公开(公告)号：US20240347774A1

公开(公告)日：2024-10-17

申请号：US18594433

申请日：2024-03-04

申请人： THE REGENTS OF THE UNIVERSITY OF CALIFORNIA

发明人： Cyrus Rustomji ,  Sungho Jin ,  Taekyoung Kim ,  Jungmin You ,  Joseph Wang ,  Duyoung Choi

IPC分类号： H01M10/0569 ,  C25D3/42 ,  C25D3/44 ,  C25D3/50 ,  C25D3/54 ,  C25D5/00 ,  C25D9/08 ,  C25D17/02 ,  H01G11/22 ,  H01G11/46 ,  H01G11/60 ,  H01G11/78 ,  H01G11/86 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/0564 ,  C25D21/00 ,  H01G11/62 ,  H01M4/38

CPC分类号： H01M10/0569 ,  C25D3/42 ,  C25D3/44 ,  C25D3/50 ,  C25D3/54 ,  C25D5/003 ,  C25D9/08 ,  C25D17/02 ,  H01G11/22 ,  H01G11/46 ,  H01G11/60 ,  H01G11/78 ,  H01G11/86 ,  H01M10/052 ,  H01M10/0525 ,  H01M10/0564 ,  C25D21/00 ,  H01G11/62 ,  H01M4/382 ,  H01M2300/0028 ,  H01M2300/0031 ,  H01M2300/0034 ,  Y02E60/13

摘要： Disclosed are novel electrolytes, and techniques for making and devices using such electrolytes, which are based on compressed gas solvents. Unlike conventional electrolytes, disclosed electrolytes are based on “compressed gas solvents” mixed with various salts, referred to as “compressed gas electrolytes.” Various embodiments of a compressed gas solvent includes a material that is in a gas phase and has a vapor pressure above an atmospheric pressure at a room temperature. The disclosed compressed gas electrolytes can have wide electrochemical potential windows, high conductivity, low temperature capability and/or high pressure solvent properties. Examples of a class of compressed gases that can be used as solvent for electrolytes include hydrofluorocarbons, in particular fluoromethane, difluoromethane, tetrafluoroethane, pentafluoroethane. Also disclosed are battery and supercapacitor structures that use compressed gas solvent-based electrolytes, techniques for constructing such energy storage devices. Techniques for electroplating difficult-to-deposit materials using compressed gas electrolytes as an electroplating bath are also disclosed.

公开(公告)号：US12104269B2

公开(公告)日：2024-10-01

申请号：US18111487

申请日：2023-02-17

申请人： Applied Materials, Inc.

发明人： Paul R. McHugh ,  Gregory J. Wilson

IPC分类号： C25D21/10 ,  C25D5/08 ,  C25D7/12 ,  C25D17/00 ,  C25D17/02

CPC分类号： C25D21/10 ,  C25D5/08 ,  C25D7/12 ,  C25D17/001 ,  C25D17/02

摘要： Systems and methods for electroplating are described. The electroplating system may include a vessel configured to hold a first portion of a liquid electrolyte. The system may also include a substrate holder configured for holding a substrate in the vessel. The system may further include a first reservoir in fluid communication with the vessel. In addition, the system may include a second reservoir in fluid communication with the vessel. Furthermore, the system may include a first mechanism configured to expel a second portion of the liquid electrolyte from the first reservoir into the vessel. The system may also include a second mechanism configured to take in a third potion of the liquid electrolyte from the vessel into the second reservoir when the second portion of the liquid electrolyte is expelled from the first reservoir. Methods may include oscillating flow of the electrolyte within the vessel.

公开(公告)号：US20240318346A1

公开(公告)日：2024-09-26

申请号：US18026774

申请日：2022-04-21

申请人： EBARA CORPORATION

发明人： Shinji OMATA ,  Masaki TOMITA ,  Kentaro YAMAMOTO ,  Yasuyuki MASUDA

IPC分类号： C25D17/00 ,  C25D17/02 ,  C25D17/06 ,  C25D21/04

CPC分类号： C25D17/002 ,  C25D17/02 ,  C25D17/06 ,  C25D21/04

摘要： Provided is a technique that ensures suppressing deterioration of plating quality of a substrate due to gas bubbles at an anode.
A plating module 400 includes a plating tank 10 configured to house a plating solution, an anode 13 arranged in the plating tank 10, a substrate holder 20 configured to hold a substrate WF with a surface to be plated facing downward so as to be opposed to the anode 13, a membrane module 40 that includes a first membrane 41 partitioning an inside of the plating tank 10 into an anode chamber 11 and a cathode chamber 12 and a second membrane 42 arranged between the first membrane 41 and the anode 13, and a pipe member 31 communicating between a first region R1 below the anode 13 in the plating tank 10 and a second region R2 between the first membrane 41 and the second membrane 42.

