摘要:
Systems and methods for the protection of optics are provided. In one example embodiment, a laser processing system is provided, the laser processing system comprising a laser source and an optic. The laser processing system may further comprise at least one of a liquid delivery mechanism configured to deposit liquid on the optic and an evacuation mechanism.
摘要:
The present invention relates to a device for the treatment of a workpiece, in particular of a substantially flat substrate, comprising a table (2) for supporting the workpiece (5), a flow generation apparatus (6, 11) producing a gas flow (22) on a top face (17.1, 17.2) of the table (2) in a region between the workpiece (5) and the top face (17.1, 17.2) of the table (2), on which gas flow the workpiece (5) is supported during the treatment.
摘要:
Improved slats for cutting tables are provided by forming from steel elongate receiver plates having a plurality of receiver slats and forming from copper a plurality of insert members. The insert members each have an interlocking section and a tip section. The interlocking sections of the insert members are mated and pressed into the receiver slots so the tip sections extend above the top of the receiver plates and are able to support a work piece above and away from the receiver plates during a cutting operation.
摘要:
A welding tool is configured with a housing enclosing a fiber laser system which is operative to produce a weld seam for connecting two workpieces. The fiber laser system includes a focusing optic configured to focus the output beam of the system so that it propagates through an elongated slit formed in the bottom of the housing. The fiber laser system is capable to move along a predetermined path extending parallel to the longitudinal direction of the slit and limited by the perimeter thereof. The output beam is generated only when the slit sits upon at least one of the workpieces.
摘要:
The invention relates to a method for the generative production of a component (2) and to a device for carrying out such a method, having the following steps: applying a material layer with a constant layer thickness; solidifying a region of the material layer according to a component cross section; generating an eddy-current scan of the solidified region, a scan depth corresponding to a multiple of the layer thickness; determining a material characterization of the solidified region taking into consideration a previous eddy-current scan of solidified regions of lower-lying material layers; and repeating the steps until the component (2) is assembled. An electric material characterization of each individual layer is determined using a recursive algorithm of individual measurements (monolayer by monolayer), and thus the entire component is tested step by step completely in a highly resolved manner.
摘要:
A support comprises a ceramic supporting surface, on which a circuit board may be placed for cutting to be performed by means of optical radiation generated by a laser. The ceramic supporting surface remains unchanged as said laser radiation hits it.
摘要:
Methods and systems are provided for the split and separation of a layer of desired thickness of crystalline semiconductor material containing optical, photovoltaic, electronic, micro-electro-mechanical system (MEMS), or optoelectronic devices, from a thicker donor wafer using laser irradiation.
摘要:
A welding tool is configured with a housing enclosing a fiber laser system which is operative to produce a weld seam for connecting two workpieces. The fiber laser system includes a focusing optic configured to focus the output beam of the system so that it propagates through an elongated slit formed in the bottom of the housing. The fiber laser system is capable to move along a predetermined path extending parallel to the longitudinal direction of the slit and limited by the perimeter thereof. The output beam od generated only when the slit sits upon at least one of the workpieces.
摘要:
A laser processing system includes a metal platform having a metal surface wherein at least a portion of the platform surface is substantially planar with a substantially smooth topography. A laser source is configured to generate a laser beam having a focal point that is directed toward a substantially planar portion of the platform surface. A motion mechanism is configured to move at least one of the metal platform and the focal point along at least one axis. A restraining mechanism restrains a film against the platform surface such that an adjoining surface of the restrained film remains in intimate contact with the surface. A controller is configured to operate the laser source, the motion mechanism or both to cut the restrained film in a predetermined pattern with a generated laser beam such that the cut does not extend through the adjoining surface of the restrained film.
摘要:
A method of generating a hole or well in an electrically insulating or semiconducting substrate, a hole or well in a substrate generated by this method, and an array of holes or wells in a substrate generated by the method.