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公开(公告)号：US4025348A
公开(公告)日：1977-05-24
申请号：US574452
申请日：1975-05-05
CPC分类号： G03F7/038 , G03F7/032 , Y10S430/106 , Y10S430/115 , Y10S430/117
摘要： A photosensitive resin composition consisting essentially of (A) a photo-polymerizable unsaturated compound having at least two terminal ethylene groups, (B) a reactive linear high molecular weight compound having in its side chain one or two functional groups selected from the class consisting of tetrahydrofurfuryl group and N-alkoxymethylcarbamoyl group, (C) a sensitizer capable of initiating polymerization of the above unsaturated compound upon irradiation with active rays, (D) a compound having at least two epoxy groups, and (E) a potential or latent curing agent for epoxy resins. The photosensitive resin composition can give a protective film excellent in solvent resistance, chemical resistance, heat resistance and mechanical strengths, and hence can be used in the production of printed circuit boards and the precision-processing of metals.
摘要翻译： 基本上由（A）具有至少两个末端亚乙基的光聚合性不饱和化合物组成的光敏树脂组合物，（B）在其侧链中具有一个或两个选自以下的官能团的反应性线性高分子量化合物： 四氢糠基和N-烷氧基甲基氨基甲酰基，（C）能够在用活性射线照射时引发上述不饱和化合物的聚合的敏化剂，（D）具有至少两个环氧基的化合物，和（E）潜在或潜在性固化剂 用于环氧树脂。 感光性树脂组合物可以得到耐溶剂性，耐化学性，耐热性和机械强度优异的保护膜，因此可以用于印刷电路板的制造和金属的精密加工。
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2.发明授权Soldering mask formed from a photosensitive resin composition and a photosensitive element 失效由感光性树脂组合物和光敏元件形成的焊接掩模
公开(公告)号：US4499163A
公开(公告)日：1985-02-12
申请号：US512660
申请日：1983-07-11
CPC分类号： G03F7/027 , C08F2/50 , C08F299/065 , C08G18/672
摘要： A photosensitive resin composition comprising (a) 20 to 75 parts by weight of a urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate and/or isophorone diisocynate dihydric alcohol and an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., and (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.
摘要翻译： 一种感光性树脂组合物，其含有（a）20〜75重量份通过使三甲基六亚甲基二异氰酸酯和/或异佛尔酮二异氰酸酯二元醇与二元醇的丙烯酸或甲基丙烯酸单酯反应得到的氨基甲酸酯二丙烯酸酯或二甲基丙烯酸酯化合物，（b）20〜75 重量的玻璃化转变温度为约40〜150℃的线性高分子化合物，和（c）由于光化性光而产生自由基的敏化剂和/或敏化剂体系，耐热性优异， 耐热冲击和耐溶剂性，并且适于形成焊接掩模。 此外，通过在支撑体上形成上述组合物层而制造的感光元件形成耐热性，耐热冲击性和耐溶剂性优异的保护涂膜，特别适用于焊接掩模。
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3.发明授权
公开(公告)号：US4108666A
公开(公告)日：1978-08-22
申请号：US665883
申请日：1976-03-11
IPC分类号： H05K3/00 , B32B27/36 , C08F2/50 , C23C18/16 , C23C18/18 , C23C18/31 , G03F7/027 , H05K3/18 , G03C1/68
CPC分类号： G03F7/027
摘要： A photosensitive composition for a photoresist, which comprises (A) a compound having the following general formula: ##STR1## wherein Z is a cyclic dibasic acid anhydride moiety, R.sup.1 is an alkylene group having 1 to 3 carbon atoms, R.sup.2 is hydrogen or methyl, and R.sup.3 is hydrogen, methyl, ethyl or -CH.sub.2 X in which X is chlorine or bromine, (B) a photopolymerization sensitizer, (C) a polymer being capable of giving a film-forming property, (D) a chain transfer agent and (E) a thermal polymerization inhibitor; and a laminated photosensitive element which has a substantially dry photosensitive layer of the photosensitive composition. The composition and element are capable of giving a minute resist pattern which is excellent as an etching resist or metal plating resist and can be readily removed after etching or metal plating.
