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10 条记录 (耗时 0.013 秒)

    Printed circuit board and method of manufacturing the same
    1.
    发明申请
    Printed circuit board and method of manufacturing the same 失效
    印刷电路板及其制造方法

    公开(公告)号：US20070141310A1

    公开(公告)日：2007-06-21

    申请号：US11585276

    申请日：2006-10-24

    申请人： Jong Seok Song ,  Taehoon Kim

    发明人： Jong Seok Song ,  Taehoon Kim

    IPC分类号： B05D5/12 ,  B32B3/00

    CPC分类号： H05K1/036 ,  B32B3/266 ,  B32B27/08 ,  B32B27/16 ,  B32B27/28 ,  B32B27/281 ,  B32B27/304 ,  B32B27/322 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/728 ,  B32B2457/08 ,  C08J7/045 ,  H05K1/034 ,  H05K3/108 ,  H05K3/381 ,  H05K3/426 ,  H05K2201/015 ,  H05K2203/092 ,  Y10T428/24917

    摘要： Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. According to this invention, the interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.

    摘要翻译： 公开了一种印刷电路板及其制造方法，其中在树脂基板上形成氟树脂涂层，然后使用包括离子束表面处理和真空沉积的干法形成铜层，而不是形成铜层 常规湿法包括表面粗糙化和无电镀铜。 根据本发明，可以在不改变其表面粗糙度的情况下增加基板材料的界面粘合性，从而实现高可靠性的精细电路。 同样，由于氟树脂层的形成，可以获得低介电常数和低损耗系数。 此外，用干法代替湿法，由此可以以环境友好的方式形成铜镀层。

    Twisted electric heating cables and method for manufacturing thereof
    2.
    发明授权
    Twisted electric heating cables and method for manufacturing thereof 失效
    双绞电加热电缆及其制造方法

    公开(公告)号：US07987659B2

    公开(公告)日：2011-08-02

    申请号：US12092546

    申请日：2006-11-13

    申请人： Jong Seok Song

    发明人： Jong Seok Song

    IPC分类号： D02G3/02

    CPC分类号： H05B3/56 ,  Y10T29/49083

    摘要： Disclosed herein is an electric heating cable which is used in an electric heating apparatus and minimizes an electromagnetic field effect. The electric heating cable is manufactured by twisting first and second electric heating strands in three axial directions. Each electric heating strand includes a core wire comprising a stranded wire of a resistor, and an insulating sheath made of fluorine resin. According to the invention, the electric heating cable is resistive to untwisting in a free state even if no adhering means is used, and is compactly twisted, so that the electric heating cable maintains a secured state and has superior flexibility, while reducing leakage flux, and the electric heating cable has a reduced outer diameter and is light, so that it is useful for a thin electric heating apparatus, and incurs a low manufacturing cost.

    摘要翻译： 这里公开了一种电加热电缆，其用于电加热装置中并使电磁场效应最小化。 电加热电缆是通过在第一和第二电加热线在三个轴向上扭转制造的。 每个电加热线包括包括电阻器的绞线的芯线和由氟树脂制成的绝缘护套。 根据本发明，即使没有使用粘合手段，电加热电缆在自由状态下具有解捻性，并且紧凑扭曲，使得电加热电缆保持固定状态并具有优异的柔性，同时减少漏磁通， 并且电加热电缆具有减小的外径并且较轻，使得其对于薄的电加热装置是有用的，并且导致低的制造成本。

    Method of manufacturing build-up printed circuit board
    4.
    发明授权
    Method of manufacturing build-up printed circuit board 失效
    制造印刷电路板的方法

