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1089 条记录 (耗时 0.028 秒)

    Method of sealing an array of cell microstructures using microencapsulated adhesive
    72.
    发明申请
    Method of sealing an array of cell microstructures using microencapsulated adhesive 失效
    使用微胶囊化粘合剂密封细胞微结构阵列的方法

    公开(公告)号：US20050133154A1

    公开(公告)日：2005-06-23

    申请号：US10739621

    申请日：2003-12-18

    申请人： Jurgen Hans Daniel ,  Brent Shawhan Krusor ,  Michael Charles Weisberg

    发明人： Jurgen Hans Daniel ,  Brent Shawhan Krusor ,  Michael Charles Weisberg

    IPC分类号： C09J5/00 ,  C09J201/00 ,  G02F1/1333 ,  G02F1/1341 ,  G02F1/167 ,  G09F9/00 ,  B32B31/00

    CPC分类号： G02F1/133377 ,  G02F1/1341 ,  G02F1/167 ,  Y10T428/24174

    摘要： A method for sealing microstructured cells, which are defined by at least a first substrate and a wall microstructure extending from the first substrate, includes a step of applying a plurality of adhesive microcapsules along at least one of a first side of a second substrate and an exposed end portion of the wall microstructure. The adhesive microcapsules containing an adhesive substance. Another step includes positioning the first side of the second substrate adjacent the end portion of the wall microstructure. Still another step includes rupturing at least a portion of the plurality of adhesive microcapsules dispensing the adhesive substance between the end portion of the wall microstructure and the first side of the second substrate. A microstructure is also provided.

    摘要翻译： 用于密封由至少第一基底和从第一基底延伸的壁微结构限定的微结构细胞的方法包括沿着第二基底的第一侧和第二基底中的至少一个施加多个粘合微胶囊的步骤， 露出端部的壁微结构。 粘合剂微胶囊含有粘合剂物质。 另一步骤包括将第二衬底的第一侧定位成邻近壁微结构的端部。 另一步骤包括破坏在壁微结构的端部与第二基底的第一侧之间分配粘合剂物质的多个粘合微胶囊的至少一部分。 还提供微结构。

    Transfer method and adhesive for transfer
    73.
    发明申请
    Transfer method and adhesive for transfer 审中-公开
    转移方法和粘合剂用于转移

    公开(公告)号：US20050126691A1

    公开(公告)日：2005-06-16

    申请号：US10736185

    申请日：2003-12-15

    申请人： Nobuo Sugino

    发明人： Nobuo Sugino

    IPC分类号： B44C1/17 ,  B44C1/00 ,  B44C1/165 ,  C09J5/00 ,  C09J201/00

    CPC分类号： B44C1/105 ,  B44C1/1712

    摘要： A transfer method is comprised of a step for applying an adhesive for transfer to an upper surface of a pattern for transfer formed on a transfer sheet, the pattern formed by copying or printing, the adhesive spreading over the upper surface of the pattern by surface tension, the adhesive for transfer being one of a hot-melt adhesive or water-soluble or alcohol soluble adhesive including acrylic pressure sensitive adhesive, polyvinyl acetate adhesive, chloroprene rubber adhesive, polyurethane resin adhesive, polyvinyl chloride adhesive, silicon rubber adhesive and the like; and a step for transferring including an over-transferring, the transferring step being performed at least one time and including removing a liner sheet after the part with the adhesive applied to it is pushed or adhered fixedly with heating on a substrate so that everyone can easily perform the transfer work and can transfer to any substrate.

    摘要翻译： 转印方法包括用于将转印用粘合剂施加到转印纸上形成的图案的上表面的步骤，通过复印或印刷形成的图案，粘合剂通过表面张力铺展在图案的上表面上 用于转印的粘合剂是包括丙烯酸压敏粘合剂，聚乙酸乙烯酯粘合剂，氯丁橡胶粘合剂，聚氨酯树脂粘合剂，聚氯乙烯粘合剂，硅橡胶粘合剂等热熔性粘合剂或水溶性或醇溶性粘合剂之一。 以及转印步骤，其中包括过度转印，转印步骤至少进行一次，并且包括在涂布有粘合剂的部分之后移除衬纸，将其加热固定在基板上，使得每个人都可以容易地 执行传输工作并可以转移到任何基板。

    Initiator systems comprising beta-ketone compounds and bonding compositions made therewith
    75.
    发明申请
    Initiator systems comprising beta-ketone compounds and bonding compositions made therewith 有权
    包含β-酮化合物和由其制备的粘合组合物的引发剂体系

    公开(公告)号：US20050107557A1

    公开(公告)日：2005-05-19

    申请号：US10970707

    申请日：2004-10-21

    申请人： Dean Moren

    发明人： Dean Moren

    IPC分类号： C08F4/54 ,  C08F4/00 ,  C09J4/00 ,  C09J11/06 ,  C09J201/00 ,  C08F118/02

    CPC分类号： C09J4/00

    摘要： The invention provides initiator systems capable of initiating polymerization. More specifically, the invention relates to initiator systems comprising a complexed initiator and a β-ketone compound decomplexer. The invention further relates to the use of these initiator systems for initiating polymerization, as well as kits, bonding compositions, and polymerized compositions made therewith, and coated substrates and bonded articles prepared therefrom.

