利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

21 条记录 (耗时 0.014 秒)

    Methods for fabricating current-carrying structures using voltage switchable dielectric materials
    1.
    发明授权
    Methods for fabricating current-carrying structures using voltage switchable dielectric materials 失效
    使用可开关电介质材料制造载流结构的方法

    公开(公告)号：US08117743B2

    公开(公告)日：2012-02-21

    申请号：US12953158

    申请日：2010-11-23

    申请人： Lex Kosowsky

    发明人： Lex Kosowsky

    IPC分类号： H05K3/10

    CPC分类号： H05K1/0254 ,  C25D5/54 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/188 ,  H05K3/423 ,  H05K3/426 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2203/105 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155

    摘要： A method includes providing a voltage switchable dielectric material having a characteristic voltage, exposing the voltage switchable dielectric material to a source of ions associated with an electrically conductive material, and creating a voltage difference between the source and the voltage switchable dielectric material that is greater than the characteristic voltage. Electrical current is allowed to flow from the voltage switchable dielectric material, and the electrically conductive material is deposited on the voltage switchable dielectric material. A body comprises a voltage switchable dielectric material and a conductive material deposited on the voltage switchable dielectric material using an electrochemical process. In some cases, the conductive material is deposited using electroplating.

    摘要翻译： 一种方法包括提供具有特征电压的电压可切换电介质材料，将电压可切换电介质材料暴露于与导电材料相关的离子源，并且产生电源和可切换电介质材料之间的电压差大于 特征电压。 允许电流从电压可切换介电材料流出，并且导电材料沉积在可开关电介质材料上。 身体包括电​​压可​​切换电介质材料和使用电化学过程沉积在可开关电介质材料上的导电材料。 在一些情况下，使用电镀沉积导电材料。

    System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices
    2.
    发明授权
    System and method for including protective voltage switchable dielectric material in the design or simulation of substrate devices 有权
    在设计或模拟衬底器件时包括保护电压可切换介电材料的系统和方法

    公开(公告)号：US07793236B2

    公开(公告)日：2010-09-07

    申请号：US11860530

    申请日：2007-09-24

    申请人： Lex Kosowsky ,  Robert Fleming

    发明人： Lex Kosowsky ,  Robert Fleming

    IPC分类号： G06F17/50

    CPC分类号： G06F17/5068 ,  H05K1/0254 ,  H05K1/0259 ,  H05K1/0293 ,  H05K1/0373 ,  H05K3/0005 ,  H05K2201/0738 ,  H05K2203/105

    摘要： A substrate device is designed by identifying one or more criteria for handling of a transient electrical event on the substrate device. The one or more criteria may be based at least in part on an input provided from a designer. From the one or more criteria, one or more characteristics may be determined for integrating VSD material as a layer within or on at least a portion of the substrate device. The layer of VSD material may be positioned to protect one or more components of the substrate from the transient electrical condition.

    摘要翻译： 通过识别用于处理衬底装置上的瞬态电事件的一个或多个标准来设计衬底装置。 该一个或多个标准可以至少部分地基于从设计者提供的输入。 根据一个或多个标准，可以确定一个或多个特性，用于将VSD材料整合为衬底装置的至少一部分内或之上的层。 可以将VSD材料层定位成保护衬底的一个或多个部件免受瞬态电气条件的影响。

    Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration
    4.
    发明授权
    Substrate device or package using embedded layer of voltage switchable dielectric material in a vertical switching configuration 有权
    基板装置或封装，采用垂直开关配置的可切换电介质材料的嵌入层

    公开(公告)号：US08203421B2

    公开(公告)日：2012-06-19

    申请号：US12417589

    申请日：2009-04-02

    申请人： Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon

    发明人： Lex Kosowsky ,  Robert Fleming ,  Bhret Graydon

    IPC分类号： H01C7/10

    CPC分类号： H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K2201/0738 ,  H05K2203/105

    摘要： A substrate device includes an embedded layer of VSD material that overlays a conductive element or layer to provide a ground. An electrode, connected to circuit elements that are to be protected, extends into the thickness of the substrate to make contact with the VSD layer. When the circuit elements are operated under normal voltages, the VSD layer is dielectric and not connected to ground. When a transient electrical event occurs on the circuit elements, the VSD layer switches instantly to a conductive state, so that the first electrode is connected to ground.

    摘要翻译： 衬底器件包括覆盖导电元件或层以提供接地的VSD材料的嵌入层。 连接到要被保护的电路元件的电极延伸到衬底的厚度以与VSD层接触。 当电路元件在正常电压下工作时，VSD层是电介质的，不连接到地。 当在电路元件上发生瞬态电事件时，VSD层立即切换到导通状态，使得第一电极连接到地。