公开(公告)号：US06432778B1

公开(公告)日：2002-08-13

申请号：US09682216

申请日：2001-08-07

Applicant: Erh-Kun Lai ,  Ying-Tso Chen ,  Chien-Hung Liu ,  Shyi-Shuh Pan ,  Shou-Wei Huang

Inventor： Erh-Kun Lai ,  Ying-Tso Chen ,  Chien-Hung Liu ,  Shyi-Shuh Pan ,  Shou-Wei Huang

IPC: H01L218236

CPC classification number: H01L27/11266 ,  H01L21/823412 ,  H01L21/823418 ,  H01L21/82345 ,  H01L27/105 ,  H01L27/1052 ,  H01L27/11293 ,  H01L27/11573 ,  Y10S438/954

Abstract: An ONO dielectric layer is formed on the surface of a substrate, and then a plurality of bit lines are formed in the substrate by utilizing a photolithography and an ion implantation process. Thereafter the ONO dielectric layer in the periphery area is removed and the threshold voltage of the periphery transistor is adjusted. After the ONO dielectric layer in the read only memory area is removed, and a buried drain oxide layer and a plurality of gate oxide layers are formed atop each bit line and the surface of each device respectively. Then each word line in the memory area and each gate of each periphery transistor in the periphery area is formed so as to simultaneously form at least a nitride read only memory in the nitride read only memory area and a high, low threshold voltage device in the read only memory area. Finally the threshold voltage of the high threshold voltage device is adjusted by utilizing a ROM code implantation process.

Abstract translation: 在衬底的表面上形成ONO电介质层，然后利用光刻和离子注入工艺在衬底中形成多个位线。 此后，去除外围区域中的ONO电介质层，并调整周边晶体管的阈值电压。 在只读存储器区域中的ONO介电层被去除之后，并且在每个位线和每个器件的表面上分别形成掩埋的漏极氧化物层和多个栅极氧化物层。 然后形成周边区域的存储区域和每个周边晶体管的每个栅极的每个字线，以便在氮化物只读存储器区域和高，低阈值电压器件中同时形成至少一个氮化物只读存储器 只读存储区。 最后，通过利用ROM代码注入过程来调整高阈值电压器件的阈值电压。

公开(公告)号：US08867832B2

公开(公告)日：2014-10-21

申请号：US13756874

申请日：2013-02-01

Applicant: Shih-Chang Hsia ,  Chien-Hung Liu

Inventor： Shih-Chang Hsia ,  Chien-Hung Liu

IPC: G06K9/00 ,  G06K9/34 ,  G06K9/40 ,  G06K9/32 ,  H04N11/02 ,  G06T7/00

CPC classification number: G06T5/005 ,  G06T7/11 ,  G06T7/174 ,  G06T7/254 ,  G06T2207/10016

Abstract: A method for detecting and removing scrolling texts comprising a step of using an adaptive transient difference processing of video communication to conduct frame calculation, wherein the adaptive transient difference processing takes first N frames fjkt−N and a current frame fjkt, and subtracts them to obtain a frame difference; and if the frame difference is greater than a threshold value, it is determined that the current frame fjkt has scrolling texts; and interpolates the first N frames before the current position of the scrolling texts to replace the current frame fjkt to achieve the goal of hiding the scrolling texts during video communication to enhance the viewing effect.

Abstract translation: 一种用于检测和去除滚动文本的方法，包括使用视频通信的自适应瞬时差分处理进行帧计算的步骤，其中自适应瞬态差分处理采取前N帧fjkt-N和当前帧fjkt，并且减去它们以获得 一帧差异; 并且如果帧差大于阈值，则确定当前帧fjkt具有滚动文本; 并且在滚动文本的当前位置之前内插前N个帧以替换当前帧fjkt，以实现在视频通信期间隐藏滚动文本以增强观看效果的目的。

