公开(公告)号：US09024341B2

公开(公告)日：2015-05-05

申请号：US12912900

申请日：2010-10-27

申请人： Hsiao-Wen Lee ,  Shang-Yu Tsai ,  Tien-Ming Lin ,  Chyi Shyuan Chern ,  Hsin-Hsien Wu ,  Fu-Wen Liu ,  Huai-En Lai ,  Yu-Sheng Tang

发明人： Hsiao-Wen Lee ,  Shang-Yu Tsai ,  Tien-Ming Lin ,  Chyi Shyuan Chern ,  Hsin-Hsien Wu ,  Fu-Wen Liu ,  Huai-En Lai ,  Yu-Sheng Tang

IPC分类号： H01L33/00 ,  H01L33/54 ,  H01L33/44 ,  H01L33/50 ,  H01L33/56

CPC分类号： H01L33/54 ,  H01L33/44 ,  H01L33/504 ,  H01L33/507 ,  H01L33/56 ,  H01L2224/48091 ,  H01L2924/0002 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2933/005 ,  H01L2924/00 ,  H01L2924/00014

摘要： Two or more molded ellipsoid lenses are formed on a packaged LED die by injecting a glue material into a mold over the LED die and curing the glue material. After curing, the refractive index of the lens in contact with the LED die is greater than the refractive index of the lens not directly contacting the LED die. At least one phosphor material is incorporated into the glue material for at least one of the lenses not directly contacting the LED die. The lens directly contacting the LED die may also include one or more phosphor material. A high refractive index coating may be applied between the LED die and the lens.

摘要翻译： 在封装的LED模具上形成两个或多个模制的椭圆体透镜，该胶片通过将胶料注入到LED模具中的模具中并固化胶料。 固化后，与LED芯片接触的透镜的折射率大于不直接接触LED芯片的透镜的折射率。 对于不直接接触LED管芯的透镜中的至少一个，将至少一种磷光体材料结合到胶合材料中。 直接接触LED芯片的透镜还可以包括一种或多种荧光体材料。 可以在LED管芯和透镜之间施加高折射率涂层。

公开(公告)号：US20140054616A1

公开(公告)日：2014-02-27

申请号：US13594219

申请日：2012-08-24

申请人： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Ming Lin

发明人： Chi-Xiang Tseng ,  Hsiao-Wen Lee ,  Min-Sheng Wu ,  Tien-Ming Lin

IPC分类号： H01L33/48 ,  H01L33/08

CPC分类号： H01L33/62 ,  H01L25/0753 ,  H01L33/50 ,  H01L2224/13 ,  H01L2924/0002 ,  H01L2933/0041 ,  H01L2924/00

摘要： The present disclosure involves a method of packaging a light-emitting diode (LED). According to the method, a group of metal pads and a group of LEDs are provided. The group of LEDs is attached to the group of metal pads, for example through a bonding process. After the LEDs are attached to the metal pads, each LED is spaced apart from adjacent LEDs. Also according to the method, a phosphor film is coated around the group of LEDs collectively. The phosphor film is coated on top and side surfaces of each LED and between adjacent LEDs. A dicing process is then performed to slice through portions of the phosphor film located between adjacent LEDs. The dicing process divides the group of LEDs into a plurality of individual phosphor-coated LEDs.

公开(公告)号：US08647900B2

公开(公告)日：2014-02-11

申请号：US12885892

申请日：2010-09-20

申请人： Chi Xiang Tseng ,  Hsiao-Wen Lee

发明人： Chi Xiang Tseng ,  Hsiao-Wen Lee

IPC分类号： H01L21/00

CPC分类号： H01L33/505 ,  H01L33/54 ,  H01L2224/14 ,  H01L2933/0041

摘要： An optical emitter includes micro-structure phosphor coating on a light-emitting diode die mounted on a package substrate. The micro-structures are transferred onto a micro-structure phosphor coating precursor by patterning and curing the precursor or by curing the precursor through a mold. The micro-structures are half spheroids, three-sided pyramids, or six-sided pyramids.

摘要翻译： 光发射器包括安装在封装衬底上的发光二极管管芯上的微结构磷光体涂层。 通过图案化和固化前体或通过模具固化前体将微结构转移到微结构荧光体涂层前体上。 微结构是半球体，三面体金字塔或六边形金字塔。

公开(公告)号：US08524521B2

公开(公告)日：2013-09-03

申请号：US12539309

申请日：2009-08-11

申请人： Hsiao-Wen Lee ,  Pai-Chun Peter Zung ,  Tzu-Han Lin

发明人： Hsiao-Wen Lee ,  Pai-Chun Peter Zung ,  Tzu-Han Lin

IPC分类号： H01L21/00

CPC分类号： H04N5/2254 ,  H04N5/2257

摘要： A wafer level image module includes a photo sensor for outputting an electrical signal upon receiving light, a lens set for focusing incident light onto the photo sensor, and an adjustment member disposed between the photo sensor and the lens set for controlling the distance between the photo sensor and the lens set to compensate the focus offset of the photo sensor for enabling the lens set to accurately focus the incident light onto the photo sensor in an in-focus manner so as to provide a high image quality.

