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公开(公告)号:US20180337016A1
公开(公告)日:2018-11-22
申请号:US15777977
申请日:2016-12-14
Applicant: NEC Network and Sensor Systems, Ltd.
Inventor: Norio MASUDA , Takashi NAKANO
CPC classification number: H01J23/24 , H01J23/28 , H01J25/42 , H01P3/123 , H01P11/002
Abstract: Provided are a slow wave circuit and a traveling wave tube suitable for an increase in fineness with regard to processing beam holes, and suitable for higher frequencies. A slow wave circuit (10) includes a meandering waveguide (1) and a beam hole (2) that pierces the meandering waveguide (1), and the cross-section of the beam hole (2) in the direction orthogonal to the long direction is in the shape of a polygon having a larger number of sides than a quadrilateral.
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公开(公告)号:US20180191046A1
公开(公告)日:2018-07-05
申请号:US15395023
申请日:2016-12-30
Applicant: Radio Frequency Systems, Inc
Inventor: Yunchi Zhang , Yin-Shing Chong , Gregory J. Lamont
CPC classification number: H01P3/12 , H01P1/2053 , H01P1/208 , H01P7/04 , H01P7/06 , H01P11/002
Abstract: An apparatus, e.g. a cavity resonator, includes a floor and a cover. A conductive post is located between the floor and the cover and has a void oriented along a longitudinal axis of the post. A dielectric spacer is located between the cover and the post and a dielectric rod is located within the void. A resilient dielectric is located within the void between the dielectric spacer and the floor.
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公开(公告)号:US20180177041A1
公开(公告)日:2018-06-21
申请号:US15387278
申请日:2016-12-21
Applicant: Invensas Corporation
Inventor: Shaowu HUANG , Javier A. DELACRUZ
CPC classification number: H05K1/0228 , H01L2224/48091 , H01L2224/48227 , H01P1/2088 , H01P1/39 , H01P3/121 , H01P5/19 , H01P7/065 , H01P11/002 , H01Q13/18 , H05K3/30 , H05K2201/10287 , H01L2924/00014
Abstract: Apparatus, and corresponding method, relates generally to a microelectronic device. In such an apparatus, a first conductive layer is for providing a lower interior surface of a circuit structure. A plurality of wire bond wires are interconnected to the lower interior surface and spaced apart from one another for providing at least one side of the circuit structure. A second conductive layer is for providing an upper interior surface of the circuit structure spaced apart from the lower interior surface by and interconnected to the plurality of wire bond wires. The plurality of wire bond wires, the first conductive layer and the second conductive layer in combination define at least one opening in the at least one side for a signal port of the circuit structure. Such circuit structure may be a signal guide circuit structure, such as for a signal waveguide or signal cavity for example.
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公开(公告)号:US20180034124A1
公开(公告)日:2018-02-01
申请号:US14901490
申请日:2015-12-15
Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
Inventor: Lars Bolander , Ove Persson
CPC classification number: H01P1/042 , H01P5/024 , H01P11/002
Abstract: The present disclosure relates to a waveguide gasket (1) arranged for electrically sealing a waveguide interface (2) between a first contact end (7) and second contact end (8) of the waveguide gasket. The waveguide gasket (1) comprises a plurality of electrically conducting members (3) that are positioned along a circumference (4) along which the waveguide gasket (1) extends. Each electrically conducting member (3) has a first end (5) and a second end (6) compressibly separable by a variable first height (h1) along a first direction (d1). Each first end (5) faces the first contact end (7) and each second end (6) faces the second side contact end (8), where each first contact end (7) and each second contact end (8) are separated by a variable second height (h2) along the first direction (d1), At least one electrically conducting member (3) is arranged to expand only along said circumference (4) when compressed.
