Abstract:
The inventive concepts relate to nonvolatile memory devices. The nonvolatile memory devices may include a memory cell array, and a page buffer circuit connected to the memory cell array through bit lines. The page buffer circuit may comprise a substrate, bit line selection transistors on the substrate and connected to respective ones of the bit lines, and latches on the substrate connected to the bit line selection transistors through lines. The lines may be on a first plane above and parallel to a top surface of the substrate, and may be connected to respective ones of the bit line selection transistors through first contacts. The bit lines may be on a second plane above and parallel to a top surface of the substrate, and may be connected to respective ones of the bit line selection transistors through second contacts.
Abstract:
A semiconductor device includes a semiconductor device, comprising a memory cell array including a plurality of memory cells connected to a first bit line and a second bit line, respectively, a page buffer group, and bit line selection circuits including a plurality of selection circuit blocks to connect the first bit lines or the second bit lines to the page buffer group, wherein each of the selection circuit blocks includes a first contact region and a second contact region to which the first and second bit lines coupled, and same bit lines of the first and second bit lines are coupled to contact regions adjacent to one another of the first and second contact regions included in bit line selection circuits adjacent to one another of the bit line selection circuits.
Abstract:
A semiconductor device includes a first vertical memory string connected to a common source line, a second vertical memory string connected to a bit line, a pipe transistor suitable for selectively connecting the first and second vertical memory strings based on a block selection signal, and a plurality of transistors suitable for selectively connecting local lines of the first and second vertical memory strings to corresponding global lines based on the block selection signal.
Abstract:
A circuit includes a hybrid switch, which includes a Tunnel Field-Effect Transistor (TFET) having a first source, a first drain, and a first gate. The hybrid switch further includes a Metal-Oxide-Semiconductor Field-Effect Transistor (MOSFET) connected to the TFET in parallel, with the MOSFET including a second source connected to the first source, a second drain connected to the first drain, and a second gate connected to the first gate.
Abstract:
The disclosed system and method detect and correct register file read path errors that may occur as a result of reducing or eliminating supply voltage guardbands and/or frequency guardbands for a CPU, thereby increasing overall energy efficiency of the system.
Abstract:
An integrated circuit (IC) can include M memory banks, where M is greater than 2, and each memory bank is separately accessible according to a received address value; N channels, where N is greater than 2, and each channel includes its own a data connections, address connections, and control input connections for executing a read or write access to one of the memory banks in synchronism with a clock signal; and a controller subsystem configured to control accesses between the channels and the memory banks, including up to an access on every channel on consecutive cycles of the clock signal.
Abstract:
For multi-level interconnect metallization, each metal level maintains a parallel line arrangement within a region, and the lines of each adjacent metal level are orthogonal or otherwise cross with one another. Vertical shunting among levels for routing in different directions employs short paddles that stay within the parallel scheme, and multiple paddles within a region at the same metal level can be co-linear. Parallel lines in the same metal level can be rotated with respect to one another in adjacent regions, for example to better interface with driver circuitry with orthogonal orientations in the different regions.
Abstract:
A circuit includes a first data line, a first plurality of memory cells coupled with the first data line, and a data transfer circuit coupled with the first data line. The data transfer circuit includes an output logic gate. The data transfer circuit is configured to, in a first operation mode in which the first plurality of memory cells is in a standby mode, set an output node of the output logic gate to be free from electrically coupled with a reference voltage and a supply voltage through the output logic gate. The data transfer circuit is configured to, in a second operation mode in which a memory cell of the first plurality of memory cells is selected to be read, set the output node of the output logic gate to be either electrically coupled with the reference voltage or with the supply voltage through the output logic gate.
Abstract:
A non-volatile storage system includes a plurality of groups of connected non-volatile storage elements. Each group comprises multiple connected data non-volatile storage elements and multiple select gates on a common side of the data non-volatile storage elements. The multiple select gates comprise a first select gate and a second select gate. The first select gate has a first threshold voltage for a first subset of the groups and a second threshold voltage for a second subset of the groups due to active area implantation for the second subset of groups that causes the second threshold voltage to be lower than the first threshold voltage. The second select gate of each group has a programmable threshold voltage. Each of the plurality of bit lines are connected to multiple groups of connected non-volatile storage elements.
Abstract:
An intermediate mode is set between the active mode in which a threshold voltage is low and a standby mode in which a threshold voltage is high. When a mode is shifted from the active mode to the standby mode, the threshold voltage for the active mode is raised temporarily to a threshold voltage for the intermediate mode and then the threshold voltage for the intermediate mode is raised to the threshold voltage for the standby mode. When a mode is shifted from the standby mode to the active mode, the threshold voltage for the standby mode is lowered temporarily to the threshold voltage for the intermediate mode and then the threshold voltage for the intermediate mode is lowered to the threshold voltage for the active mode.