摘要翻译： 晶片级图像模块包括用于在接收光时输出电信号的光传感器，用于将入射光聚焦到光传感器上的透镜组以及设置在光传感器和透镜组之间的调节构件，用于控制照片之间的距离 传感器和透镜设置以补偿光传感器的聚焦偏移，以使透镜组能够以聚焦方式精确地将入射光聚焦到光传感器上，从而提供高图像质量。

公开(公告)号：US08486724B2

公开(公告)日：2013-07-16

申请号：US12910363

申请日：2010-10-22

申请人： Hao-Wei Ku ,  Chung Yu Wang ,  Yu-Sheng Tang ,  Hsin-Hung Chen ,  Hao-Yu Yang ,  Ching-Yi Chen ,  Hsiao-Wen Lee ,  Chi Xiang Tseng ,  Sheng-Shin Guo ,  Tien-Ming Lin ,  Shang-Yu Tsai

发明人： Hao-Wei Ku ,  Chung Yu Wang ,  Yu-Sheng Tang ,  Hsin-Hung Chen ,  Hao-Yu Yang ,  Ching-Yi Chen ,  Hsiao-Wen Lee ,  Chi Xiang Tseng ,  Sheng-Shin Guo ,  Tien-Ming Lin ,  Shang-Yu Tsai

IPC分类号： H01L21/00

CPC分类号： H01L27/15 ,  H01L24/97 ,  H01L25/167 ,  H01L33/486 ,  H01L33/54 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/8592 ,  H01L2924/01322 ,  H01L2924/10253 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0058 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： An optical emitter is fabricated by bonding a Light-Emitting Diode (LED) die to a package wafer, electrically connecting the LED die and the package wafer, forming a phosphor coating over the LED die on the package wafer, molding a lens over the LED die on the package wafer, molding a reflector on the package wafer, and dicing the wafer into at least one optical emitter.

摘要翻译： 通过将发光二极管（LED）裸片结合到封装晶片，电连接LED管芯和封装晶片，在封装晶片上的LED管芯上形成荧光体涂层，在LED上模制透镜来制造光发射器 在封装晶片上模制，在封装晶片上模制反射器，并将晶片切割成至少一个光发射器。

公开(公告)号：US20120261690A1

公开(公告)日：2012-10-18

申请号：US13087564

申请日：2011-04-15

申请人： Hsiao-Wen LEE ,  Shang-Yu TSAI ,  Pei-Wen KO

发明人： Hsiao-Wen LEE ,  Shang-Yu TSAI ,  Pei-Wen KO

IPC分类号： H01L33/58 ,  H01L33/50

CPC分类号： H01L33/005 ,  H01L33/50 ,  H01L33/58 ,  H01L33/60 ,  H01L2933/0041 ,  H01L2933/0058

摘要： A light emitting diode (LED) with a micro-structure lens includes a LED die and a micro-structure lens. The micro-structure lens includes a convex lens portion, at least one concentric ridge structure surrounding the convex lens portion, and a lower portion below the convex lens portion and the at least one concentric ridge structure. The lower portion is arranged to be disposed over the LED die. A first optical path length from an edge of the LED die to a top center of the microstructure lens is substantially the same as a second optical path length from the edge of the LED die to a side of the micro-structure lens.

摘要翻译： 具有微结构透镜的发光二极管（LED）包括LED管芯和微结构透镜。 微结构透镜包括凸透镜部分，围绕凸透镜部分的至少一个同心脊结构，以及在凸透镜部分下方的下部和至少一个同心脊结构。 下部布置成设置在LED管芯上。 从LED管芯的边缘到微结构透镜的顶部中心的第一光路长度基本上与从LED管芯的边缘到微结构透镜的侧面的第二光程长度相同。

公开(公告)号：US20120113621A1

公开(公告)日：2012-05-10

申请号：US13273470

申请日：2011-10-14

申请人： Hsiao-Wen LEE ,  Chi Xiang TSENG

发明人： Hsiao-Wen LEE ,  Chi Xiang TSENG

IPC分类号： G09F13/04 ,  B29C31/00 ,  F21V5/04

CPC分类号： H01L33/54 ,  F21V5/04 ,  F21W2131/103 ,  F21Y2115/10 ,  H01L33/60 ,  H01L2224/48091 ,  H01L2924/13091 ,  H01L2924/00014 ,  H01L2924/00

摘要： A batwing beam is produced from an LED package having a primary LED lens by molding the LED lens directly over an LED on a package substrate. The LED lens includes a cavity over a center of the LED. The cavity surface reflects light from the LED through total internal reflection (TIR) or through a reflectivity gel coating. The cavity may be a cone or a pyramid.