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公开(公告)号:US20170334002A1
公开(公告)日:2017-11-23
申请号:US15158219
申请日:2016-05-18
Applicant: General Atomics
Inventor: Michelangelo DiMartino , Charles P. Moeller
CPC classification number: B23C3/02 , B23C3/28 , B23C3/34 , B23C5/14 , B23C2210/088 , B23C2220/36 , B23C2220/40 , B23C2250/12 , B23C2265/12 , H01P3/12 , H01P3/123 , H01P3/127 , H01P11/002
Abstract: An apparatus for cutting annular corrugations in an interior surface of a cylindrical tube having a cutter head comprising a plurality of cutting teeth; a drive shaft coupled to the cutter head for spinning the cutter head; a mandrel coupled to the cutter head, wherein the mandrel defines a longitudinal axis, wherein an axis of rotation of the cutter head is parallel to, but in a position not coaxial with the axis of rotation of the cutter head; an outer eccentric coupled to mandrel, wherein the outer eccentric rotates the mandrel, wherein the axis of rotation orbits around the longitudinal axis.
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公开(公告)号:US20170250454A1
公开(公告)日:2017-08-31
申请号:US15584362
申请日:2017-05-02
Applicant: Radio Frequency Systems Inc.
Inventor: Yin-Shing Chong , Peter Casey , Yunchi Zhang
CPC classification number: H01P11/00 , F16J15/06 , F16J15/0818 , F16J15/32 , F16J15/3268 , H01P1/042 , H01P1/161 , H01P11/002 , H01Q1/002 , H01Q1/02 , H01Q19/12 , Y10T29/49016
Abstract: Sealing portions of an orthomode transducer or another antenna component is accomplished by forming first and second receptacles or channels in one half or portion of the transducer and inserting first and second type of compressible sealing components into the receptacles. Upon attaching additional portions of the transducer the compressible sealing components may be compressed, but the compression is limited to an amount within a compression range to maintain a seal.
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公开(公告)号:US09698459B2
公开(公告)日:2017-07-04
申请号:US14764928
申请日:2014-01-23
Applicant: Rohde & Schwarz GmbH & Co. KG , RPG Radiometer Physics GmbH
Inventor: Christian Pinta , Mathias Nagel , Gerd Hechtfischer , Achim Walber
CPC classification number: H01P3/12 , H01P1/207 , H01P3/087 , H01P11/002 , H05K1/02 , H05K3/007 , H05K2201/09781 , H05K2201/2009 , Y10T29/49158
Abstract: A substrate-based circuit (31) provides a carrier substrate (2), wherein a bond layer (5) is embodied on at least one part of the carrier substrate (2), and wherein a contact layer (6) which forms at least one conductor line (7) and/or at least one antenna element (8) is embodied on at least one first part (51) of the bond layer (5). The carrier substrate (2) provides at least one fastening element (20), which is deposited at the outer region of the carrier substrate (2) and projects beyond the outer region of the carrier substrate (2).
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公开(公告)号:US09680194B2
公开(公告)日:2017-06-13
申请号:US13908542
申请日:2013-06-03
Applicant: Radio Frequency Systems, Inc.
Inventor: Yin-Shing Chong , Peter Casey , Yunchi Zhang
CPC classification number: H01P1/161 , H01P11/001 , H01P11/002
Abstract: Orthomode transducers (OMTs) and methods of fabricating OMTs are disclosed. According to disclosed embodiments, an OMT includes a housing defining an internal waveguide. The housing may be composed of a first cast housing member attached to a second cast housing member. The first housing member may include a first side of the waveguide that is cast into the first housing member. The second housing member may include a second side of the waveguide that is cast into the second housing member. A method of fabricating an OMT may include arranging at least one casting insert in at least one mold, casting the housing in the mold and casting a waveguide in the housing using the at least one casting insert. The disclosed devices and methods provide cost effective solutions for fabricating OMTs of various operating frequencies that share a substantially similar outer housing shape and size.
