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    Integrated Circuit Provided with a Device for Detecting its Spatial Orientation and/or a Modification of this Orientation
    73.
    发明申请
    Integrated Circuit Provided with a Device for Detecting its Spatial Orientation and/or a Modification of this Orientation 有权
    具有用于检测其空间方向和/或该方向的修改的装置的集成电路

    公开(公告)号：US20150014794A1

    公开(公告)日：2015-01-15

    申请号：US14501537

    申请日：2014-09-30

    Applicant: STMicroelectronics (Rousset) SAS

    Inventor： Antonio Di-Giacomo ,  Pascal Fornara

    IPC: B81B7/02 ,  B81C1/00 ,  B81B3/00

    CPC classification number: B81B7/02 ,  B81B3/0051 ,  B81B2201/0235 ,  B81B2201/0292 ,  B81C1/00174 ,  B81C1/00246 ,  B81C2203/0714 ,  B81C2203/0771 ,  G01C9/12 ,  G01P13/00 ,  G01P15/135

    Abstract: An integrated circuit includes a mechanical device for detection of spatial orientation and/or of change in orientation of the integrated circuit. The device is formed in the BEOL and includes an accommodation whose sides include metal portions formed within various metallization levels. A mobile metal component is accommodated within the accommodation. A monitor inside the accommodation defines a displacement area for the metal component and includes electrically conductive elements disposed at the periphery of the displacement area. The component is configured so as to, under the action of the gravity, come into contact with the two electrically conductive elements in response to a given spatial orientation of the integrated circuit. A detector is configured to detect an electrical link passing through the component and the electrically conductive elements.

    Abstract translation: 集成电路包括用于检测集成电路的空间取向和/或取向变化的机械装置。 该装置形成在BEOL中并且包括其侧面包括形成在各种金属化水平内的金属部分的容纳物。 移动金属部件容纳在住宿内。 住房内的监视器限定了用于金属部件的位移区域，并且包括设置在位移区域周边的导电元件。 该部件构造成在重力的作用下，响应于集成电路的给定的空间取向与两个导电元件接触。 检测器被配置为检测通过部件和导电元件的电连接。

    Electrically Controllable Integrated Switch
    74.
    发明申请
    Electrically Controllable Integrated Switch 有权
    电控集成开关

    公开(公告)号：US20140360851A1

    公开(公告)日：2014-12-11

    申请号：US14286331

    申请日：2014-05-23

    Applicant: STMicroelectronics (Rousset) SAS

    Inventor： Christian Rivero ,  Pascal Fornara ,  Antonio di-Giacomo ,  Brice Arrazat

    IPC: H01H59/00 ,  H01L21/822 ,  H01L27/06

    CPC classification number: H01H59/0009 ,  B81B2201/018 ,  B81C1/00246 ,  B81C2203/0735 ,  B81C2203/0771 ,  H01H1/0036 ,  H01H57/00 ,  H01H2001/0068 ,  H01H2001/0078 ,  H01H2059/0054 ,  H01L21/8221 ,  H01L23/522 ,  H01L27/0617 ,  H01L27/0688 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An integrated circuit includes an interconnection part with several metallization levels. An electrically activatable switching device within the interconnection part has an assembly that includes a beam held by a structure. The beam and structure are located within the same metallization level. Locations of fixing of the structure on the beam are arranged so as to define for the beam a pivot point situated between these fixing locations. The structure is substantially symmetric with respect to the beam and to a plane perpendicular to the beam in the absence of a potential difference. The beam is able to pivot in a first direction in the presence of a first potential difference applied between a first part of the structure and to pivot in a second direction in the presence of a second potential difference applied between a second part of the structure.

    Abstract translation: 集成电路包括具有多个金属化级别的互连部件。 互连部件内的可电激活的开关装置具有包括由结构保持的梁的组件。 梁和结构位于相同的金属化水平内。 布置结构在梁上的固定位置，以便为梁定义位于这些固定位置之间的枢转点。 该结构在不存在电位差的情况下相对于光束和垂直于光束的平面基本对称。 在存在施加在结构的第一部分之间的第一电位差并且在存在施加在结构的第二部分之间的第二电位差的情况下在第二方向上枢转时，梁能够在第一方向上枢转。

    Integrated Switchable Capacitive Device
    75.
    发明申请
    Integrated Switchable Capacitive Device 有权
    集成可切换电容装置