    摘要翻译： 本发明提供了能够引发聚合的引发剂体系。 更具体地，本发明涉及包含络合引发剂和β-酮化合物分解剂的引发剂体系。 本发明还涉及这些引发剂体系用于引发聚合的用途，以及试剂盒，粘合组合物和由其制备的聚合组合物以及由其制备的涂覆的基材和粘合制品。

    Conductive adhesive and piezo-electric device having piezo-electric element mounted thereon using such adhesive
    78.
    发明申请
    Conductive adhesive and piezo-electric device having piezo-electric element mounted thereon using such adhesive 审中-公开
    具有使用这种粘合剂安装在其上的压电元件的导电粘合剂和压电装置

    公开(公告)号：US20050085578A1

    公开(公告)日：2005-04-21

    申请号：US10915218

    申请日：2004-08-09

    申请人： Shuichi Iguchi

    发明人： Shuichi Iguchi

    IPC分类号： C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01B1/00 ,  H01B1/22 ,  H01L21/52 ,  H03H9/02 ,  H03H9/05 ,  H03H9/25 ,  H02N2/00

    CPC分类号： H03H9/1071 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2224/85181 ,  H01L2924/16195 ,  H03H9/0585 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A piezo electric device in which a SAW element 5 is mounted on a base 1 of a package 4 having bonding pads 10,10 connected through bonding wires to corresponding connection terminals 11,11 in the package and having a lid 2 being joined to the base by seam welding and hermetically sealed thereto. The SAW element 5 is bonded and affixed to a mounting surface 6 in the base 1 using a conductive adhesive 7 which contains 80 to 85% resin material by weight and a 20 to 15% flaky conductive filler by weight, or using a conductive adhesive which contains 82.5 to 85% resin material by weight and a 17.5 to 15% conductive filler by weight, wherein the conductive filler comprises a 30% small particulate conductive filler 21 by weight and a 70% large particulate conductive filler 22 by weight.

    摘要翻译： 一种压电装置，其中SAW元件5安装在具有接合焊盘10,10的封装4的基座1上，接合焊盘10,10通过接合线连接到封装中的相应的连接端子11,11，并且具有与基座 通过缝焊和气密密封。 SAW元件5使用包含重量百分比为80-85％的树脂材料的导电粘合剂7和重量为20至15％的片状导电填料或使用导电粘合剂将导电粘合剂7粘合并固定到基座1中的安装表面6上， 含有82.5至85重量％的树脂材料和17.5至15重量％的导电填料，其中导电填料包含30重量％的小颗粒导电填料21和70重量％的大颗粒状导电填料22。

    Laser module
    79.
    发明申请
    Laser module 有权
    激光模块

    公开(公告)号：US20050074039A1

    公开(公告)日：2005-04-07

    申请号：US10954245

    申请日：2004-10-01

    申请人： Teruhiko Kuramachi ,  Fusao Yamanaka ,  Kazuhiko Nagano

    发明人： Teruhiko Kuramachi ,  Fusao Yamanaka ,  Kazuhiko Nagano

    IPC分类号： G02B6/42 ,  C09J11/04 ,  C09J11/06 ,  C09J163/00 ,  C09J171/02 ,  C09J201/00 ,  H01S3/10 ,  H01S5/00 ,  H01S5/02 ,  H01S5/022 ,  H01S5/024 ,  H01S5/40

    CPC分类号： G02B6/4206 ,  G02B6/4239 ,  H01L2224/48091 ,  H01L2924/12044 ,  H01S5/005 ,  H01S5/0222 ,  H01S5/02248 ,  H01S5/02284 ,  H01S5/4012 ,  H01S5/4031 ,  H01L2924/00014 ,  H01L2924/00

    摘要： In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, generation of organic volatile gas is suppressed in the container and life of the module is prolonged. In a laser module comprising a hermetically sealed container having inside a semiconductor laser device whose emission wavelength is 350˜450 nm, optical components whose organic volatile gas generation measured by GC/MS is 10 μg/g or less at 150° C. are positioned in the container. In addition, as an organic adhesive to fix the optical components such as a collimating lens is used an organic adhesive whose organic volatile gas generation measured by GC/MS is 100 μg/g or less at 150° C.

    摘要翻译： 在包含发光波长为350〜450nm的半导体激光装置的内部的气密密封容器的激光模块中，在容器中抑制有机挥发性气体的产生，延长了模块的使用寿命。 在包括发光波长为350〜450nm的半导体激光装置的内部的气密密封容器的激光模块中，通过GC / MS测定的有机挥发性气体的产生在150℃下为10mug / g以下的光学部件被定位 在容器中 此外，作为用于固定准直透镜等光学部件的有机粘合剂，使用通过GC / MS测定的有机挥发性气体产生在150℃下为100mug / g以下的有机粘合剂。