公开(公告)号：US06433418B1

公开(公告)日：2002-08-13

申请号：US09301345

申请日：1999-04-29

申请人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Seiichi Orimo ,  Kazuhiko Mitobe ,  Masaaki Seki ,  Masaki Waki ,  Toshio Hamano ,  Katsuhiro Hayashida ,  Yoshitsugu Katoh ,  Hiroshi Inoue

发明人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Seiichi Orimo ,  Kazuhiko Mitobe ,  Masaaki Seki ,  Masaki Waki ,  Toshio Hamano ,  Katsuhiro Hayashida ,  Yoshitsugu Katoh ,  Hiroshi Inoue

IPC分类号： H01L2302

CPC分类号： H01L23/49555 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/05599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85399 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device includes a resin package in which a semiconductor chip is sealed, the resin package having a first surface and a second surface opposite to the first surface; a plurality of leads having inner lead parts connected to the semiconductor chip and outer lead parts extending outside the resin package, the outer lead parts being bent along the shape of the resin package so as to form first terminal parts on the second surface and second terminal parts on the first surface; connection means electrically connecting the semiconductor chip and the leads; and a positioning mechanism provided either on the leads or on the resin package, which positions the outer lead parts by engaging a part of the outer lead parts to the resin package. Further, at least one of the leads and/or connection means is cut so as to electrically disconnect the semiconductor chip and the one of the leads and/or connection elements.

摘要翻译： 半导体器件包括其中半导体芯片被密封的树脂封装，所述树脂封装具有第一表面和与第一表面相对的第二表面; 多个引线，其具有连接到所述半导体芯片的内部引线部分和在所述树脂封装体外部延伸的外部引线部分，所述外部引线部分沿着所述树脂封装件的形状弯曲，以在所述第二表面上形成第一端子部分， 第一表面上的零件; 连接装置电连接半导体芯片和引线; 以及设置在引线上或树脂封装上的定位机构，其通过将外引线部分的一部分接合到树脂封装来定位外引线部分。 此外，切断引线和/或连接装置中的至少一个，以便使半导体芯片和引线和/或连接元件中的一个电气断开。

公开(公告)号：US6094356A

公开(公告)日：2000-07-25

申请号：US8305

申请日：1998-01-16

申请人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Kazuhiko Mitobe ,  Katsuhiro Hayashida ,  Masaaki Seki ,  Seiichi Orimo ,  Toshio Hamano

发明人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Kazuhiko Mitobe ,  Katsuhiro Hayashida ,  Masaaki Seki ,  Seiichi Orimo ,  Toshio Hamano

IPC分类号： H01L21/60 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H05H7/12

CPC分类号： H01L23/49555 ,  H01L23/3107 ,  H01L24/01 ,  H01L2224/16 ,  H01L2924/3011

摘要： A semiconductor device including a semiconductor chip, connection parts arranged along one end of the semiconductor chip, and external connection terminals connected to the connection parts.

摘要翻译： 包括半导体芯片的半导体器件，沿着半导体芯片的一端布置的连接部件和连接到连接部件的外部连接端子。

公开(公告)号：US06333564B1

公开(公告)日：2001-12-25

申请号：US09336747

申请日：1999-06-21

申请人： Yoshitsugu Katoh ,  Mitsutaka Sato ,  Hiroshi Inoue ,  Seiichi Orimo ,  Akira Okada ,  Yoshihiro Kubota ,  Mitsuo Abe ,  Toshio Hamano ,  Yoshitaka Aiba ,  Tetsuya Fujisawa ,  Masaaki Seki ,  Noriaki Shiba

发明人： Yoshitsugu Katoh ,  Mitsutaka Sato ,  Hiroshi Inoue ,  Seiichi Orimo ,  Akira Okada ,  Yoshihiro Kubota ,  Mitsuo Abe ,  Toshio Hamano ,  Yoshitaka Aiba ,  Tetsuya Fujisawa ,  Masaaki Seki ,  Noriaki Shiba

IPC分类号： H01L2348

CPC分类号： H01L23/3107 ,  H01L23/4334 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2924/18165 ,  H01L2924/3511 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2224/05599

摘要： A semiconductor device and a method of producing the same, the device including a semiconductor chip; balls which function as external connecting terminals; a substrate which electrically connects the semiconductor chip and the balls; a mold resin which seals at least a part of the semiconductor chip; and a connecting portion sealing resin which seals the connecting portion between the substrate and the semiconductor chip. The semiconductor device is mounted onto a printed circuit board via the balls. The thermal expansion coefficient of the mold resin is matched with the thermal expansion coefficient of the printed circuit board. A side surface holding portion for the holding the side surfaces of the semiconductor chip is formed in the mold resin to restrict thermal deformation of the semiconductor chip.