    公开(公告)号：US20140319653A1

    公开(公告)日：2014-10-30

    申请号：US14264227

    申请日：2014-04-29

    Applicant: STMicroelectronics (Rousset) SAS

    Inventor： Pascal Fornara ,  Christian Rivero

    IPC: H01L23/522 ,  H01G5/16 ,  H01L21/768

    CPC classification number: H01L27/0629 ,  H01G5/011 ,  H01G5/16 ,  H01L21/768 ,  H01L21/7682 ,  H01L21/7687 ,  H01L23/4821 ,  H01L23/5223 ,  H01L23/528 ,  H01L23/642 ,  H01L28/60 ,  H01L2924/0002 ,  H01L2924/1461 ,  H01L2924/00

    Abstract: An integrated circuit includes a substrate. A fixed main capacitor electrode is disposed in a metal layer overlying the substrate. A second main capacitor electrode is disposed in a metal layer and spaced from the fixed main capacitor electrode. A movable capacitor electrode is disposed adjacent the fixed main capacitor electrode. The movable capacitor electrode is switchable between a first configuration in which the movable capacitor electrode and fixed main capacitor electrode are mutually spaced out in such a manner as to form an auxiliary capacitor electrically connected to the main capacitor. In a second configuration, the movable capacitor electrode and the fixed main capacitor electrode are in electrical contact in such a manner as to give a second capacitive value.

    Abstract translation: 集成电路包括基板。 固定的主电容器电极设置在覆盖衬底的金属层中。 第二主电容器电极设置在金属层中并与固定主电容器电极间隔开。 可动电容电极设置在固定主电容器电极附近。 可移动电容器电极可以在可移动电容器电极和固定主电容器电极相互间隔开的第一配置之间切换，以形成电连接到主电容器的辅助电容器。 在第二构造中，可移动电容电极和固定主电容器电极以提供第二电容值的方式进行电接触。

    ELECTRICALLY ACTIVATABLE INTEGRATED MECHANICAL ANTI-ROLLBACK DEVICE WITH ONE OR MORE POSITIONS
    76.
    发明申请
    ELECTRICALLY ACTIVATABLE INTEGRATED MECHANICAL ANTI-ROLLBACK DEVICE WITH ONE OR MORE POSITIONS 有权
    具有一个或多个位置的电动可激活的机械防反转装置

    公开(公告)号：US20130250531A1

    公开(公告)日：2013-09-26

    申请号：US13765064

    申请日：2013-02-12

    Applicant: STMICROELECTRONICS (ROUSSET) SAS

    Inventor： Albert Martinez ,  Pascal Fornara

    IPC: H05K1/02 ,  H05K3/30

    CPC classification number: H05K1/02 ,  H01G5/04 ,  H01G5/16 ,  H01H1/0036 ,  H01H59/0009 ,  H05K3/30 ,  Y10T29/49155

    Abstract: A thermally deformable assembly is formed in an integrated-circuit metallization level. The physical behavior of the metal forming the assembly brings the assembly into contact with a stop-forming body when subjected to a temperature change caused by a current flow. A natural rollback to the initial configuration in which the assembly is a certain distance away from the body is prevented. The state or configuration of the assembly is determined by a capacitive reader.

    Abstract translation: 热变形组件形成在集成电路金属化层中。 形成组件的金属的物理行为使得组件在受到由电流引起的温度变化时与停止成形体接触。 防止组装距离身体一定距离的初始构造的自然回滚。 组件的状态或配置由电容式读取器确定。

    Integrated fuse
    78.
    发明授权
    Integrated fuse 有权

    公开(公告)号：US12119310B2

    公开(公告)日：2024-10-15

    申请号：US18210392

    申请日：2023-06-15

    Applicant: STMicroelectronics (Rousset) SAS

    Inventor： Pascal Fornara

    IPC: H01L23/62 ,  H01H85/02 ,  H01L21/66 ,  H01L23/525

    CPC classification number: H01L23/62 ,  H01H85/0241 ,  H01L22/34 ,  H01L23/5256 ,  H01H2085/0283

    Abstract: A semiconductor wafer includes first zones containing integrated circuits, each first zone including a substrate and a sealing ring at a periphery of the substrate. The first zones are separated from each other by second zones defining cutting lines or paths. The integrated circuit includes an electrically conductive fuse that extends between a first location inside the integrated circuit and a second location situated outside the integrated circuit beyond one of the cutting lines. This electrically conductive fuse includes a portion that passes through the sealing ring and another portion that straddles the adjacent cutting line. The portion of the fuse that passes through is electrically isolated from the sealing ring and from the substrate. The straddling portion is configured to be sliced, when cutting the wafer along the cutting line, so as to cause the fuse to change from an electrical on state to an electrical off state.

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