公开(公告)号：US20240301579A1

公开(公告)日：2024-09-12

申请号：US18667227

申请日：2024-05-17

申请人： ALPHA-EN CORPORATION

发明人： Lawrence Ralph Swonger

IPC分类号： C25D3/42 ,  C03C3/21 ,  C03C4/18 ,  C03C10/00 ,  C25C1/02 ,  C25D7/06 ,  C25D17/00 ,  C25D17/02 ,  C25D17/10 ,  C25D17/12 ,  C25D21/02 ,  C25D21/18

CPC分类号： C25D3/42 ,  C03C3/21 ,  C03C4/18 ,  C03C10/00 ,  C25C1/02 ,  C25D7/0642 ,  C25D17/002 ,  C25D17/005 ,  C25D17/02 ,  C25D17/10 ,  C25D17/12 ,  C25D21/02 ,  C25D21/18

摘要： A decoupled plating system is provided for producing lithium. In a general embodiment, the present disclosure provides a feed tank configured to supply a lithium-rich aqueous electrolyte stream, a plating tank that is configured to receive an organic electrolyte and plate out lithium metal from that organic electrolyte, and one or more lithium replenishment cells configured to receive both electrolytes, keep them separated, and selectively move lithium ions from the aqueous electrolyte into the spent organic electrolyte stream. The present system and process can advantageously reduce operating costs and/or improve energy efficiency in production of lithium metal and associated products.

公开(公告)号：US20240271312A1

公开(公告)日：2024-08-15

申请号：US18492392

申请日：2023-10-23

申请人： Applied Materials, Inc.

发明人： Nolan L. Zimmerman

IPC分类号： C25D17/02 ,  C25D21/10 ,  H01L21/288

CPC分类号： C25D17/02 ,  C25D21/10 ,  H01L21/2885

摘要： Electroplating systems according to embodiments of the present technology may include a plating chamber configured to deposit metal material onto substrates positioned in the plating chamber. The plating chamber may include a rotor and a vessel. The electroplating systems may include at least one of baffle positioned in the plating chamber. The at least one baffle may define a plurality of slots. The at least one baffle may be configured to limit or prevent fluid from splashing the rotor or the plating chamber during operation of the plating chamber.

公开(公告)号：US20240247396A1

公开(公告)日：2024-07-25

申请号：US18017645

申请日：2022-06-17

申请人： EBARA CORPORATION

发明人： Masaki TOMITA ,  Masaya SEKI ,  Kentaro YAMAMOTO

IPC分类号： C25D21/12 ,  C25D5/48 ,  C25D17/00 ,  C25D17/02 ,  C25D17/06 ,  G01M3/16

CPC分类号： C25D21/12 ,  C25D5/48 ,  C25D17/001 ,  C25D17/02 ,  C25D17/06 ,  G01M3/16

摘要： Provided is a technique that determines presence of a leakage of a plating solution to an arranged region of a contact member.
A leakage determination method includes: discharging step 120 of discharging a cleaning liquid to the contact member of a substrate holder after immersing a substrate held by the substrate holder in the plating solution and performing a plating process; a measuring step 122 of measuring a conductivity of the cleaning liquid after cleaning the contact member; and determining step 128 of determining presence or absence of a leakage of the plating solution to the arranged region of the contact member based on comparison between a first conductivity of a cleaning liquid measured in advance for a substrate holder serving as a reference and a second conductivity of the cleaning liquid measured in the measuring step 122.