摘要翻译： 一种半导体器件及其制造方法，该器件包括半导体芯片; 作为外部连接端子的球; 电连接半导体芯片和滚珠的基板; 模制树脂，其密封半导体芯片的至少一部分; 以及密封基板和半导体芯片之间的连接部分的连接部密封树脂。 半导体器件通过球安装到印刷电路板上。 模制树脂的热膨胀系数与印刷电路板的热膨胀系数相匹配。 在模制树脂中形成用于保持半导体芯片的侧表面的侧表面保持部分，以限制半导体芯片的热变形。

公开(公告)号：US5984699A

公开(公告)日：1999-11-16

申请号：US790982

申请日：1997-01-29

申请人： Masaki Waki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Tadashi Uno ,  Kazuhiko Mitobe ,  Tetsuya Fujisawa

发明人： Masaki Waki ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Tadashi Uno ,  Kazuhiko Mitobe ,  Tetsuya Fujisawa

IPC分类号： H05K1/18 ,  H01L21/60 ,  H01L23/495 ,  H01L23/50 ,  H01L21/44

CPC分类号： H01L24/27 ,  H01L23/4951 ,  H01L23/49551 ,  H01L24/32 ,  H01L2224/05554 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/85439 ,  H01L2224/92147 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/07802 ,  H01L2924/181

摘要： A lead frame is formed by subjecting a frame base to a forming process, a semiconductor chip is fixed on leads formed in the lead frame and wires are provided in the semiconductor chip, and then a package which accommodates the semiconductor chip is formed; a non-conductive adhesive being provided, before the forming process, on a position on the frame base in which the leads are formed, and unnecessary portions of the frame base and the non-conductive adhesive being removed in the forming process so that the leads having a predetermined configuration and provided with the non-conductive adhesive are formed.

摘要翻译： 通过对框架基底进行成形工序来形成引线框架，将半导体芯片固定在引线框架中形成的引线上，并且在半导体芯片中设置布线，然后形成容纳半导体芯片的封装; 在成形工艺之前，在形成引线的框架基座上的位置上设置不导电粘合剂，并且在成形过程中除去框架基座和非导电粘合剂的不必要部分，使得引线 形成具有预定构造并且设置有非导电粘合剂的形状。

公开(公告)号：US6060768A

公开(公告)日：2000-05-09

申请号：US935892

申请日：1997-09-23

申请人： Katsuhiro Hayashida ,  Mitsutaka Sato ,  Tadashi Uno ,  Tetsuya Fujisawa ,  Masaki Waki

发明人： Katsuhiro Hayashida ,  Mitsutaka Sato ,  Tadashi Uno ,  Tetsuya Fujisawa ,  Masaki Waki

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/12 ,  H01L23/28 ,  H01L23/31 ,  H01L23/495 ,  H01L23/50 ,  H01L23/48 ,  H01L29/46

CPC分类号： H01L21/565 ,  H01L23/3107 ,  H01L23/4951 ,  H01L23/49548 ,  H01L24/05 ,  H01L24/06 ,  H01L24/83 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05 ,  H01L2224/05554 ,  H01L2224/06136 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/48599 ,  H01L2224/73215 ,  H01L2224/78301 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/85181 ,  H01L2224/92147 ,  H01L24/45 ,  H01L24/48 ,  H01L24/78 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/15173 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576

摘要： A semiconductor device includes a semiconductor chip in which electrode pads are formed with a first pitch, leads electrically connected with the electrode pads through lines, and sealing plastic sealing the semiconductor chip. In the semiconductor device, projections used for external connection ports are formed in the leads with a second pitch. The sealing plastic seals the lines connecting the electrode pads and the leads, but the projections are exposed from the sealing plastic.

