利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

191 条记录 (耗时 0.035 秒)

    PECVD process chamber backing plate reinforcement
    82.
    发明授权
    PECVD process chamber backing plate reinforcement 有权
    PECVD处理室背板加强

    公开(公告)号：US08733279B2

    公开(公告)日：2014-05-27

    申请号：US12037885

    申请日：2008-02-26

    申请人： John M. White ,  Shinichi Kurita ,  Robin L. Tiner

    发明人： John M. White ,  Shinichi Kurita ,  Robin L. Tiner

    IPC分类号： C23C16/00 ,  H01L21/306 ,  C23F1/00

    CPC分类号： H01J37/32449 ,  C23C16/44 ,  C23C16/5096 ,  H01J37/3244 ,  H01J37/32495 ,  H01J37/32623 ,  H01J2237/3321 ,  H01J2237/3325

    摘要： The present invention generally comprises a backing plate reinforcement apparatus for use in a plasma enhanced chemical vapor deposition apparatus. When processing large area substrates, the backing plate extending across the chamber may also be quite large. By supporting a central area of the backing plate with a frame structure, the backing plate may be maintained substantially planar. Alternatively, as necessary, the contour of the backing plate may be adjusted to suit the particular needs of the process.

    摘要翻译： 本发明通常包括用于等离子体增强化学气相沉积设备中的背板加强装置。 当处理大面积基板时，延伸穿过室的背板也可能相当大。 通过用框架结构支撑背板的中心区域，背板可以保持基本上平面。 或者，根据需要，可以调整背板的轮廓以适应该方法的特定需要。

    Load lock chamber with decoupled slit valve door seal compartment
    83.
    发明授权
    Load lock chamber with decoupled slit valve door seal compartment 有权
    加载锁定室与分离的狭缝阀门密封隔间

    公开(公告)号：US08124907B2

    公开(公告)日：2012-02-28

    申请号：US11782267

    申请日：2007-07-24

    申请人： Jae-Chull Lee ,  Suhail Anwar ,  Shinichi Kurita

    发明人： Jae-Chull Lee ,  Suhail Anwar ,  Shinichi Kurita

    IPC分类号： B23K10/00

    CPC分类号： H01L21/67126 ,  H01L21/67201

    摘要： Embodiments of the invention include a load lock chamber having a decoupled slit valve door seal compartment. In one embodiment, a load lock chamber includes a main assembly, a first slit valve door seal compartment and a seal assembly. The main assembly has a substrate transfer cavity formed therein. Two substrate access ports are formed through the main assembly and fluidly couple to the cavity. The first slit valve door seal compartment has an aperture disposed adjacent to and aligned with one of the access ports. The first slit valve door seal compartment is decoupled from the main assembly. The seal assembly couples the first slit valve door seal compartment to the main assembly.

    摘要翻译： 本发明的实施例包括具有解耦的狭缝阀门密封隔室的装载锁定室。 在一个实施例中，负载锁定室包括主组件，第一狭缝阀门密封室和密封组件。 主组件具有形成在其中的衬底传送腔。 两个基板通道端口通过主组件形成并且流体耦合到空腔。 第一狭缝阀门密封隔室具有邻近并与其中一个进入口相对设置的孔。 第一个狭缝阀门密封隔间与主组件分离。 密封组件将第一狭缝阀门密封隔间连接到主组件。

    Multiple slot load lock chamber and method of operation
    85.
    发明授权
    Multiple slot load lock chamber and method of operation 有权
    多槽加载锁定室和操作方法

    公开(公告)号：US08061949B2

    公开(公告)日：2011-11-22

    申请号：US12709713

    申请日：2010-02-22

    申请人： Shinichi Kurita ,  Suhail Anwar ,  Jae-Chull Lee

    发明人： Shinichi Kurita ,  Suhail Anwar ,  Jae-Chull Lee

    IPC分类号： B65G49/07

    CPC分类号： H01L21/67201 ,  C23C14/566 ,  H01L21/67109 ,  H01L21/67126 ,  H01L21/67167 ,  H01L21/67178 ,  H01L21/6719 ,  H01L21/67742 ,  H01L21/67751 ,  Y10S414/139

    摘要： Embodiments of the invention include a load lock chamber, a processing system having a load lock chamber and a method for transferring substrates between atmospheric and vacuum environments. In one embodiment, the method includes maintaining a processed substrate within a transfer cavity formed in a chamber body for two venting cycles. In another embodiment, the method includes transferring a substrate from a transfer cavity to a heating cavity formed in the chamber body, and heating the substrate in the heating cavity. In another embodiment, a load lock chamber includes a chamber body having substrate support disposed in a transfer cavity. The substrate support is movable between a first elevation and a second elevation. A plurality of grooves are formed in at least one of a ceiling or floor of the transfer cavity and configured to receive at least a portion of the substrate support when located in the second elevation.