摘要翻译： 通过在封装衬底上的LED上直接模制LED透镜，从具有主要LED透镜的LED​​封装产生蝙蝠光束。 LED透镜包括位于LED中心的空腔。 空腔表面通过全内反射（TIR）或通过反射性凝胶涂层反射来自LED的光。 空腔可以是锥体或金字塔。

公开(公告)号：US07914174B2

公开(公告)日：2011-03-29

申请号：US12332696

申请日：2008-12-11

申请人： Chih-Chiang Ho ,  Hsiao-Wen Lee

发明人： Chih-Chiang Ho ,  Hsiao-Wen Lee

IPC分类号： G02B3/08 ,  F21S9/00

CPC分类号： G02B3/08 ,  G02B19/0014 ,  G02B19/0061 ,  G02B27/0955

摘要： A micro-optic lens is disclosed. The micro-optic lens includes a substrate; and a lens element on the substrate, wherein the lens element includes a flat surface and an annularly grooved surface including first facets and second facets, and wherein the first facets collimate a light effectively and the second facets are parallel to a light. The micro-optic lens can decrease the draft loss and collimate the emitted light beams to increase the light efficiency. Further, the present invention also provides a method for designing angles of micro-optic lenses.

摘要翻译： 公开了一种微光学透镜。 微光学透镜包括基底; 以及透镜元件，其中所述透镜元件包括平坦表面和包括第一刻面和第二面的环形凹槽表面，并且其中所述第一刻面有效地准直光，并且所述第二刻面平行于光。 微光学透镜可以减小牵引损耗并准直发射的光束以提高光效。 此外，本发明还提供了一种用于设计微光学透镜的角度的方法。

公开(公告)号：US07875949B2

公开(公告)日：2011-01-25

申请号：US12039540

申请日：2008-02-28

申请人： Hsiao-Wen Lee

发明人： Hsiao-Wen Lee

IPC分类号： H01L31/075

CPC分类号： H01L27/14632 ,  H01G9/2031 ,  H01G9/2059 ,  H01L27/14627 ,  H01L27/14692 ,  Y02E10/542

摘要： An image sensor device is disclosed. The image sensor device comprises a substrate having a pixel region and at least one integrated circuit in the substrate of the pixel region. A photodiode is disposed on the substrate of the pixel region, comprising a lower electrode, a transparent upper electrode and a photoelectric conversion layer. The lower electrode is disposed on the substrate and is electrically connected to the integrated circuit. The photoelectric conversion layer is disposed on the lower electrode and has a submicron structure therein. The transparent upper electrode is disposed on the photoelectric conversion layer.

摘要翻译： 公开了一种图像传感器装置。 图像传感器装置包括在像素区域的衬底中具有像素区域和至少一个集成电路的衬底。 光电二极管设置在像素区域的基板上，包括下电极，透明上电极和光电转换层。 下电极设置在基板上并与集成电路电连接。 光电转换层设置在下电极上，其中具有亚微米结构。 透明上电极设置在光电转换层上。

公开(公告)号：US07860357B2

公开(公告)日：2010-12-28

申请号：US12228102

申请日：2008-08-09

申请人： Hsiao-Wen Lee ,  Peter Zung ,  Tzu-Han Lin ,  Tzy-Ying Lin ,  Chia-Yang Chang ,  Chien-Pang Lin

发明人： Hsiao-Wen Lee ,  Peter Zung ,  Tzu-Han Lin ,  Tzy-Ying Lin ,  Chia-Yang Chang ,  Chien-Pang Lin

IPC分类号： G02B6/12

CPC分类号： H01L27/14618 ,  H01L21/76898 ,  H01L23/481 ,  H01L27/14683 ,  H01L2223/6622 ,  H01L2224/274 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/00

摘要： An optoelectronic device chip, and a method for making the chip, are disclosed. The chip comprises a device substrate, an optically transparent upper substrate, and a composite spacer layer which includes an adhesive material and a plurality of particles dispersed in said adhesive material. The distance between the device substrate and the upper substrate is controlled by the thickness of the composite spacer layer so that the variation is within the depth of focus of optical system.

摘要翻译： 公开了一种光电器件芯片及其制造方法。 芯片包括器件基板，光学透明上基板和复合间隔层，其包括粘合材料和分散在所述粘合材料中的多个颗粒。 器件基板和上基板之间的距离由复合间隔层的厚度控制，使得该变化在光学系统的焦深范围内。