    公开(公告)号：US07707716B2

    公开(公告)日：2010-05-04

    申请号：US11709215

    申请日：2007-02-22

    申请人： Jong Seok Song ,  Taehoon Kim ,  Dong Sun Kim ,  Hye Yeon Cha

    发明人： Jong Seok Song ,  Taehoon Kim ,  Dong Sun Kim ,  Hye Yeon Cha

    IPC分类号： H01K3/10

    CPC分类号： H05K3/381 ,  H05K3/108 ,  H05K3/146 ,  H05K3/4069 ,  H05K3/426 ,  H05K3/4602 ,  H05K2201/0959 ,  H05K2203/092 ,  H05K2203/1152 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： A method of manufacturing a build-up printed circuit board, in which the circuit of a build-up printed circuit board including a core layer and an outer layer is realized by forming the metal seed layer of the core layer using a dry process, consisting of ion beam surface treatment and vacuum deposition, instead of a conventional wet process, including a wet surface roughening process and electroless plating. When the wet process is replaced with the dry process in the method of the invention, the circuit layer can be formed in an environmentally friendly manner, and as well, all circuit layers of the substrate including the core layer and the outer layer can be manufactured through a semi-additive process. Further, the peel strength between the resin substrate and the metal layer can be increased, thus realizing a highly reliable fine circuit.

    摘要翻译： 一种积层印刷电路板的制造方法，其中通过使用干法形成芯层的金属种子层来实现包括芯层和外层的积层印刷电路板的电路，其包括 的离子束表面处理和真空沉积，而不是常规的湿法，包括湿表面粗糙化处理和无电镀。 当在本发明的方法中用干法代替湿法时，电路层可以以环境友好的方式形成，并且可以制造包括芯层和外层的基片的所有电路层 通过半加成过程。 此外，可以提高树脂基板和金属层之间的剥离强度，从而实现高可靠性的精细电路。

    Twisted Electric Heating Cables And Method For Manufacturing Thereof
    6.
    发明申请
    Twisted Electric Heating Cables And Method For Manufacturing Thereof 失效
    双绞电加热电缆及其制造方法

    公开(公告)号：US20090188231A1

    公开(公告)日：2009-07-30

    申请号：US12092546

    申请日：2006-11-13

    申请人： Jong Seok Song

    发明人： Jong Seok Song

    IPC分类号： D01H1/14 ,  H05B3/00

    CPC分类号： H05B3/56 ,  Y10T29/49083

    摘要： Disclosed herein is an electric heating cable which is used in an electric heating apparatus and minimizes an electromagnetic field. The electric heating cable is manufactured by twisting first and second electric heating strands in three axes. Each electric heating strand includes a core wire comprising a stranded wire of a resistor, and an insulating sheath made of fluorine resin. According to the invention, the electric heating cable does not come untwisted in a free state even if no adhering means is used, and is compactly twisted, so that the electric heating cable maintains a state of closer contact and has superior flexibility, thus reducing leakage flux, and the electric heating cable has a small in outer diameter and is light, so that it is useful for a thin electric heating apparatus, and incurs a low manufacturing cost.

    摘要翻译： 这里公开了一种电加热电缆，其用于电加热装置并使电磁场最小化。 电加热电缆通过将第一和第二电加热线绞合在三个轴上来制造。 每个电加热线包括包括电阻器的绞线的芯线和由氟树脂制成的绝缘护套。 根据本发明，即使没有使用粘合手段，电加热电缆也不会在自由状态下解捻并且紧密地扭曲，使得电加热电缆保持更接近的状态并具有优异的柔性，从而减少泄漏 磁通，电加热电缆的外径小，重量轻，因此对于薄型电加热装置是有用的，并且制造成本低。

    Method of manufacturing build-up printed circuit board
    7.
    发明申请
    Method of manufacturing build-up printed circuit board 失效
    制造印刷电路板的方法

