公开(公告)号：US08841757B2

公开(公告)日：2014-09-23

申请号：US13298614

申请日：2011-11-17

申请人： Daisuke Uenda ,  Takeshi Matsumura ,  Koichi Inoue ,  Miki Morita

发明人： Daisuke Uenda ,  Takeshi Matsumura ,  Koichi Inoue ,  Miki Morita

IPC分类号： H01L21/00 ,  H01L23/552 ,  H01L21/683 ,  H01L21/56 ,  H01L23/544

CPC分类号： H01L23/552 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2924/01019 ,  H01L2924/01037 ,  H01L2924/01055 ,  H01L2924/01079 ,  Y10T428/28 ,  H01L2924/00

摘要： An electromagnetic wave shielding layer can be provided on the backside of a semiconductor element that is flip-chip connected to an adherend, and a semiconductor device having the electromagnetic wave shielding layer can be manufactured without deteriorating productivity. The present invention provides a film for the backside of a flip-chip type semiconductor to be formed on the backside of a semiconductor element that is flip-chip connected to an adherend, having an adhesive layer and an electromagnetic wave shielding layer.

摘要翻译： 可以在倒装芯片连接到被粘物的半导体元件的背面设置电磁波屏蔽层，并且可以制造具有电磁波屏蔽层的半导体器件，而不会降低生产率。 本发明提供了一种用于倒装芯片型半导体的背面的薄膜，该薄膜将形成在半导体元件的背面，该半导体元件倒装芯片连接到具有粘合剂层和电磁波屏蔽层的被粘物。

公开(公告)号：US20120126380A1

公开(公告)日：2012-05-24

申请号：US13298614

申请日：2011-11-17

申请人： Daisuke UENDA ,  Takeshi MATSUMURA ,  Koichi INOUE ,  Miki MORITA

发明人： Daisuke UENDA ,  Takeshi MATSUMURA ,  Koichi INOUE ,  Miki MORITA

IPC分类号： H01L23/552 ,  B05D5/10 ,  B32B27/00

CPC分类号： H01L23/552 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/68377 ,  H01L2221/68386 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13116 ,  H01L2224/13118 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16245 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/831 ,  H01L2224/83862 ,  H01L2924/01019 ,  H01L2924/01037 ,  H01L2924/01055 ,  H01L2924/01079 ,  Y10T428/28 ,  H01L2924/00

摘要： An electromagnetic wave shielding layer can be provided on the backside of a semiconductor element that is flip-chip connected to an adherend, and a semiconductor device having the electromagnetic wave shielding layer can be manufactured without deteriorating productivity. The present invention provides a film for the backside of a flip-chip type semiconductor to be formed on the backside of a semiconductor element that is flip-chip connected to an adherend, having an adhesive layer and an electromagnetic wave shielding layer.

摘要翻译： 可以在倒装芯片连接到被粘物的半导体元件的背面设置电磁波屏蔽层，并且可以制造具有电磁波屏蔽层的半导体器件，而不会降低生产率。 本发明提供了一种用于倒装芯片型半导体的背面的薄膜，该薄膜将形成在半导体元件的背面，该半导体元件倒装芯片连接到具有粘合剂层和电磁波屏蔽层的被粘物。

公开(公告)号：US20090253891A1

公开(公告)日：2009-10-08

申请号：US12484700

申请日：2009-06-15

申请人： Yoshio TERADA ,  Hirofumi FUJII ,  Makoto NAMIKAWA ,  Daisuke UENDA ,  Yasuhiro AMANO

发明人： Yoshio TERADA ,  Hirofumi FUJII ,  Makoto NAMIKAWA ,  Daisuke UENDA ,  Yasuhiro AMANO

IPC分类号： C08G69/26

CPC分类号： B32B27/28 ,  B32B27/06 ,  B32B27/34 ,  B32B27/36 ,  B32B2307/31 ,  B32B2307/54 ,  B32B2432/00 ,  Y10T428/28 ,  Y10T428/2896 ,  Y10T428/31504 ,  Y10T428/31721

摘要： The present invention provides a cleaning substrate of a substrate processing equipment, which comprises a cleaning layer comprising a heat resistant resin with a storage modulus (1 Hz) at 20° C. up to 150° C. being 5×107 Pa to 1×109 Pa on at least one face of the substrate; and a polyimide resin suitable as the heat resistant resin for the cleaning layer and usable under circumstances possibly involving the generation of serious disadvantages due to silicone contamination, such as for HDD application and some semiconductor applications.

