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    Hard disk drive preamp heat dissipation methods
    2.
    发明申请
    Hard disk drive preamp heat dissipation methods 审中-公开
    硬盘驱动器前置放大器散热方式

    公开(公告)号：US20070246822A1

    公开(公告)日：2007-10-25

    申请号：US11410394

    申请日：2006-04-25

    申请人： Kerry Glover ,  Edgar Zuniga-Ortiz

    发明人： Kerry Glover ,  Edgar Zuniga-Ortiz

    IPC分类号： H01L23/34

    CPC分类号： H01L23/4985 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/4006 ,  H01L23/492 ,  H01L24/16 ,  H01L24/32 ,  H01L24/40 ,  H01L24/84 ,  H01L2224/16 ,  H01L2224/32188 ,  H01L2224/40225 ,  H01L2224/73153 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2224/37099

    摘要： A heatsink architecture employing a combination of stiffeners and flex substrate to improve the sinking of heat from the integrated circuit. The stiffener may be employed in numerous locations, including above the integrated circuit, or interposed between the integrated circuit and an e-block. The flex substrate may be interposed between the integrated circuit and the stiffener, while in other embodiments the integrated circuit is directly coupled to the e-block via heat conductive epoxy and the like. Solder balls may be employed to connect the flex substrate to integrated circuit. The flex substrate may take different forms, and may or may not be connected to the e-block. The flex substrate may be connected directly to the e-block, or connected via an e-pin extending through layers including the flex substrate and/or the stiffener.

    摘要翻译： 采用加强件和柔性基板组合的散热结构，以改善集成电路的热量沉降。 加强件可用于包括集成电路上方在内的多个位置，或插入在集成电路和电子块之间。 柔性基板可以插入在集成电路和加强件之间，而在其它实施例中，集成电路通过导热环氧树脂等直接耦合到电子块。 可以使用焊球将柔性基板连接到集成电路。 柔性基板可以采取不同的形式，并且可以或可以不连接到电子块。 柔性基板可以直接连接到e块，或者通过延伸穿过包括柔性基板和/或加强件的层的e形引脚连接。

    Semiconductor device having directly attached heat spreader
    3.
    发明申请
    Semiconductor device having directly attached heat spreader 审中-公开
    具有直接连接散热器的半导体装置

    公开(公告)号：US20060170080A1

    公开(公告)日：2006-08-03

    申请号：US11050059

    申请日：2005-02-03

    申请人： Edgar Zuniga-Ortiz ,  Richard Saye ,  Lance Wright

    发明人： Edgar Zuniga-Ortiz ,  Richard Saye ,  Lance Wright

    IPC分类号： H01L23/495

    CPC分类号： H01L23/49568 ,  H01L23/49551 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus consisting of a leadframe (301) and a metallic heat spreader (310). The leadframe, made of a planar metal sheet, includes a plurality of non-coplanar members (312) operable as mechanical couplers configured to grip inserted objects. The heat spreader has a central pad (310) suitable for mounting a heat-generating object, and a plurality of handles (312) in locations to match the members; the handles are coupled with the members. One member end is formed as a clamp having projections from the planar sheet, operable to grip one of the handles, when it is inserted into the coupler, and also has a bend so that the plane of the heat spreader, after insertion of its handles into the clamps, is spaced from the plane of the leadframe. A gap is thus created between the spreader and the first leadframe segment ends.

    摘要翻译： 一种由引线框架（301）和金属散热器（310）组成的装置。 由平面金属板制成的引线框架包括多个非共面构件（312），其可操作为构造成夹持插入物体的机械耦合器。 散热器具有适于安装发热物体的中心衬垫（310）和与构件相配合的位置上的多个把手（312）; 手柄与构件相连。 一个构件端形成为具有来自平面片的突起的夹具，当其插入耦合器时可操作地夹持手柄中的一个，并且还具有弯曲部，使得散热器的平面在其手柄插入之后 夹持器与引线框的平面间隔开。 因此，在扩展器和第一引线框架段之间产生间隙。

    Method for efficient annealing of plated semiconductor package leads
    6.
    发明申请
    Method for efficient annealing of plated semiconductor package leads 审中-公开
    电镀半导体封装引线的高效退火方法

    公开(公告)号：US20060189029A1

    公开(公告)日：2006-08-24

    申请号：US11065689

    申请日：2005-02-24

    申请人： Sreenivasan Koduri ,  Edgar Zuniga-Ortiz

    发明人： Sreenivasan Koduri ,  Edgar Zuniga-Ortiz

    IPC分类号： H01L21/44

    CPC分类号： H01L21/56 ,  H01L23/49582 ,  H01L2924/0002 ,  H01L2924/00

    摘要： A method for completing an assembled semiconductor device, which has metallic leads for connection to external parts. The method comprises the step (202) of encapsulating the assembled device with a polymeric precursor so that at least portions of the leads remain un-encapsulated. Without significant delay, these un-encapsulated lead portions are plated (203) with at least one metal layer suitable for connection to external parts; the plating step has no noticeable impact on the uncured mold compound. The encapsulated and plated device is then submitted (204) to a sequence of elevated temperatures for specified periods of time so that concurrently the precursor is polymerized and the at least one metal layer is annealed.

    摘要翻译： 一种用于完成组装的半导体器件的方法，其具有用于连接到外部部件的金属引线。 该方法包括将组装的装置与聚合物前体封装的步骤（202），使得至少部分引线保持未包封。 没有显着的延迟，这些未封装的引线部分被电镀（203）与至少一个适于连接到外部部件的金属层; 电镀步骤对未固化的模塑料没有明显的影响。 然后将包封和镀覆的装置（204）提交到指定时间段的升高的温度序列，使得前体聚合并且至少一个金属层被退火。