摘要翻译： 半导体器件包括：半导体芯片，其中电极焊盘形成有第一间距，通过线与电极焊盘电连接，并密封塑料密封半导体芯片。 在半导体器件中，用于外部连接端口的突起以第二间距形成在引线中。 密封塑料密封连接电极焊盘和引线的线，但凸起从密封塑料露出。

公开(公告)号：US5760471A

公开(公告)日：1998-06-02

申请号：US794763

申请日：1997-02-03

申请人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Junichi Kasai ,  Masataka Mizukoshi ,  Kousuke Otokita ,  Hiroshi Yoshimura ,  Katsuhiro Hayashida ,  Akira Takashima ,  Masahiko Ishiguri ,  Michio Sono

发明人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Junichi Kasai ,  Masataka Mizukoshi ,  Kousuke Otokita ,  Hiroshi Yoshimura ,  Katsuhiro Hayashida ,  Akira Takashima ,  Masahiko Ishiguri ,  Michio Sono

IPC分类号： H01L23/495 ,  H01L25/10 ,  H01L23/48 ,  H01L23/02 ,  H01L23/12 ,  H01L23/50

CPC分类号： H01L23/4951 ,  H01L23/49551 ,  H01L25/105 ,  H01L2224/05647 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/48465 ,  H01L2224/73215 ,  H01L2224/8547 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/07802 ,  H01L2924/12042

摘要： A semiconductor device including a semiconductor element, and leads connected with the semiconductor element. Each of the leads includes an outer lead part for being connected externally. The semiconductor device further includes a plastic package sealing the semiconductor element and the leads. In the semiconductor device, the outer lead part is exposed to the outside of a side face of the plastic package, and the plastic package is mounted on any base in a standing form by the side face contacting the base.

摘要翻译： 包括半导体元件的半导体器件和与半导体元件连接的引线。 每个引线包括用于外部连接的外引线部分。 半导体器件还包括密封半导体元件和引线的塑料封装。 在半导体器件中，外部引线部分暴露于塑料封装的侧面的外侧，塑料封装通过与底座接触的侧面以立式形式安装在任何基座上。

公开(公告)号：US07692294B2

公开(公告)日：2010-04-06

申请号：US11843948

申请日：2007-08-23

申请人： Yoshitsugu Katoh ,  Tetsuya Fujisawa ,  Mitsutaka Sato ,  Eiji Yoshida

发明人： Yoshitsugu Katoh ,  Tetsuya Fujisawa ,  Mitsutaka Sato ,  Eiji Yoshida

IPC分类号： H01L23/34

CPC分类号： H01L23/4334 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/97 ,  H01L2224/05553 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/07802 ,  H01L2924/10162 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/181 ,  H01L2924/19043 ,  H01L2224/83 ,  H01L2224/85 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/92247 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device with a structure having superior heat sink characteristics. A first heat sink member is located over a wiring board by using an adhesive material. A semiconductor element is stuck over the first heat sink member by using an adhesive material. The semiconductor element and electrodes located over the wiring board are connected by wires. A second heat sink member which covers the semiconductor element and the wires is joined to the first heat sink member by using a conductive adhesive material. The inside and outside of the second heat sink member are sealed by resin except a flat top thereof. By doing so, the semiconductor device is fabricated. Heat which is generated in the semiconductor element and which is transmitted to the first heat sink member is released from an edge portion of the first heat sink member. In addition, the heat which is generated in the semiconductor element and which is transmitted to the first heat sink member is transmitted to the conductive adhesive material and the second heat sink member and is released from the flat top of the second heat sink member.

摘要翻译： 具有散热特性优异的结构的半导体器件。 第一散热构件通过使用粘合剂材料位于布线板上。 半导体元件通过使用粘合材料粘附在第一散热构件上。 位于布线板上的半导体元件和电极通过导线连接。 覆盖半导体元件和电线的第二散热构件通过使用导电粘合剂材料接合到第一散热构件。 第二散热构件的内部和外部除了其平坦的顶部之外由树脂密封。 通过这样做，制造半导体器件。 在半导体元件中产生并且传递到第一散热构件的热量从第一散热构件的边缘部分释放。 此外，在半导体元件中产生并且传递到第一散热构件的热量传递到导电粘合剂材料和第二散热构件，并从第二散热构件的平坦顶部释放。

公开(公告)号：US06696754B2

公开(公告)日：2004-02-24

申请号：US10214306

申请日：2002-08-08

申请人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

发明人： Mitsutaka Sato ,  Tetsuya Fujisawa ,  Shigeyuki Maruyama ,  Junichi Kasai ,  Toshimi Kawahara ,  Toshio Hamano ,  Yoshihiro Kubota ,  Mitsunada Osawa ,  Yoshiyuki Yoneda ,  Kazuto Tsuji ,  Hirohisa Matsuki

IPC分类号： H01L2334

CPC分类号： H01L25/105 ,  H01L2224/48227 ,  H01L2225/1023 ,  H01L2924/09701 ,  H01L2924/1533 ,  H01L2924/3025 ,  H01R12/82 ,  H05K7/1431 ,  H01L2924/00

摘要： A semiconductor module includes a plurality of semiconductor devices each including a circuit substrate carrying thereon a single memory semiconductor chip and a socket for holding the semiconductor devices detachably.