    公开(公告)号：US20070261234A1

    公开(公告)日：2007-11-15

    申请号：US11709215

    申请日：2007-02-22

    申请人： Jong Seok Song ,  Taehoon Kim ,  Dong Sun Kim ,  Hye Yeon Cha

    发明人： Jong Seok Song ,  Taehoon Kim ,  Dong Sun Kim ,  Hye Yeon Cha

    IPC分类号： H01K3/10 ,  H05K3/10 ,  H05K3/02

    CPC分类号： H05K3/381 ,  H05K3/108 ,  H05K3/146 ,  H05K3/4069 ,  H05K3/426 ,  H05K3/4602 ,  H05K2201/0959 ,  H05K2203/092 ,  H05K2203/1152 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

    摘要： Disclosed is a method of manufacturing a build-up printed circuit board, in which the circuit of a build-up printed circuit board including a core layer and an outer layer is realized by forming the metal seed layer of the core layer using a dry process, consisting of ion beam surface treatment and vacuum deposition, instead of a conventional wet process, including a wet surface roughening process and electroless plating. When the wet process is replaced with the dry process in the method of the invention, the circuit layer can be formed in an environmentally friendly manner, and as well, all circuit layers of the substrate including the core layer and the outer layer can be manufactured through a semi-additive process. Further, the peel strength between the resin substrate and the metal layer can be increased, thus realizing a highly reliable fine circuit.

    摘要翻译： 公开了一种积层印刷电路板的制造方法，其中通过使用干法形成芯层的金属种子层来实现包括芯层和外层的积层印刷电路板的电路 ，由离子束表面处理和真空沉积组成，代替常规的湿法，包括湿表面粗糙化处理和无电镀。 当在本发明的方法中用干法代替湿法时，电路层可以以环境友好的方式形成，并且可以制造包括芯层和外层的基片的所有电路层 通过半加成过程。 此外，可以提高树脂基板和金属层之间的剥离强度，从而实现高可靠性的精细电路。

    Printed circuit board and method of manufacturing the same
    10.
    发明授权
    Printed circuit board and method of manufacturing the same 失效
    印刷电路板及其制造方法

    公开(公告)号：US07601419B2

    公开(公告)日：2009-10-13

    申请号：US11585276

    申请日：2006-10-24

    申请人： Jong Seok Song ,  Taehoon Kim

    发明人： Jong Seok Song ,  Taehoon Kim

    IPC分类号： B32B15/00

    CPC分类号： H05K1/036 ,  B32B3/266 ,  B32B27/08 ,  B32B27/16 ,  B32B27/28 ,  B32B27/281 ,  B32B27/304 ,  B32B27/322 ,  B32B27/38 ,  B32B2255/10 ,  B32B2255/205 ,  B32B2255/26 ,  B32B2255/28 ,  B32B2307/728 ,  B32B2457/08 ,  C08J7/045 ,  H05K1/034 ,  H05K3/108 ,  H05K3/381 ,  H05K3/426 ,  H05K2201/015 ,  H05K2203/092 ,  Y10T428/24917

    摘要： Disclosed are a printed circuit board and a method of manufacturing the same, in which a fluorine resin coating layer is formed on a resin substrate, and then a copper layer is formed using a dry process including ion beam surface treatment and vacuum deposition instead of a conventional wet process including surface roughening and electroless copper plating. According to this invention, the interfacial adhesion of the substrate material may be increased without changing the surface roughness thereof, thus realizing a highly reliable fine circuit. As well, a low dielectric constant and a low loss coefficient may be obtained thanks to the formation of the fluorine resin layer. Further, a wet process is replaced with a dry process, whereby the copper plating layer may be formed in an environmentally friendly manner.

    摘要翻译： 公开了一种印刷电路板及其制造方法，其中在树脂基板上形成氟树脂涂层，然后使用包括离子束表面处理和真空沉积的干法形成铜层，而不是形成铜层 常规湿法包括表面粗糙化和无电镀铜。 根据本发明，可以在不改变其表面粗糙度的情况下增加基板材料的界面粘合性，从而实现高可靠性的精细电路。 同样，由于形成氟树脂层，可以获得低介电常数和低损耗系数。 此外，用干法代替湿法，由此可以以环境友好的方式形成铜镀层。