摘要翻译： 一种光致抗蚀剂用光敏组合物，其包含（A）具有以下通式的化合物：其中Z是环状二元酸酐部分，R 1是具有1至3个碳原子的亚烷基，R 2是氢或甲基 ，R 3为氢，甲基，乙基或-CH 2 X，其中X为氯或溴，（B）光聚合增感剂，（C）能够提供成膜性的聚合物，（D）链转移剂和 （E）热聚合抑制剂; 以及具有基本上干燥的光敏组合物感光层的层压感光元件。 组合物和元素能够提供作为抗蚀剂或金属电镀抗蚀剂优异的微小抗蚀剂图案，并且可以在蚀刻或金属电镀之后容易地除去。
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公开(公告)号：US4101364A
公开(公告)日：1978-07-18
申请号：US709400
申请日：1976-07-28
申请人： Katsushige Tsukada , Nobuyuki Hayashi , Hideo Yamada , Toshiaki Ishimaru , Asao Isobe , Tadazi Sato
发明人： Katsushige Tsukada , Nobuyuki Hayashi , Hideo Yamada , Toshiaki Ishimaru , Asao Isobe , Tadazi Sato
IPC分类号： H05K3/06 , B29C63/00 , B29C63/02 , B29L9/00 , G03C7/30 , G03F7/004 , G03F7/16 , H05K3/00 , B29C17/00
CPC分类号： B32B37/10 , B29C63/0047 , B29C63/0091 , G03F7/161 , B32B2309/68 , H05K3/0079
摘要： It is herein proposed to laminate a film onto a convex-concaved solid surface in a vacuum to accomplish tight contact between the film and the solid surface. The apparatus includes an air tight housing in which lamination press rolls are arranged, wherein feeding-in and feeding-out of materials such as a base plate and a film for lamination are effected through air tight roll assemblies incorporated in the wall structure of the air tight housing.
摘要翻译： 这里提出在真空中将薄膜层压到凸凹固体表面上，以实现薄膜和固体表面之间的紧密接触。 该装置包括一个气密的外壳，其中布置有层叠压力辊，其中馈送和馈送诸如基板和用于层压的薄膜的材料通过结合在空气的壁结构中的气密辊组件来实现 紧密的住房。
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公开(公告)号：US4544625A
公开(公告)日：1985-10-01
申请号：US576717
申请日：1984-02-03
IPC分类号： C08F299/00 , B23K35/22 , C08F2/50 , C08F290/00 , C08F299/06 , C08G18/67 , C23F1/00 , G03F7/027 , G03F7/038 , H05K3/28 , G03C1/68
CPC分类号： G03F7/027 , B23K35/224 , C08F299/065 , C08G18/672 , H05K3/287 , H05K2203/0783 , Y10S430/162
摘要： A photosensitive resin composition comprising (a) 20 to 75 parts by weight of an urethane diacrylate or dimethacrylate compound obtained by reacting trimethylhexamethylene diisocyanate with an acrylic or methacrylic monoester of a dihydric alcohol, (b) 20 to 75 parts by weight of a linear polymeric compound having a glass transition temperature of about 40.degree. to 150.degree. C., (c) a sensitizer and/or a sensitizer system which generate free radicals owing to actinic light, and (d) an acrylic or methacrylic ester containing a phosphoric acid group in the molecule in an amount of 0.01 to 5% by weight based on the total weight of components (a) and (b) is excellent in heat resistance, resistance to thermal shock and solvent resistance, and is suitable for forming a soldering mask. Further, a photosensitive element produced by forming a layer of the above-mentioned composition on a support gives a protective coating film excellent in heat resistance, resistance to thermal shock and solvent resistance, and is particularly suitable for a soldering mask.