    摘要翻译： 本发明的实施例包括负载锁定室，具有负载锁定室的处理系统和用于在大气和真空环境之间传送衬底的方法。 在一个实施例中，该方法包括将经处理的基板保持在形成在室主体中的传送空腔内用于两个排气循环。 在另一个实施例中，该方法包括将基底从传递腔转移到形成在腔体中的加热腔，以及加热加热腔中的基底。 在另一个实施例中，负载锁定室包括具有设置在传送腔中的衬底支撑件的室主体。 衬底支撑件可在第一高度和第二高度之间移动。 多个槽形成在传送腔的天花板或地板中的至少一个中，并且被配置为当位于第二高度时容纳衬底支撑件的至少一部分。

    Transfer chamber for vacuum processing system
    86.
    发明授权
    Transfer chamber for vacuum processing system 有权
    真空处理系统传送室

    公开(公告)号：US08033772B2

    公开(公告)日：2011-10-11

    申请号：US11386257

    申请日：2006-03-21

    申请人： Shinichi Kurita ,  Emanuel Beer ,  Hung T. Nguyen ,  Wendell T. Blonigan

    发明人： Shinichi Kurita ,  Emanuel Beer ,  Hung T. Nguyen ,  Wendell T. Blonigan

    IPC分类号： C23C14/34 ,  C23C16/00 ,  B65H1/00

    CPC分类号： H01L21/67196 ,  C23C14/566 ,  C23C16/54 ,  H01L21/67126 ,  H01L21/67739 ,  H01L21/67748 ,  Y10S414/135

    摘要： A transfer chamber for a substrate processing tool includes a main body having side walls adapted to couple to at least one processing chamber and at least one load lock chamber. The main body houses at least a portion of a robot adapted to transport a substrate between the processing chamber and the load lock chamber. A lid couples to and seals a top of the main body of the transfer chamber. The transfer chamber also has a domed bottom adapted to couple to and to seal a bottom portion of the main body of the transfer chamber.

    摘要翻译： 用于基板处理工具的传送室包括具有适于耦合到至少一个处理室和至少一个装载锁定室的侧壁的主体。 主体容纳至少一部分适于在处理室和加载锁定室之间输送基板的机器人。 盖子连接到并密封传送室主体的顶部。 传送室还具有适于联接到传送室的主体的底部并且密封传送室的主体的底部的圆顶形底部。

    Dual substrate loadlock process equipment
    87.
    发明授权
    Dual substrate loadlock process equipment 有权
    双基板负载锁定工艺设备

    公开(公告)号：US07976635B2

    公开(公告)日：2011-07-12

    申请号：US12691612

    申请日：2010-01-21

    申请人： Shinichi Kurita ,  Wendell T. Blonigan ,  Akihiro Hosokawa

    发明人： Shinichi Kurita ,  Wendell T. Blonigan ,  Akihiro Hosokawa

    IPC分类号： H01L21/677 ,  H01L23/34 ,  F25D23/12

    CPC分类号： H01L21/68742 ,  B65G49/068 ,  B65G2249/02 ,  B65G2249/04 ,  C23C14/566 ,  C23C14/568 ,  C23C16/54 ,  H01L21/67103 ,  H01L21/67109 ,  H01L21/67167 ,  H01L21/67201 ,  H01L21/67739 ,  H01L21/67745 ,  H01L21/67748

    摘要： One embodiment relates to a loadlock having a first support structure therein to support one unprocessed substrate and a second support structure therein to support one processed substrate. The first support structure is located above the second support structure. The loadlock includes an elevator to control the vertical position of the support structures. The loadlock also includes a first aperture to permit insertion of an unprocessed substrate into the loadlock and removal of a processed substrate from the loadlock, as well as a second aperture to permit removal of an unprocessed substrate from the loadlock and insertion of a processed substrate into the loadlock. A cooling plate is also located in the loadlock. The cooling plate includes a surface adapted to support a processed substrate thereon. A heating device may be located in the loadlock above the first support structure.