公开(公告)号：US08823179B2

公开(公告)日：2014-09-02

申请号：US12667383

申请日：2008-06-13

Applicant: Chia-Lun Tsai ,  Wen-Cheng Chien ,  Po-Han Lee ,  Wei-Ming Chen ,  Chien-Hung Liu ,  Ying-Nan Wen

Inventor： Chia-Lun Tsai ,  Wen-Cheng Chien ,  Po-Han Lee ,  Wei-Ming Chen ,  Chien-Hung Liu ,  Ying-Nan Wen

IPC: H01L23/48 ,  H01L27/146 ,  H01L21/768 ,  H01L23/00

CPC classification number: H01L23/481 ,  H01L21/76898 ,  H01L24/12 ,  H01L27/14618 ,  H01L27/14683 ,  H01L2224/05001 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05548 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2924/01021 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2224/05099

Abstract: An embodiment of the present invention provides an electronic device package, which includes a chip having a first surface and an opposite second surface and a trench extending into a body of the chip along a direction from the second surface to the first surface, wherein a bottom portion of the trench includes at least two contact holes.

Abstract translation: 本发明的实施例提供了一种电子器件封装，其包括具有第一表面和相对的第二表面的芯片以及沿着从第二表面到第一表面的方向延伸到芯片的主体中的沟槽，其中底部 沟槽的一部分包括至少两个接触孔。

公开(公告)号：US20140219555A1

公开(公告)日：2014-08-07

申请号：US13756874

申请日：2013-02-01

Applicant: Shih-Chang Hsia ,  Chien-Hung Liu

Inventor： Shih-Chang Hsia ,  Chien-Hung Liu

IPC: G06T7/00

CPC classification number: G06T5/005 ,  G06T7/11 ,  G06T7/174 ,  G06T7/254 ,  G06T2207/10016

Abstract: A method for detecting and removing scrolling texts comprising a step of using an adaptive transient difference processing of video communication to conduct frame calculation, wherein the adaptive transient difference processing takes first N frames fjkt−N and a current frame fjkt, and subtracts them to obtain a frame difference; and if the frame difference is greater than a threshold value, it is determined that the current frame fjkt has scrolling texts; and interpolates the first N frames before the current position of the scrolling texts to replace the current frame fjkt to achieve the goal of hiding the scrolling texts during video communication to enhance the viewing effect.

Abstract translation: 一种用于检测和去除滚动文本的方法，包括使用视频通信的自适应瞬时差分处理进行帧计算的步骤，其中自适应瞬态差分处理采取前N帧fjkt-N和当前帧fjkt，并且减去它们以获得 一帧差异; 并且如果帧差大于阈值，则确定当前帧fjkt具有滚动文本; 并且在滚动文本的当前位置之前内插前N个帧以替换当前帧fjkt，以实现在视频通信期间隐藏滚动文本以增强观看效果的目的。

公开(公告)号：US08713227B2

公开(公告)日：2014-04-29

申请号：US13444315

申请日：2012-04-11

Applicant: Chien-Hung Liu

Inventor： Chien-Hung Liu

IPC: G06F13/12 ,  G06F12/00

CPC classification number: G06F3/0607 ,  G06F3/0661 ,  G06F3/0676

Abstract: An accessing device communicating with a host device and including a connector, a storage unit and a control unit is disclosed. The connector connects to the host device. The storage unit stores data. The control unit communicates with the storage unit according to a first communication protocol and communicates with the host device via the connector according to a second communication protocol. The control unit determines the kind of the second communication protocol according to selection information.