摘要翻译： 一种感光性树脂组合物，其包含（a）20〜75重量份通过三甲基六亚甲基二异氰酸酯与二元醇的丙烯酸或甲基丙烯酸单酯反应得到的聚氨酯二丙烯酸酯或二甲基丙烯酸酯化合物，（b）20〜75重量份的线性聚合物 玻璃化转变温度为约40〜150℃的化合物，（c）由于光化反应而产生自由基的敏化剂和/或敏化剂体系，（d）含有磷酸基团的丙烯酸或甲基丙烯酸酯 相对于成分（a）和（b）的总重量，分子中的0.01〜5重量％的耐热性，耐热冲击性和耐溶剂性优异，适合于形成焊接掩模。 此外，通过在支撑体上形成上述组合物层而制造的感光元件形成耐热性，耐热冲击性和耐溶剂性优异的保护涂膜，特别适用于焊接掩模。
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6.发明授权Photosensitive resin composition containing unsaturated monomers and unsaturated phosphates 失效含有不饱和单体和不饱和磷酸盐的感光树脂组合物
公开(公告)号：US4438190A
公开(公告)日：1984-03-20
申请号：US351765
申请日：1982-02-24
IPC分类号： G03F7/025 , B23K35/22 , C08F2/50 , C08F291/00 , C08G18/67 , C08L75/16 , C09D4/00 , G03F7/027 , G03F7/085 , H05K3/28 , G03C1/68
CPC分类号： C08L75/16 , B23K35/224 , C08F291/00 , C08G18/672 , C09D4/00 , G03F7/027 , G03F7/085 , H05K3/287 , H05K2203/0783 , Y10S430/106 , Y10S430/111 , Y10S430/117 , Y10S430/118 , Y10S430/12 , Y10S430/121 , Y10S430/122 , Y10S430/123
摘要： A photosensitive resin composition comprising (a) at least one compound selected from the group consisting of benzotriazole, benzimidazole, benzothiazole, derivatives thereof and salts thereof, (b) a phosphate compound having photopolymeric unsaturated bonds, (c), if necessary, an organic thermoplastic polymer, (d) a photopolymerizable unsaturated compound having at least one terminal ethylene group and (e) a sensitizer and/or a sensitizer system, and a photosensitive element comprising a layer of said photosensitive resin composition and a support film therefor, are provided. The photosensitive resin composition can form a protective coating film with excellent adhesiveness to the substrate surface, and such a protective coating film or, photosensitive element obtained therefrom can be advantageously used as a resist for soldering mask, etc.
摘要翻译： 一种光敏树脂组合物，其包含（a）至少一种选自苯并三唑，苯并咪唑，苯并噻唑，其衍生物及其盐的化合物，（b）具有光聚合不饱和键的磷酸酯化合物，（c）如有必要，有机 热塑性聚合物，（d）具有至少一个末端亚乙基的光聚合性不饱和化合物和（e）敏化剂和/或敏化剂体系，以及包含所述感光性树脂组合物层及其支持膜的感光元件 。 感光性树脂组合物可以形成对基材表面具有优异粘附性的保护涂膜，并且这种保护涂膜或由其获得的感光元件可有利地用作焊接掩模等的抗蚀剂。
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公开(公告)号：US4272607A
公开(公告)日：1981-06-09
申请号：US782378
申请日：1977-03-29
CPC分类号： G03F7/033 , Y10S430/106
摘要： A photosensitive resin composition comprising (a) a linear polymer or copolymer having tetrahydrofurfuryl groups at side chains, (b) one or more photopolymerizable unsaturated compounds having at least two terminal ethylene groups, and (c) one or more sensitizers which initiate polymerization of said unsaturated compounds by irradiation of active light, has excellent storage stability and photosensitivity. The composition can produce permanent protective films having excellent resistance to solvents, heat resistance and the like and can be used as a solder resist and the like.
摘要翻译： 一种光敏树脂组合物，其包含（a）在侧链具有四氢糠基的直链聚合物或共聚物，（b）一种或多种具有至少两个末端亚乙基的可光聚合的不饱和化合物，和（c）一种或多种引发所述 不饱和化合物通过活性光照射，具有优异的储存稳定性和光敏性。 该组合物可以制造具有优异的耐溶剂性，耐热性等的永久保护膜，并且可以用作阻焊剂等。
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公开(公告)号：US4312916A
公开(公告)日：1982-01-26
申请号：US186240
申请日：1980-09-11
CPC分类号： C09J175/04 , C08G18/637 , C09D4/06 , C09J4/06 , C09J7/0246 , Y10T428/2809 , Y10T428/2896
摘要： A process for producing adhesive film comprising coating on a filmlike substrate a composition comprising (i) a copolymer having a glass transition temperature of -30.degree. C. or lower and obtained from one or more monomers (a) such as alkyl acrylates or methacrylates, or the like, and another monomers (b) containing at least one carboxyl, alcoholic hydroxyl, or glycidyl group, (ii) a crosslinking agent having at least two crosslinkable functional groups which can react with the monomers (b), (iii) one or more monofunctional addition polymerizable monomers having a boiling point of 200.degree. C. or higher, (iv) one or more polyfunctional addition polymerizable monomers having a boiling point of 200.degree. C. or higher, and (v) a photochemical initiator, and irradiating said composition with actinic light, is advantageous in that the amount of solvent to be removed after coating the composition on the substrate can be reduced remarkably without lowering properties of the resulting adhesive film.