摘要翻译： 本发明提供了一种基板处理设备的清洁基板，其包括在20℃至150℃下具有储能模量（1Hz）的耐热树脂的清洁层，为5×10 7 Pa至1×10 9 Pa 底物的至少一个面; 以及适合用作清洁层的耐热树脂的聚酰亚胺树脂，并且可用于可能涉及由于硅氧烷污染而产生严重缺点的环境，例如用于HDD应用和一些半导体应用。

公开(公告)号：US20070163621A1

公开(公告)日：2007-07-19

申请号：US10591330

申请日：2005-03-07

申请人： Hitoshi Ishizaka ,  Daisuke Uenda ,  Daisuke Hanai

发明人： Hitoshi Ishizaka ,  Daisuke Uenda ,  Daisuke Hanai

IPC分类号： B08B9/00

CPC分类号： H01L21/6715 ,  H01L21/6708

摘要： An object is to provide a cleaning member for semiconductor apparatus which can easily remove, without fail, foreign matters adherent to inner parts of a semiconductor apparatus, can bear a clearly readable mark for lot management, and can be prevented from generating particles upon contact with the holding part of a wafer case. A cleaning member for semiconductor apparatus, characterized in that the cleaning member comprises a wafer 1 and formed on at least one side thereof a cleaning layer 2 made of a heat-resistant resin formed by thermally curing a poly(amic acid), and that the cleaning layer 2 has a part 12 where a wafer surface is exposed; and in particular a cleaning member for semiconductor apparatus having the constitution described above wherein that part 12 in the cleaning layer 2 in which a wafer surface is exposed is a part where the cleaning layer has been removed throughout the whole circular area having a given width ranging from the peripheral edge of the wafer toward the center thereof.

摘要翻译： 本发明的目的是提供一种用于半导体装置的清洁部件，其能够容易地去除附着于半导体装置的内部部件的异物，从而能够为批次管理提供清晰可读的标记，并且可以防止在接触时产生颗粒 晶片盒的保持部分。 一种用于半导体装置的清洁部件，其特征在于，所述清洁部件包括晶片1，并且在其至少一侧上形成由通过热固化聚（酰胺酸）形成的耐热树脂制成的清洁层2， 清洁层2具有暴露晶片表面的部分12; 特别是具有上述结构的半导体装置用清洁部件，其中，露出晶片表面的清洁层2中的部分12是在具有给定宽度范围的整个圆形区域中已经清除了清洁层的部分 从晶片的周缘朝向其中心。

公开(公告)号：US20050244632A1

公开(公告)日：2005-11-03

申请号：US11014779

申请日：2004-12-20

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： B08B7/00 ,  B32B27/06

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US08524007B2

公开(公告)日：2013-09-03

申请号：US12977762

申请日：2010-12-23

申请人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

发明人： Daisuke Uenda ,  Yukio Arimitsu ,  Yoshio Terada ,  Yasuhiro Amano ,  Akihisa Murata

IPC分类号： B08B7/00 ,  B32B3/30 ,  B32B17/10

CPC分类号： B08B1/00 ,  B08B7/0028 ,  H01L21/02096 ,  Y10T428/24355 ,  Y10T428/2457 ,  Y10T428/24612 ,  Y10T428/31

摘要： A cleaning sheet including a cleaning layer which has a microasperity shape having an arithmetic average roughness Ra of 0.05 μm or less and a maximum height Rz of 1.0 μm or less. Preferably, a substantial surface area of the cleaning layer per a flat surface of 1 mm2 is 150% or more of a substantial surface area of a silicon wafer mirror surface per a flat area of 1 mm2. The cleaning sheet may be provided on at least one surface of a transfer member so that the transfer member has a cleaning function. When the cleaning sheet or the transfer member having a cleaning function is transferred in a substrate processing apparatus in place of a substrate to be processed therein, the cleaning sheet contacts and cleans a site of the substrate processing apparatus.