公开(公告)号：US20240218552A1

公开(公告)日：2024-07-04

申请号：US17923412

申请日：2021-11-04

申请人： EBARA CORPORATION

发明人： Kentaro YAMAMOTO ,  Masaki TOMITA ,  Kazuhito TSUJI

IPC分类号： C25D21/08 ,  C25D17/00 ,  C25D17/02 ,  C25D17/06

CPC分类号： C25D21/08 ,  C25D17/005 ,  C25D17/02 ,  C25D17/06

摘要： A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; a rotation mechanism configured to rotate the substrate holder; a contact member 494-4 having a substrate contact point 494-4a for contacting an outer peripheral portion of the surface to be plated of the substrate held by the substrate holder and a main body 494-4b extending above with respect to the substrate contact point 494-4a, and attached to the substrate holder; and a contact cleaning member 482 for discharging a cleaning liquid toward the main body 494-4b of the contact member 494-4 from a lower side of the substrate holder.

公开(公告)号：US20240209541A1

公开(公告)日：2024-06-27

申请号：US18427250

申请日：2024-01-30

申请人： Snap-on Incorporated

发明人： Kraig A. Tabor ,  Thomas L. Kassouf ,  Ricardo M. Guedes ,  Greg P. Formella ,  Alan J. Birschbach ,  Peter W. Eisch ,  Garry L. Dillon ,  Chad J. Kaschak ,  Michael G. Gentile

IPC分类号： C25D21/08 ,  C25D5/08 ,  C25D17/00 ,  C25D17/02 ,  C25D17/04 ,  C25D17/06 ,  C25D17/08 ,  C25D17/10 ,  C25D21/10 ,  C25D21/12

CPC分类号： C25D21/08 ,  C25D5/08 ,  C25D17/00 ,  C25D17/02 ,  C25D17/04 ,  C25D17/06 ,  C25D17/08 ,  C25D17/10 ,  C25D21/10 ,  C25D21/12

摘要： A portable electroplating system with components integrated into a complete system, rather than separated and disjointed. A single electroplating system can be self-contained to include all necessary rectifiers, tanks, cleaning functionalities, and other helpful or necessary items. By using smaller components than conventional electroplating systems, the system can allow for more economical use of chemicals, solutions, and energy and can be utilized more efficiently towards a unique shape or size of object to be plated. The system can also include wheels to make the system portable. A rack management system can be employed to move objects from one location to another within the system.

公开(公告)号：US20240209538A1

公开(公告)日：2024-06-27

申请号：US17802400

申请日：2021-11-04

申请人： EBARA CORPORATION

发明人： Kentaro YAMAMOTO ,  Masaki TOMITA ,  Kazuhito TSUJI

IPC分类号： C25D17/06 ,  C25D17/00 ,  C25D17/02 ,  C25D21/08

CPC分类号： C25D17/06 ,  C25D17/004 ,  C25D17/02 ,  C25D21/08

摘要： A plating module includes: a plating tank configured to accommodate a plating solution; a substrate holder configured to hold a substrate with a surface to be plated facing downward; an elevating mechanism configured to elevate the substrate holder; a cover member arranged above the plating tank and having a side wall surrounding an elevating path of the substrate holder; an opening/closing mechanism configured to open and close an opening formed in the side wall of the cover member; a substrate cleaning member for discharging a cleaning liquid toward a surface to be plated of a substrate held by the substrate holder; and a driving mechanism configured to move the substrate cleaning member between a cleaning position between the plating tank and the substrate holder and a retracted position retracted from between the plating tank and the substrate holder, through the opening.

公开(公告)号：US20240191383A1

公开(公告)日：2024-06-13

申请号：US18279428

申请日：2022-02-22

申请人： NanoWired GmbH

发明人： Olav Birlem ,  Florian Dassinger ,  Sebastian Quednau ,  Farough Roustaie

IPC分类号： C25D1/00 ,  C25D1/04 ,  C25D17/02 ,  C25D21/12

CPC分类号： C25D1/006 ,  C25D1/04 ,  C25D17/02 ,  C25D21/12

摘要： Apparatus for galvanically growing a plurality of nanowires on a substrate, comprising a substrate holder and a housing, in which a chamber, a control unit and a storage tank for an electrolyte are arranged, the apparatus being designed to grow the plurality of nanowires from the electrolyte onto the substrate when the substrate holder with the substrate has been inserted into the chamber.