公开(公告)号：US20150179595A1

公开(公告)日：2015-06-25

申请号：US14136908

申请日：2013-12-20

Applicant: Mihir Oka ,  Xavier Brun ,  Dingying David Xu ,  Edward Prack ,  Kabirkumar Mirpuri ,  Saikumar Jayaraman

Inventor： Mihir Oka ,  Xavier Brun ,  Dingying David Xu ,  Edward Prack ,  Kabirkumar Mirpuri ,  Saikumar Jayaraman

IPC: H01L23/00 ,  C08L79/04 ,  B23K1/00 ,  C08L77/00 ,  C08K3/22 ,  B23K1/20 ,  C08G69/00 ,  C08K3/36

CPC classification number: H01L24/11 ,  B23K1/0016 ,  B23K1/20 ,  B23K26/361 ,  B23K26/362 ,  B23K2101/42 ,  C08G73/0233 ,  C08K3/22 ,  C08K3/36 ,  C08K2003/2241 ,  C09D179/02 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05647 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1147 ,  H01L2224/1181 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/131 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13347 ,  H01L2224/1339 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/81191 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012 ,  C08L79/04 ,  C08L79/02

Abstract: This disclosure relates generally to generating a solder-on-die using a water-soluble resist, system, and method. Heat may be applied to solder as applied to a hole formed in a water-soluble resist coating, the water-soluble resist coating being on a surface of an initial assembly. The initial assembly may include an electronic component. The surface may be formed, at least in part, by an electrical terminal of the electronic component, the hole being aligned, at least in part, with the electrical terminal. The solder may be reflowed, wherein the solder couples, at least in part, with the electrical terminal.

Abstract translation: 本公开总体上涉及使用水溶性抗蚀剂，系统和方法来生成管芯上的焊料。 当施加到形成在水溶性抗蚀剂涂层中的孔时，可以将热量施加到焊料上，水溶性抗蚀剂涂层在初始组件的表面上。 初始组件可以包括电子部件。 该表面可以至少部分地由电子部件的电端子形成，该孔至少部分地与电端子对准。 焊料可以被回流，其中焊料至少部分地与电端子耦合。

公开(公告)号：US20150077962A1

公开(公告)日：2015-03-19

申请号：US14031414

申请日：2013-09-19

Applicant: Kabirkumar Mirpuri

Inventor： Kabirkumar Mirpuri

IPC: H05K1/18 ,  H01L23/00 ,  H05K1/11 ,  B23K1/20

CPC classification number: H01L24/81 ,  B23K1/20 ,  H01L24/13 ,  H01L24/16 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/13101 ,  H01L2224/16225 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2225/06513 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15331 ,  H01L2924/1815 ,  H01L2924/20106 ,  H01L2924/351 ,  H05K3/3436 ,  H01L2924/00 ,  H01L2924/00014

Abstract: An electronic device including a solder structure and methods of forming an electrical interconnection are shown. Solder structures are shown including a solder ball formed from a first solder having a first melting temperature, and a connecting structure coupling the solder ball to one or more electrical connection pads, the connecting structure formed from a second solder having a second melting temperature lower than the first melting temperature. Electronic devices are shown including a polymer mold material formed over the solder structures.

Abstract translation: 示出了包括焊料结构的电子器件和形成电互连的方法。 示出了焊接结构，其包括由具有第一熔融温度的第一焊料形成的焊球和将焊球耦合到一个或多个电连接焊盘的连接结构，该连接结构由第二焊料形成，第二焊料具有低于 第一个熔化温度。 示出了包括在焊料结构上形成的聚合物模具材料的电子器件。

公开(公告)号：US10008419B2

公开(公告)日：2018-06-26

申请号：US14343598

申请日：2012-08-22

Applicant: Shinji Okada ,  Masatoshi Shiraishi ,  Masatoshi Deguchi ,  Xavier Francois Brun ,  Charles Wayne Singleton, Jr. ,  Kabirkumar Mirpuri

Inventor： Shinji Okada ,  Masatoshi Shiraishi ,  Masatoshi Deguchi ,  Xavier Francois Brun ,  Charles Wayne Singleton, Jr. ,  Kabirkumar Mirpuri

IPC: H01L21/00 ,  H01L21/66 ,  H01L21/67 ,  H01L21/02 ,  H01L21/683

CPC classification number: H01L22/12 ,  H01L21/02068 ,  H01L21/67017 ,  H01L21/67092 ,  H01L21/6715 ,  H01L21/6835 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  Y10T156/1911

Abstract: A superposed wafer is separated to a processing target wafer and a supporting wafer while being heated. Then, an adhesive on a joint surface of the processing target wafer is removed by supplying an organic solvent onto the joint surface of the processing target wafer. Then, an oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed by supplying acetic acid to the joint surface of the processing target wafer. Then, the joint surface of the processing target wafer is inspected. Then, based on an inspection result, the adhesive on the joint surface of the processing target wafer is removed and the oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed.

公开(公告)号：US20150001706A1

公开(公告)日：2015-01-01

申请号：US13929087

申请日：2013-06-27

Applicant: Kabirkumar Mirpuri ,  Yoshihiro Tomita

Inventor： Kabirkumar Mirpuri ,  Yoshihiro Tomita

IPC: H01L23/00

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L23/49833 ,  H01L2224/11005 ,  H01L2224/11312 ,  H01L2224/11848 ,  H05K3/3463 ,  H05K3/3468 ,  H05K2203/0557 ,  H01L2924/00012

Abstract: A method includes positioning a solder mask on an integrated circuit (IC) package substrate with the solder mask having cavities that extend to the IC package substrate, applying molten solder to the flexible solder mask to fill the cavities of the solder mask with solder, and removing the solder mask to expose solder bumps on the IC package substrate. The molten solder includes silver and an additive to reduce formation of a silver compound that causes deformation of solder bumps.

Abstract translation: 一种方法包括将焊接掩模定位在集成电路（IC）封装衬底上，其中焊料掩模具有延伸到IC封装衬底的空腔，将熔融焊料施加到柔性焊料掩模以用焊料填充焊料掩模的空腔，以及 去除焊接掩模以暴露IC封装衬底上的焊料凸块。 熔融焊料包括银和添加剂以减少引起焊料凸块变形的银化合物的形成。