摘要翻译： 一种清洁片，包括具有0.05微米以下的算术平均粗糙度Ra和1.0mum以下的最大高度Rz的微细度形状的清洁层。 优选地，每1mm平坦表面的清洁层的基本表面积为1mm 2的平坦区域的硅晶片镜表面的基本表面积的150％或更多。 清洁片可以设置在转印构件的至少一个表面上，使得转印构件具有清洁功能。 当清洁片或具有清洁功能的转印元件在衬底处理设备中转移以代替待处理衬底时，清洁片接触并清洁衬底处理设备的位置。

公开(公告)号：US20120126381A1

公开(公告)日：2012-05-24

申请号：US13298687

申请日：2011-11-17

申请人： Daisuke UENDA ,  Takeshi MATSUMURA ,  Koichi INOUE ,  Miki MORITA

发明人： Daisuke UENDA ,  Takeshi MATSUMURA ,  Koichi INOUE ,  Miki MORITA

IPC分类号： H01L23/552 ,  B32B7/12

CPC分类号： H01L25/0657 ,  C09J7/28 ,  C09J2203/326 ,  H01L21/6836 ,  H01L23/552 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L2221/68327 ,  H01L2224/16225 ,  H01L2224/27436 ,  H01L2224/29 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/83862 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06537 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01037 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01055 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01059 ,  H01L2924/01063 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01076 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/3025 ,  Y10T428/28 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2924/01026 ,  H01L2924/01028 ,  H01L2924/3512 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299

摘要： An object of the present invention is to decrease the influence of an electromagnetic wave emitted from one semiconductor chip on other semiconductor chips in the same package, amounted substrate, adjacent devices, and the package. The present invention provides an adhesive film for a semiconductor device having an adhesive layer and an electromagnetic wave shielding layer, in which the attenuation of the electromagnetic wave that penetrates the adhesive film for a semiconductor device is 3 dB or more in at least a portion of the frequency range of 50 MHz to 20 GHz.

摘要翻译： 本发明的一个目的是减少在同一封装，基片，相邻器件和封装中的一个半导体芯片发射的电磁波对其它半导体芯片的影响。 本发明提供一种具有粘合层和电磁波屏蔽层的半导体装置用粘合膜，其中贯穿半导体装置用粘合膜的电磁波的衰减在至少一部分中为3dB以上 频率范围为50 MHz至20 GHz。

公开(公告)号：US20120042902A1

公开(公告)日：2012-02-23

申请号：US13266768

申请日：2010-04-13

申请人： Daisuke Uenda

发明人： Daisuke Uenda

IPC分类号： B08B1/00 ,  H01L21/02

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  C09J7/22

摘要： Provided are a cleaning sheet and a transfer member provided with a cleaning function, which are excellent in foreign matter removing performance and transfer performance and which are capable of removing foreign matters each having a predetermined particle diameter particularly efficiently. The cleaning sheet of the present invention includes a cleaning layer substantially free of an adhesive ability, in which: the cleaning layer has an uneven portion having an average surface roughness Ra of 0.10 μm or more; and the cleaning layer has a 180° peeling adhesion of less than 0.20 N/10 mm, which is defined by JIS-Z-0237 with respect to a mirror surface of a silicon wafer. The transfer member provided with a cleaning function of the present invention includes a transfer member and the cleaning layer of the present invention provided on at least one surface of the transfer member.

