circuit adjusts a delay for each I/O node as the predefined data pattern is received. The latch latches the data received on each I/O node. The memory stores the latched data. The control logic compares the stored latched data to an expected data pattern and sets the delay for each I/O node based on the comparison.
Abstract:
Memory including an array of memory cells might include an input buffer having calibration circuitry, a first input, a second input, and an output; and calibration logic having an input selectively connected to the output of the input buffer and comprising an output connected to the calibration circuitry, wherein the calibration logic is configured to cause the memory to determine whether the input buffer exhibits offset while a particular voltage level is applied to the first and second inputs of the input buffer, and, in response to determining that the selected input buffer exhibits offset, apply an adjustment to the calibration circuitry while the particular voltage level is applied to the first and second inputs until a logic level of the output of the selected input buffer transitions.