Abstract translation: 公开了一种与主机设备通信并包括连接器，存储单元和控制单元的访问设备。 连接器连接到主机设备。 存储单元存储数据。 控制单元根据第一通信协议与存储单元通信，并根据第二通信协议经由连接器与主机设备进行通信。 控制单元根据选择信息确定第二通信协议的种类。

公开(公告)号：US08497534B2

公开(公告)日：2013-07-30

申请号：US12788091

申请日：2010-05-26

Applicant: Chien-Hung Liu ,  Cheng-Te Chou

Inventor： Chien-Hung Liu ,  Cheng-Te Chou

IPC: H01L23/48 ,  H01L23/02 ,  H01L21/00

CPC classification number: H01L27/14618 ,  H01L21/76898 ,  H01L23/3114 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/83 ,  H01L24/93 ,  H01L24/94 ,  H01L25/0657 ,  H01L27/14683 ,  H01L2224/0231 ,  H01L2224/0237 ,  H01L2224/02372 ,  H01L2224/0239 ,  H01L2224/0401 ,  H01L2224/05024 ,  H01L2224/051 ,  H01L2224/05569 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/056 ,  H01L2224/05638 ,  H01L2224/05688 ,  H01L2224/13022 ,  H01L2224/29007 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32052 ,  H01L2224/32145 ,  H01L2224/33181 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/8385 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01021 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/01014 ,  H01L2924/053 ,  H01L2924/01 ,  H01L2224/83 ,  H01L2224/11 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552

Abstract: The invention provides a chip package and fabrication method thereof. In one embodiment, the chip package includes: a semiconductor substrate having opposite first and second surfaces, at least one bond pad region and at least one device region; a plurality of conductive pad structures disposed on the bond pad region at the first surface of the semiconductor substrate; a plurality of heavily doped regions isolated from one another, underlying and electrically connected to the conductive pad structures; and a plurality of conductive bumps underlying the heavily doped regions and electrically connected to the conductive pad structures through the heavily-doped regions.

Abstract translation: 本发明提供一种芯片封装及其制造方法。 在一个实施例中，芯片封装包括：具有相对的第一和第二表面，至少一个焊盘区域和至少一个器件区域的半导体衬底; 多个导电焊盘结构，设置在半导体衬底的第一表面处的焊盘区域上; 多个彼此隔离的重掺杂区域，其下面并电连接到导电焊盘结构; 以及在重掺杂区域下面的多个导电凸块，并通过重掺杂区域电连接到导电焊盘结构。

公开(公告)号：US08476738B2

公开(公告)日：2013-07-02

申请号：US12826251

申请日：2010-06-29

Applicant: Chien-Hung Liu

Inventor： Chien-Hung Liu

IPC: H01L29/06

CPC classification number: H01L21/76898 ,  H01L21/6835 ,  H01L21/76831 ,  H01L23/481 ,  H01L24/11 ,  H01L24/13 ,  H01L24/24 ,  H01L24/29 ,  H01L24/32 ,  H01L24/82 ,  H01L24/83 ,  H01L24/92 ,  H01L24/93 ,  H01L24/95 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L27/14618 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2224/0401 ,  H01L2224/05551 ,  H01L2224/0557 ,  H01L2224/1132 ,  H01L2224/1146 ,  H01L2224/11849 ,  H01L2224/12105 ,  H01L2224/2405 ,  H01L2224/241 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/24226 ,  H01L2224/245 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32147 ,  H01L2224/32155 ,  H01L2224/83005 ,  H01L2224/83203 ,  H01L2224/83805 ,  H01L2224/8385 ,  H01L2224/8389 ,  H01L2224/83893 ,  H01L2224/9202 ,  H01L2224/92144 ,  H01L2224/93 ,  H01L2224/94 ,  H01L2224/95 ,  H01L2225/06551 ,  H01L2225/06565 ,  H01L2225/1011 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/141 ,  H01L2924/143 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2224/82 ,  H01L2224/11 ,  H01L2224/05552 ,  H01L2924/00

Abstract: An electronic component package is described. The electronic component package includes a first electronic component package module mounted on a surface of a packaging layer. A second electronic component package module laminated on a bottom of the first electronic component package module is mounted on a surface of a packaging layer. The first and second electronic component package modules respectively include at least two semiconductor chips laminated. A first redistribution layer is between the first and the second electronic component package modules, electrically connected to the first and the second electronic component package modules. A conductive bump is mounted on a bottom of the second electronic component package module, electrically connected to the second electronic component package module.