摘要翻译： 提供具有清除功能的清洁片和转印部件，它具有优异的异物去除性能和转印性能，并且能够特别有效地去除具有预定粒径的异物。 本发明的清洁片包括基本上不具有粘合能力的清洁层，其中：清洁层具有平均表面粗糙度Ra为0.10μm以上的凹凸部; 并且清洁层具有相对于硅晶片的镜面由JIS-Z-0237定义的小于0.20N / 10mm的180°剥离粘合力。 具有本发明的清洁功能的转印部件包括设置在转印部件的至少一个表面上的转印部件和本发明的清洁层。

公开(公告)号：US07793668B2

公开(公告)日：2010-09-14

申请号：US11014779

申请日：2004-12-20

申请人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

发明人： Makoto Namikawa ,  Yoshio Terada ,  Jirou Nukaga ,  Eiji Toyoda ,  Hirofumi Fujii ,  Daisuke Uenda ,  Asami Funatsu ,  Nobuaki Maruoka ,  Hitoshi Ishizaka ,  Yasuhiro Amano

IPC分类号： B08B3/00

CPC分类号： B08B1/00 ,  B08B7/00 ,  B08B7/0028 ,  Y10T428/2848 ,  Y10T428/31721

摘要： A cleaning sheet for cleaning foreign matters away from the interior of the substrate processing equipment is provided. The cleaning sheet includes a cleaning layer having substantially no tackiness and having a tensile modulus of not lower than 0.98 N/mm2 as determined according to JIS K7127. Alternatively, the cleaning sheet includes a cleaning layer having a Vickers hardness of not lower than 10 MPa.

摘要翻译： 提供了一种用于清除离开基板处理设备内部的异物的清洁片。 清洁片包括基本上没有粘性并且根据JIS K7127测定的拉伸模量不低于0.98N / mm 2的清洁层。 或者，清洁片包括维氏硬度不低于10MPa的清洁层。

公开(公告)号：US06798487B1

公开(公告)日：2004-09-28

申请号：US09661057

申请日：2000-09-13

申请人： Akira Ohtani ,  Takashi Yamaoka ,  Daisuke Uenda ,  Hiroyuki Yoshimi

发明人： Akira Ohtani ,  Takashi Yamaoka ,  Daisuke Uenda ,  Hiroyuki Yoshimi

IPC分类号： G02F11333

CPC分类号： B32B15/08 ,  B32B27/08 ,  C08F283/00 ,  C08F283/10 ,  C08F290/00 ,  C08F290/06 ,  C08G59/226 ,  C08G59/38 ,  C08L63/00 ,  G02F1/133305 ,  G02F1/133528 ,  C08L2666/02

摘要： A liquid crystal cell substrate having a polarizing function is disclosed which can be extremely thin and lightweight and is excellent in heat resistance, impact resistance and quality stability. The liquid crystal cell substrate comprises a resin substrate and, closely adhered thereon, at least a gas barrier layer, a crosslinked resin layer and a polarizing layer, wherein the polarizing layer comprises a coating layer. This cell substrate, having a polarizing function and high durability, can be efficiently produced because an exceedingly thin polarizing layer having excellent heat resistance can be deposited on a resin substrate by coating and because a gas barrier layer and a crosslinked resin layer also can be easily formed. It is excellent in moisture resistance, gas resistance and impact resistance, can be extremely thin and lightweight, and has excellent heat resistance. With this liquid crystal cell substrate, a liquid crystal cell excellent in the long-term stability of display quality can be fabricated.

摘要翻译： 公开了一种具有极化功能的液晶单元基板，其极薄且重量轻，耐热性，耐冲击性和质量稳定性优异。 液晶单元基板包括树脂基板，并且紧密地粘附在其上，至少阻气层，交联树脂层和偏振层，其中偏振层包括涂层。 具有极化功能和高耐久性的电池基板可以有效地制造，因为通过涂布可以在树脂基板上沉积出优异的耐热性的极薄的偏振层，并且由于阻气层和交联树脂层也可以容易地 形成。 耐湿性，耐气体性和耐冲击性优异，可以非常轻薄，耐热性优异。 利用该液晶单元基板，可以制造显示质量的长期稳定性优异的液晶元件。