摘要翻译： 一种制造粘合剂膜的方法，其包括在膜状基材上涂布组合物，所述组合物包含（i）玻璃化转变温度为-30℃以下并由一种或多种单体（a）如丙烯酸烷基酯或甲基丙烯酸烷基酯获得的共聚物， （b）含有至少一个羧基，醇羟基或缩水甘油基的单体（b），（ii）具有至少两个可与单体（b）反应的交联性官能团的交联剂，（iii）一种 或更多的沸点为200℃以上的单官能加聚单体，（iv）一种或多种沸点为200℃以上的多官能加聚单体和（v）光化学引发剂，以及照射 所述具有光化性光的组合物的优点在于，可以显着降低在基材上涂布组合物后除去的溶剂的量，而不会降低所得粘合剂膜的性能 。
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公开(公告)号：US4302268A
公开(公告)日：1981-11-24
申请号：US151986
申请日：1980-05-21
CPC分类号： H05K3/281 , G03F7/09 , H05K1/0393 , H05K2203/066 , H05K3/0023
摘要： A flexible printed-circuit board is covered imagewise with a polymer film as a cover layer to improve the flexibility of the board. The cover layer is formed by laminating a photoprintable, photosensitive layer supported on a flexible support to the surface of a flexible printed-circuit board, exposing the photosensitive layer imagewise to light to form a polymer image in the layer and removing the unexposed areas of the layer to leave an imaged polymer film on the surface of the board. The formation of the cover layer can be easily conducted by a continuous operation.
摘要翻译： 柔性印刷电路板以聚合物膜作为覆盖层成像地覆盖以提高板的柔性。 覆盖层通过将支撑在柔性载体上的可照相照相感光层层压到柔性印刷电路板的表面上而形成，将感光层成像曝光以在层中形成聚合物图像，并且去除未曝光的区域 层，以在板的表面上留下成像的聚合物膜。 覆盖层的形成可以通过连续操作容易地进行。
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公开(公告)号：US5028513A
公开(公告)日：1991-07-02
申请号：US336771
申请日：1989-04-13
申请人： Kanji Murakami , Mineo Kawamoto , Akio Tadokoro , Haruo Akahoshi , Toshikazu Narahara , Ritsuji Toba , Toshiaki Ishimaru , Nobuyuki Hayashi , Motoyo Wajima
发明人： Kanji Murakami , Mineo Kawamoto , Akio Tadokoro , Haruo Akahoshi , Toshikazu Narahara , Ritsuji Toba , Toshiaki Ishimaru , Nobuyuki Hayashi , Motoyo Wajima
CPC分类号： H05K3/282 , H05K3/108 , H05K2201/0355 , H05K2203/0591 , H05K2203/072 , H05K2203/1105 , H05K2203/124 , H05K3/0076 , H05K3/062 , H05K3/383
摘要： The present invention provide a process for producing printed circuit boards which comprises the steps of(a) roughening a surface of a copper layer formed on an insulating board.(b) coating the roughened surface of copper layer with a photo-resist layer containing a sublimable copper-corrosion inhibitor, exposing the resist layer selectively to actinic rays according to a circuit pattern to form, and developing the resulting resist layer, thereby forming plating-resist coats on circuit-negative pattern portions of the copper layer,(c) heat-treating the plating-resist coats,(d) plating chemically the circuit-corresponding portion with copper,(e) removing the plating-resist coats, and(f) removing the copper layer except the circuit-corresponding portion thereof.
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