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公开(公告)号:US20170033427A1
公开(公告)日:2017-02-02
申请号:US15213071
申请日:2016-07-18
Applicant: European Space Agency
CPC classification number: H01P5/12 , H01P1/207 , H01P5/181 , H01P5/227 , H01P7/06 , H01P11/002 , H01P11/007 , H01P11/008
Abstract: A multiport distribution network is provided that supports N inputs and N outputs, where N>1, the multipart distribution network providing an independent distribution path extending from each input to each output, each path being formed from a sequence of at least two fundamental units. Each fundamental unit comprises a circuit formed of multiple resonator cavities and having n input ports for receiving respective input signals, and n output ports for outputting respective output signals, where n>1, and wherein the circuit is configured to: (i) at each input port, split an input signal received at that input port into n equal signal components and provide each of the n signal components to a respective output port of the circuit; and (ii) at each output port, combine the signal components received from the n input ports to form an output signal for that output port. The multipart distribution network is configured to apply the same filter transfer function along each independent distribution path.
Abstract translation: 提供多端口分配网络,其支持N个输入和N个输出,其中N> 1,多分布分配网络提供从每个输入延伸到每个输出的独立分配路径,每个路径由至少两个基本单元的序列形成。 每个基本单元包括由多个谐振器腔形成并具有用于接收相应输入信号的n个输入端口的电路,以及用于输出相应输出信号的n个输出端口,其中n≥1,并且其中该电路被配置为:(i) 输入端口,将在该输入端口接收的输入信号分成n个相等的信号分量,并将n个信号分量中的每一个提供给电路的相应输出端口; 和(ii)在每个输出端口组合从n个输入端口接收的信号分量以形成该输出端口的输出信号。 多部分分配网络被配置为沿着每个独立分配路径应用相同的过滤器传递函数。
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公开(公告)号:US20170018597A1
公开(公告)日:2017-01-19
申请号:US15272913
申请日:2016-09-22
Applicant: Northrop Grumman Systems Corporation
Inventor: Chunbo Zhang , Peter Ngo , Gershon Akerling , Kevin M. Leong , Patty Chang-Chien , Kelly J. Hennig , William R. Deal
IPC: H01L27/146 , H01P11/00 , H01Q13/02 , H01L31/18
CPC classification number: H01L27/14685 , H01L21/76254 , H01L23/055 , H01L23/147 , H01L23/66 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/97 , H01L27/14687 , H01L31/186 , H01L31/1876 , H01L2223/6627 , H01L2223/6633 , H01L2223/6677 , H01L2223/6683 , H01L2224/0401 , H01L2224/13109 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16235 , H01L2224/81022 , H01L2224/81024 , H01L2224/81054 , H01L2224/81191 , H01L2224/81192 , H01L2224/81204 , H01L2224/81805 , H01L2224/81815 , H01L2224/94 , H01L2224/97 , H01L2924/10329 , H01L2924/10335 , H01L2924/12032 , H01L2924/13064 , H01L2924/14215 , H01L2924/1423 , H01L2924/15313 , H01L2924/157 , H01L2924/37001 , H01P11/002 , H01Q13/02 , H01Q23/00 , H01L2924/00 , H01L2224/03 , H01L2224/81 , H01L2924/01079
Abstract: A method and apparatus for integrating individual III-V MMICs into a micromachined waveguide package is disclosed. MMICs are screened prior to integration, allowing only known-good die to be integrated, leading to increased yield. The method and apparatus are used to implement a micro-integrated Focal Plane Array (mFPA) technology used for sub millimeter wave (SMMW) cameras, although many other applications are possible. MMICs of different technologies may be integrated into the same micromachined package thus achieving the same level of technology integration as in multi-wafer WLP integration.
Abstract translation: 公开了一种用于将单个III-V MMIC集成到微加工波导封装中的方法和装置。 MMIC在集成之前进行筛选,仅允许已知的芯片集成,从而提高产量。 该方法和装置用于实现用于亚毫米波(SMMW)相机的微集成焦平面阵列(mFPA)技术,尽管许多其他应用是可能的。 不同技术的MMIC可以集成到相同的微加工包装中,从而实现与多晶圆WLP集成相同的技术集成水平。
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