    摘要翻译： 一个实施例涉及一种其中具有第一支撑结构的负载锁，用于支撑一个未处理的基板和其中的第二支撑结构以支撑一个处理的基板。 第一支撑结构位于第二支撑结构的上方。 负载锁包括用于控制支撑结构的垂直位置的电梯。 负载锁还包括第一孔，以允许将未处理的衬底插入到装载锁中并从加载锁中移除经处理的衬底，以及第二孔，以允许将未处理的衬底从负载锁上移除并将经处理的衬底插入 负载锁。 一个冷却板也位于负载锁中。 冷却板包括适于在其上支撑经处理的基板的表面。 加热装置可以位于第一支撑结构上方的装载锁中。

    ANODIZED SHOWERHEAD
    88.
    发明申请
    ANODIZED SHOWERHEAD 有权
    阳光淋浴

    公开(公告)号：US20100288197A1

    公开(公告)日：2010-11-18

    申请号：US12779167

    申请日：2010-05-13

    申请人： Soo Young Choi ,  Suhail Anwar ,  Gaku Furuta ,  Beom Soo Park ,  Robin L. Tiner ,  John M. White ,  Shinichi Kurita

    发明人： Soo Young Choi ,  Suhail Anwar ,  Gaku Furuta ,  Beom Soo Park ,  Robin L. Tiner ,  John M. White ,  Shinichi Kurita

    IPC分类号： C23C16/455 ,  C23C16/00

    CPC分类号： C23C16/45565 ,  C23C16/4404 ,  C23C16/5096 ,  H01J37/32091 ,  H01J37/32449 ,  H01J37/32541 ,  H01J37/32559 ,  H01J37/32577

    摘要： Embodiments disclosed herein generally relate to an apparatus having an anodized gas distribution showerhead. In large area, parallel plate RF processing chambers, mastering the RF return path can be challenging. Arcing is a frequent problem encountered in RF processing chambers. To reduce arcing in RF processing chambers, straps may be coupled to the susceptor to shorten the RF return path, a ceramic or insulating or anodized shadow frame may be coupled to the susceptor during processing, and an anodized coating may be deposited onto the edge of the showerhead that is nearest the chamber walls. The anodized coating may reduce arcing between the showerhead and the chamber walls and therefore enhance film properties and increase deposition rate.

    摘要翻译： 本文公开的实施方案通常涉及具有阳极氧化气体分配喷头的装置。 在大面积的平行板RF处理室中，掌握RF返回路径可能具有挑战性。 射频是RF处理室遇到的一个常见问题。 为了减少RF处理室中的电弧，带可以耦合到基座以缩短RF返回路径，陶瓷或绝缘或阳极氧化的阴影框架可以在处理期间耦合到基座，并且阳极化涂层可以沉积在 最靠近室壁的淋浴头。 阳极化涂层可以减少喷头和室壁之间的电弧，并因此增强膜的性质并增加沉积速率。

    Load lock chamber with heater in tube
    89.
    发明授权
    Load lock chamber with heater in tube 有权
    带加热器的加载锁定室

    公开(公告)号：US07822324B2

    公开(公告)日：2010-10-26

    申请号：US11782290

    申请日：2007-07-24

    申请人： Suhail Anwar ,  Jae-Chull Lee ,  Shinichi Kurita

    发明人： Suhail Anwar ,  Jae-Chull Lee ,  Shinichi Kurita

    IPC分类号： F26B3/30

    CPC分类号： H01L21/67115 ,  C23C16/54 ,  H01L21/67201

    摘要： Embodiments of the invention include a heated load lock chamber. In one embodiment, a heated load lock chamber includes a chamber body having a plurality of lamp assembles disposed at least partially therein. Each lamp assembly includes a transmissive tube housing a lamp. The transmissive tube extends into the chamber body and provides a pressure barrier isolating the lamp from the interior volume of the load lock chamber. In another embodiment, an open end of the transmissive tube extends through a sidewall of the chamber body. A closed end of the transmissive tube is surrounded by the interior volume of the chamber body and is supported below a top of the chamber body in a spaced apart relation. The open end of the tube is sealed to the sidewall of the chamber body such that the interior of the tube is open to atmosphere.

    摘要翻译： 本发明的实施例包括加热的负载锁定室。 在一个实施例中，加热的负载锁定室包括具有至少部分地设置在其中的多个灯组件的室主体。 每个灯组件包括容纳灯的透射管。 透射管延伸到室主体中并提供将灯隔离到负载锁定室的内部空间的压力屏障。 在另一个实施例中，透射管的开口端延伸穿过腔体的侧壁。 透射管的封闭端被室主体的内部空间包围，并以间隔的关系支撑在腔室主体的顶部下方。 管的开口端被密封到腔体的侧壁，使得管的内部对大气敞开。