公开(公告)号：US06189207B1

公开(公告)日：2001-02-20

申请号：US08836044

申请日：1997-07-02

申请人： Kazuo Nagae

发明人： Kazuo Nagae

IPC分类号： H05K330

CPC分类号： H05K13/08 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/53178

摘要： In a parts mounting method having plural parts feed units, for setting aside a parts feed unit at a refill position if running short of a certain part in the process of mounting parts, and continuing parts mounting in other parts feed units, it is intended to reduce production stops due to parts shortage, and enhance the operation rate of the mounting machine. To achieve the object, the method of the invention comprises a step of judging if parts are refilled in the parts feed unit 4R at the refill position when parts shortage occurs while mounting parts in the parts feed unit 4L, a step of judging if all parts feed units 4L, 4R are out of the parts which are in shortage if parts are not refilled, and a step of mounting parts from the parts feed unit 4R at the refill position if shortage parts are present in the parts feed unit 4R at the refill position.

摘要翻译： 在具有多个进给单元的零件安装方法中，如果在安装部件的过程中缺少某个部件，并且在其他部件进给单元中安装的连续部件，则在备用位置放置零件进给单元， 减少零件不足造成的停产，提高安装机的运行率。 为了实现该目的，本发明的方法包括以下步骤：当在零件供给单元4L中安装零件时，在零件不足的情况下，判断在重新装填位置处的零件供给单元4R中是否重新填充零件， 如果未重新填充零件，则进给单元4L，4R不在缺少部件的情况下，以及如果在备件供给单元4R中存在缺少零件的情况，则将零件从零件供给单元4R安装在再填充位置的步骤 位置。

公开(公告)号：US06178621B2

公开(公告)日：2001-01-30

申请号：US09029627

申请日：1998-04-23

申请人： Satoshi Shida ,  Wataru Hirai ,  Muneyoshi Fujiwara ,  Hiroshi Ohta ,  Hirokazu Honkawa

发明人： Satoshi Shida ,  Wataru Hirai ,  Muneyoshi Fujiwara ,  Hiroshi Ohta ,  Hirokazu Honkawa

IPC分类号： H05K330

CPC分类号： H05K13/0409 ,  Y10T29/53091 ,  Y10T29/53178 ,  Y10T29/53191 ,  Y10T29/53261

摘要： By lightening the impact load to an electronic component and greatly promoting the load range, the adaptability to the electronic components is enhanced and the manned manual operation is eliminated, thereby improving the productivity and realizing unmanned operation. The vacuum-clamping nozzle unit comprises an automatically detachable vacuum-clamping nozzle (2) for vacuum-clamping the electronic component, a positioning section (3) for positioning the vacuum-clamping nozzle (2) in a rotating direction and a vertical direction, a pushing section (4) for urging said vacuum-clamping nozzle (2) downward by using fluid, a fluid pressure switching section for switching the urging force, a timing switching section for switching the timing of the urging force of said vacuum-clamping nozzle, and a pressure control section for controlling the load to a desired load. Switching the timing of the urging force can be made before or at the time of mounting the electronic component on an electronic circuit board.

摘要翻译： 通过减轻对电子元件的冲击负荷并大大提高负载范围，提高了对电子元器件的适应性，消除了人工操作，从而提高了生产效率，实现了无人操作。 真空夹紧喷嘴单元包括用于真空夹紧电子部件的可自动拆卸的真空夹紧喷嘴（2），用于将真空夹紧喷嘴（2）沿旋转方向和垂直方向定位的定位部分（3） 用于通过使用流体向下推动所述真空夹紧喷嘴（2）的推动部分（4），用于切换所述推动力的流体压力切换部分，用于切换所述真空夹紧喷嘴的作用力的正时的定时切换部分 以及用于将负载控制到期望负载的压力控制部。 可以在将电子部件安装在电子电路板上之前或之前进行推压力的定时切换。

公开(公告)号：US06820328B2

公开(公告)日：2004-11-23

申请号：US10328337

申请日：2002-12-23

申请人： Tina P. Barcley

发明人： Tina P. Barcley

IPC分类号： H05K330

CPC分类号： H05K1/0206 ,  H05K3/0061 ,  H05K3/429 ,  H05K2201/0209 ,  H05K2201/0959 ,  H05K2201/09781 ,  H05K2201/0979 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49165

摘要： A method removes heat from a densely packed electronic assemblage. Densely packed electronic assemblage has a substrate medium for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the heat removing element for reducing heat of the heat generating component by absorbing heat from the heat generating component.