摘要翻译： 半导体模块包括多个半导体器件，每个半导体器件包括承载有单个存储器半导体芯片的电路衬底和用于可拆卸地保持半导体器件的插座。

公开(公告)号：US5801439A

公开(公告)日：1998-09-01

申请号：US804270

申请日：1997-02-21

申请人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Junichi Kasai ,  Masataka Mizukoshi ,  Kosuke Otokita ,  Hiroshi Yoshimura ,  Katsuhiro Hayashida ,  Akira Takashima ,  Masahiko Ishiguri ,  Michio Sono

发明人： Tetsuya Fujisawa ,  Mitsutaka Sato ,  Junichi Kasai ,  Masataka Mizukoshi ,  Kosuke Otokita ,  Hiroshi Yoshimura ,  Katsuhiro Hayashida ,  Akira Takashima ,  Masahiko Ishiguri ,  Michio Sono

IPC分类号： H01L23/28 ,  H01L23/495 ,  H01L23/50 ,  H01L25/10 ,  H01L25/11 ,  H01L25/18 ,  H01L23/48 ,  H01L27/10

CPC分类号： H01L23/4951 ,  H01L25/105 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/1041 ,  H01L2225/107 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/12042

摘要： A semiconductor device includes a semiconductor element, a package sealing the semiconductor element, and leads for passing signals between the semiconductor element and an external device. Each of the leads has an inner-lead part sealed within the package and connected with the semiconductor element, and an outer-lead part which extends outward from the package toward a top of the package, and is to be connected to the external device. The outer-lead part includes a first-port part at a lower side of the package, and a second-port part at an upper side of the package.

摘要翻译： 半导体器件包括半导体元件，密封半导体元件的封装以及用于在半导体元件和外部器件之间传递信号的引线。 每个引线具有密封在封装内并与半导体元件连接的内引线部分，以及从封装向外朝向封装顶部延伸并且连接到外部装置的外引线部分。 外引线部分包括在封装的下侧的第一端口部分和在封装的上侧的第二端口部分。

公开(公告)号：US5786985A

公开(公告)日：1998-07-28

申请号：US749734

申请日：1996-11-15

申请人： Norio Taniguchi ,  Junichi Kasai ,  Kazuto Tsuji ,  Michio Sono ,  Masanori Yoshimoto ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Hiroshi Yoshimura ,  Tadashi Uno ,  Kosuke Otokita ,  Tetsuya Fujisawa

发明人： Norio Taniguchi ,  Junichi Kasai ,  Kazuto Tsuji ,  Michio Sono ,  Masanori Yoshimoto ,  Katsuhiro Hayashida ,  Mitsutaka Sato ,  Hiroshi Yoshimura ,  Tadashi Uno ,  Kosuke Otokita ,  Tetsuya Fujisawa

IPC分类号： H01L21/98 ,  H01L23/495 ,  H01L25/10 ,  H05K3/30 ,  H05K7/20

CPC分类号： H01L25/50 ,  H01L23/4951 ,  H01L23/49568 ,  H01L25/105 ,  H05K3/301 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73265 ,  H01L2225/1005 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2225/1094 ,  Y10S269/903

摘要： A semiconductor device is adapted to be mounted on a circuit substrate in an approximate vertical position. The semiconductor device includes a semiconductor chip, a stage having a first surface and a second surface opposite to the first surface, where the semiconductor chip is mounted on the first surface, a resin package encapsulating the semiconductor chip, where the resin package has upper and lower surfaces and side surfaces, a plurality of leads respectively having one end electrically connected to the semiconductor chip and another end extending downwardly from the lower surface of the resin package, and an upper extension, provided on the stage, extending upwardly from the upper surface of the resin package.

摘要翻译： 半导体器件适于以大致垂直位置安装在电路基板上。 半导体器件包括半导体芯片，具有第一表面和与第一表面相对的第二表面的阶段，其中半导体芯片安装在第一表面上，树脂封装封装半导体芯片，其中树脂封装具有上部和 下表面和侧表面，分别具有电连接到半导体芯片的一端和从树脂封装的下表面向下延伸的另一端的多个引线以及设置在台上的从上表面向上延伸的上延伸部 的树脂包装。