Abstract translation: 描述电子部件包装。 电子部件封装包括安装在包装层的表面上的第一电子部件封装模块。 层叠在第一电子部件封装模块的底部上的第二电子部件封装模块安装在包装层的表面上。 第一和第二电子部件封装模块分别包括层叠的至少两个半导体芯片。 第一再分配层位于第一和第二电子部件封装模块之间，电连接到第一和第二电子部件封装模块。 导电凸块安装在第二电子部件封装模块的底部，电连接到第二电子部件封装模块。

公开(公告)号：US08466376B2

公开(公告)日：2013-06-18

申请号：US12868687

申请日：2010-08-25

Applicant: Po-Chuan Hsieh ,  Yu-Chang Pai ,  Chien-Hung Liu

Inventor： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Chien-Hung Liu

IPC: H05K7/20

CPC classification number: H05K9/0041

Abstract: An enclosure of an electronic device includes a ventilation plate. The ventilation plate is a grid including a number of crisscrossed connection bars and a number of through holes defined by the connection bars. A tab is formed at each of the connection bars bounding each of the through holes. The tabs are substantially angled from a plane of the grid to elongate a path electromagnetic signals must travel to pass through the ventilation plate. The enclosure with the shields can shield the electronic device from EMI.

Abstract translation: 电子设备的外壳包括通风板。 通风板是包括多个十字交叉的连接杆和由连接杆限定的多个通孔的格栅。 每个连接条形成在每个通孔上的突片。 突片从网格的平面基本成角度，以延长电磁信号必须行进以通过通风板的路径。 带屏蔽的外壳可以屏蔽电子设备免受EMI影响。

公开(公告)号：US08389873B2

公开(公告)日：2013-03-05

申请号：US12841125

申请日：2010-07-21

Applicant: Po-Chuan Hsieh ,  Yu-Chang Pai ,  Chien-Hung Liu ,  Shou-Kuo Hsu

Inventor： Po-Chuan Hsieh ,  Yu-Chang Pai ,  Chien-Hung Liu ,  Shou-Kuo Hsu

IPC: H05K9/00 ,  H02B1/56

CPC classification number: H05K9/0041 ,  H05K9/0024

Abstract: An enclosure of an electronic device includes a plate. The plate defines a number of through holes. A number of shields extend from the plate corresponding to the through holes. Each shield extends outwards from the outer surface of the plate, surrounding and partly covering a corresponding through hole. The enclosure with the shields can shield the electronic device from EMI.

Abstract translation: 电子设备的外壳包括板。 该板限定了多个通孔。 多个屏蔽件从对应于通孔的板延伸。 每个护罩从板的外表面向外延伸，围绕并部分覆盖相应的通孔。 带屏蔽的外壳可以屏蔽电子设备免受EMI影响。

公开(公告)号：US08305774B2

公开(公告)日：2012-11-06

申请号：US12855903

申请日：2010-08-13

Applicant: Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

Inventor： Yu-Chang Pai ,  Po-Chuan Hsieh ,  Chien-Hung Liu ,  Shou-Kuo Hsu

IPC: H05K9/00

CPC classification number: H05K9/0041

Abstract: An enclosure includes a plate. The plate defines a number of through holes. A hollow shield extends from the edges bounding each through hole. A top side of the shield opposite to the plate is smaller than a bottom side of the shield which is connected to the edges of the through hole. The enclosure can better shield electromagnetic interference (EMI) from the electronic device.

Abstract translation: 外壳包括一个板。 该板限定了多个通孔。 中空的护罩从每个通孔的边缘延伸。 屏蔽件与板的相对的顶侧小于屏蔽件的底部侧，该底部侧连接到通孔的边缘。 外壳可以更好地屏蔽电子设备的电磁干扰（EMI）。