公开(公告)号：US06807725B2

公开(公告)日：2004-10-26

申请号：US09971682

申请日：2001-10-09

申请人： Koichi Asai ,  Shinsuke Suhara

发明人： Koichi Asai ,  Shinsuke Suhara

IPC分类号： H05K330

CPC分类号： H05K13/0812 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49769 ,  Y10T29/53087 ,  Y10T29/53174 ,  Y10T29/53178

摘要： A system of mounting a plurality of electric components on a circuit substrate and thereby producing an electric circuit including a system for performing the following steps of taking, immediately before each of the electric components is mounted on the circuit substrate, a first image of a first portion of the circuit substrate on which the each electric component is to be mounted and a second portion of the circuit substrate that is adjacent to the first portion, mounting the each electric component on the circuit substrate, taking, immediately after the each electric component is mounted on the circuit substrate, a second image of the mounted electric component, and inspecting, by comparing the first and second images with each other, a state in which the each electric component is mounted on the circuit substrate.

摘要翻译： 一种将多个电气部件安装在电路基板上并由此产生电路的系统，该系统包括用于执行以下步骤的系统，在紧接每个电气部件安装在电路基板上之前，执行以下步骤：第一图像 要在其上安装每个电气部件的电路基板的一部分和与第一部分相邻的电路基板的第二部分，将每个电气部件安装在电路基板上，在每个电气部件之后立即 安装在电路基板上的安装的电气部件的第二图像，并且通过将第一和第二图像彼此进行比较来检查每个电气部件安装在电路基板上的状态。

公开(公告)号：US06796022B2

公开(公告)日：2004-09-28

申请号：US10108989

申请日：2002-03-29

申请人： Hisayoshi Kashitani ,  Katsuyuki Seto ,  Yoshiharu Fukushima

发明人： Hisayoshi Kashitani ,  Katsuyuki Seto ,  Yoshiharu Fukushima

IPC分类号： H05K330

CPC分类号： H05K13/0452 ,  Y10S29/044 ,  Y10T29/53178 ,  Y10T29/53183 ,  Y10T29/53191

摘要： An electronic component mounting apparatus has a pair of guides, a beam traveling along the guides and a mounting head placed on the beam. A first linear motor moves the beam along the guides, and a second linear motor moves the mounting head along the beam. A thermal insulating portion placed between the beam and the guides thermally insulates the two components from each other. Thermal conduction portions are placed on the fixed elements of the first and second linear motors. This configuration assures an accurate operation of the mounting apparatus by eliminating thermal deformations of their components.

摘要翻译： 电子部件安装装置具有一对引导件，沿引导件行进的梁和放置在梁上的安装头。 第一线性电动机沿着导轨移动光束，并且第二线性电动机沿着光束移动安装头。 放置在梁和引导件之间的绝热部分将两个部件彼此热绝缘。 导热部分放置在第一和第二直线电动机的固定元件上。 该配置通过消除其组件的热变形来确保安装装置的精确操作。

公开(公告)号：US06763578B2

公开(公告)日：2004-07-20

申请号：US08975549

申请日：1997-11-20

申请人： Warren Farnworth ,  Alan Wood

发明人： Warren Farnworth ,  Alan Wood

IPC分类号： H05K330

CPC分类号： G01R31/2863 ,  G01R1/0466 ,  G01R1/0483 ,  G01R3/00 ,  G01R31/2831 ,  G01R31/2867 ,  H01L21/6835 ,  H01L22/20 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/16145 ,  H01L2224/48463 ,  H01L2224/85001 ,  H01L2224/85205 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15174 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723 ,  Y10T29/49126 ,  Y10T29/49131 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49764 ,  H01L2224/78 ,  H01L2924/00 ,  H01L2224/45099

摘要： A method and apparatus for fabricating known good semiconductor dice are provided. The method includes the steps of: testing the gross functionality of dice contained on a semiconductor wafer; sawing the wafer to singulate a die; and then testing the die by assembly in a carrier having an interconnect adapted to establish electrical communication between the bond pads on the die and external test circuitry. The interconnect for the carrier can be formed using different contact technologies including: thick film contact members on a rigid substrate; self-limiting contact members on a silicon substrate; or microbump contact members with a textured surface. During assembly of the carrier, the die and interconnect are optically aligned and placed into contact with a predetermined contact force. This establishes an electrical connection between the contact members on the interconnect and the bond pads of the die. In the assembled carrier the die and interconnect are biased together by a force distribution mechanism that includes a bridge clamp, a pressure plate and a spring clip. Following testing of the die, the carrier is disassembled and the tested die is removed.

摘要翻译： 提供了一种用于制造已知的良好半导体晶片的方法和装置。 该方法包括以下步骤：测试包含在半导体晶片上的骰子的总功能; 锯切晶片以切割模具; 然后通过组装在具有适于建立管芯上的接合焊盘与外部测试电路之间的电连通的互连的载体中来测试管芯。 用于载体的互连可以使用不同的接触技术形成，包括：刚性基板上的厚膜接触构件; 硅衬底上的自限制接触构件; 或具有纹理表面的微型块接触构件。 在载体的组装期间，芯片和互连件被光学对准并且被放置成与预定的接触力接触。 这就建立了互连上的接触构件和管芯的接合垫之间的电连接。 在组装的载体中，管芯和互连件通过包括桥夹，压板和弹簧夹的力分配机构偏压在一起。 在对模具进行测试之后，拆下载体并且移除被测试的模具。

公开(公告)号：US06763577B1

公开(公告)日：2004-07-20

申请号：US10069205

申请日：2002-02-22

申请人： Rolf Laumann

发明人： Rolf Laumann

IPC分类号： H05K330

CPC分类号： H05K13/02 ,  H05K13/086 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/53004 ,  Y10T29/53087 ,  Y10T29/5313

摘要： The invention relates to a system for placing electronic components maintained in an array to feed tracks (2) of a placement unit (1) wherein, the correct placement of the array is accomplished in a feed supervisory unit (4) by comparison of component-related data stored on identification carriers (9) respectively assigned to the arrays with placement-related data stored on a portable equipment supervisory carrier (8).

摘要翻译： 本发明涉及一种用于放置维持在阵列中的电子部件以馈送放置单元（1）的轨道（2）的系统，其中，阵列的正确放置通过比较组件 - 存储在分配给阵列的识别载体（9）上的与存储在便携式设备监督载体（8）上的放置相关数据的相关数据。

公开(公告)号：US06757969B1

公开(公告)日：2004-07-06

申请号：US10018086

申请日：2001-12-14

申请人： Tsung-Wen Chan

发明人： Tsung-Wen Chan

IPC分类号： H05K330

CPC分类号： G09F9/33 ,  G09F13/22 ,  G09F27/008 ,  H01L25/13 ,  H01L2924/0002 ,  Y10T29/49146 ,  Y10T29/49149 ,  Y10T29/49171 ,  Y10T29/49208 ,  Y10T29/4922 ,  Y10T29/49222 ,  H01L2924/00

摘要： Method of fabricating LED assembly disclosed herein can provides a string of original colored high intensity LEDS usable for screen displaying or traffic signal lights molded by injecting harmless polyacrylic resin in a short time duration and at low temperature.

摘要翻译： 本文公开的制造LED组件的方法可以提供可用于通过在短时间和低温下注入无害聚丙烯酸树脂而模制的屏幕显示或交通信号灯的原始着色的高强度LEDS串。

公开(公告)号：US06751858B2

公开(公告)日：2004-06-22

申请号：US09922801

申请日：2001-08-07

申请人： Minoru Tokuhara ,  Yukihiro Kato

发明人： Minoru Tokuhara ,  Yukihiro Kato

IPC分类号： H05K330

CPC分类号： G01L19/141 ,  G01L19/0627 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L2924/16151 ,  H01L2924/16195 ,  Y10T29/49007 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49171 ,  H01L2924/00014

摘要： In a method for manufacturing a sensor apparatus having a sensor chip disposed in a recess of a case, after the sensor chip is disposed in the recess of the case, an opening portion of the recess is closed with a sheet member. The sheet member can prevent foreign matters from intruding an inside of the recess during manufacturing steps. After that, a through hole is formed in the sheet member. Accordingly, the inside and outside of the recess communicate with each other, and the sensor chip can detect an external environment of the recess such as atmospheric pressure.

摘要翻译： 在具有设置在壳体的凹部中的传感器芯片的传感器装置的制造方法中，在传感器芯片设置在壳体的凹部中之后，用片状部件闭合凹部的开口部。 在制造步骤中，片材可以防止异物侵入凹部内部。 之后，在片材中形成通孔。 因此，凹部的内部和外部彼此连通，并且传感器芯片可以检测诸如大气压力的凹部的外部环境。

公开(公告)号：US06748650B2

公开(公告)日：2004-06-15

申请号：US09894303

申请日：2001-06-27

申请人： Harvinder Singh

发明人： Harvinder Singh

IPC分类号： H05K330

CPC分类号： H05K1/0271 ,  H05K1/0284 ,  H05K3/202 ,  H05K3/28 ,  H05K2201/09118 ,  H05K2201/2009 ,  H05K2201/2018 ,  Y10T29/41 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49155

摘要： A circuit assembly comprises a substrate comprising one or more conductors. An integral frame of frame elements supports the substrate. The frame elements spaced apart to expose intervening regions of the substrate between adjacent frame elements. A dielectric layer overlies the intervening regions, as a protective barrier for at least one of the conductors, a component, and a circuit feature of the substrate.

摘要翻译： 电路组件包括包括一个或多个导体的衬底。 框架元件的整体框架支撑基板。 间隔开的框架元件以暴露相邻框架元件之间的衬底的中间区域。 电介质层覆盖在介入区域之间，作为至少一个导体，元件和衬底的电路特征的保护屏障。