公开(公告)号：US5643831A

公开(公告)日：1997-07-01

申请号：US547532

申请日：1995-10-24

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi ,  Yutaka Yamada ,  Susumu Abe

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi ,  Yutaka Yamada ,  Susumu Abe

IPC分类号： B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H01L21/283

CPC分类号： H05K3/3484 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/1476 ,  H05K3/3463 ,  H05K3/3489

摘要： A method for fabricating a semiconductor device using a solder ball forming plate having cavities. The plate is made from a silicon plate having a flat surface in a crystallographic plane, and an orientation flat in a crystallographic plane. The cavities are formed on the flat surface of the plate by etching, using a mask having openings in the shape of rhombus arranged such that one side of the rhombus is generally parallel to the crystallographic plane. As a result, the cavities having wedge-shaped bottom are formed. The cavities are then filled with a solder paste and are heated to form solder balls in the cavities while the plate in an inclined position. The solder balls are then transferred from the plate to a semiconductor chip.

摘要翻译： 一种使用具有空腔的焊球形成板制造半导体器件的方法。 该板由具有<110>结晶平面中的平坦表面的硅板制成，并且在<1-11>晶面中平行取向。 通过蚀刻在板的平坦表面上形成空腔，使用具有菱形形状的开口的掩模，其布置成使得菱形的一侧大致平行于<1-11>晶面。 结果，形成了具有楔形底部的空腔。 然后用焊膏填充空腔，并在板中处于倾斜位置的同时加热以在空腔中形成焊球。 然后将焊球从板转移到半导体芯片。

公开(公告)号：US06528346B2

公开(公告)日：2003-03-04

申请号：US09749521

申请日：2000-12-28

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC分类号： H01L2148

CPC分类号： B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H01L2924/351 ,  H05K3/3463 ,  H05K3/3478 ,  H05K3/3484 ,  H05K3/3489 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H01L2924/00 ,  H01L2224/05599

摘要： First and second ball forming plates are prepared. The cavities of the first plate and the cavities of the second plate 20 are filled with solder paste, respectively. The first plate and the second plate are placed in a facing relationship to each other and heated to form metal balls each of which corresponds to the total metal components of the solder paste in one cavity of the first plate and one cavity in the second plate. The metal balls are formed in the cavities of the lower plate 10. The metal balls are transferred from the cavities of the first plate to a device on which bumps are to be formed.

摘要翻译： 制备第一和第二球形成板。 第一板的空腔和第二板20的空腔分别用焊膏填充。 第一板和第二板相互放置成面对的关系，并加热形成金属球，每个金属球对应于第一板的一个空腔中的焊膏的总金属成分和第二板中的一个空腔。 金属球形成在下板10的空腔中。金属球从第一板的空腔传送到要在其上形成凸块的装置。

公开(公告)号：US6025258A

公开(公告)日：2000-02-15

申请号：US516284

申请日：1995-08-17

申请人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

发明人： Masayuki Ochiai ,  Hidefumi Ueda ,  Michio Sono ,  Ichiro Yamaguchi ,  Kazuhiko Mitobe ,  Koki Otake ,  Junichi Kasai ,  Nobuo Kamehara ,  Yasuo Yamagishi ,  Masataka Mizukoshi

IPC分类号： B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  H01L21/283

CPC分类号： H01L24/742 ,  B23K3/0623 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H05K3/3484 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/0558 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15787 ,  H05K2201/10992 ,  H05K2203/0113 ,  H05K2203/016 ,  H05K2203/0278 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K2203/087 ,  H05K2203/1105 ,  H05K2203/1157 ,  H05K2203/1476 ,  H05K3/3463 ,  H05K3/3489

摘要： A method for fabricating solder bumps onto a semiconductor chip. A solder ball forming member having a flat surface and a plurality of cavities arranged on the flat surface in a predetermined pattern is prepared. The cavities are then filled with a solder paste, and the solder ball forming member is heated to a temperature higher than the melting point of the solder so that the molten solder powder in the solder paste form solder balls due to surface tension. The semiconductor chip is then moved toward the solder ball forming member to transfer the heated solder balls from the solder ball forming member to the semiconductor chip.

摘要翻译： 一种用于在半导体芯片上制造焊料凸块的方法。 制备具有平坦表面的焊球形成构件和以预定图案布置在平坦表面上的多个空腔。 然后用焊膏填充空腔，并将焊球形成构件加热到高于焊料熔点的温度，使得焊膏中的熔融焊料粉由于表面张力而形成焊球。 然后将半导体芯片移动到焊球形成部件，以将加热的焊球从焊球形成部件转移到半导体芯片。

公开(公告)号：US5629269A

公开(公告)日：1997-05-13

申请号：US332479

申请日：1994-10-31

申请人： Kazunori Yamanaka ,  Takuya Uzumaki ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Kazunori Yamanaka ,  Takuya Uzumaki ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： H01L39/24 ,  B05D5/12 ,  B05D1/32

CPC分类号： H01L39/2461 ,  Y10S505/741

摘要： Disclosed is a process for forming a super-conducting film, which a multi-layer metal film (buffer film) is formed at a specific temperature on a ceramic substrate and a superconducting film is formed at a specific temperature on the multi-layer metal film. According to this process, a superconducting film having a high critical temperature can be formed over the ceramic substrate while controlling or suppressing the occurrence of a chemical reaction between the substrate and the superconducting film, and required superconducting performances can be manifested or exhibited.

摘要翻译： 公开了一种用于形成超导膜的方法，其中在特定温度下在陶瓷基板上形成多层金属膜（缓冲膜），并且在特定温度下在多层金属膜上形成超导膜 。 根据该方法，可以在陶瓷基板上形成具有高临界温度的超导膜，同时控制或抑制基板与超导膜之间的化学反应的发生，并且可以显示或显示所需的超导性能。

公开(公告)号：US5081070A

公开(公告)日：1992-01-14

申请号：US268195

申请日：1989-01-30

申请人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

发明人： Hiromitsu Yokoyama ,  Yoshihiko Imanaka ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa ,  Takuya Uzumaki ,  Hitoshi Suzuki ,  Takato Machi

IPC分类号： H01L39/02 ,  B32B18/00 ,  C01G1/00 ,  C01G3/00 ,  C04B35/00 ,  C04B35/45 ,  H01B12/00 ,  H01B13/00 ,  H01L21/48 ,  H01L21/768 ,  H01L23/498 ,  H01L39/06 ,  H01L39/24 ,  H05K1/09

CPC分类号： H01L21/4846 ,  B32B18/00 ,  C04B35/4504 ,  C04B35/4512 ,  C04B35/4521 ,  C04B37/005 ,  C04B37/006 ,  H01L21/76891 ,  H01L23/49888 ,  H01L39/2429 ,  C04B2235/483 ,  C04B2235/6567 ,  C04B2237/06 ,  C04B2237/066 ,  C04B2237/09 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/59 ,  C04B2237/68 ,  C04B2237/704 ,  C04B2237/708 ,  H01L2924/0002 ,  H01L2924/09701 ,  Y10S428/901 ,  Y10S428/93 ,  Y10S505/701 ,  Y10S505/702 ,  Y10S505/703 ,  Y10S505/704 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A superconducting circuit board is provided comprising a sintered alumina board containing more than 99% by weight of alumina and an interconnection pattern of an superconducting ceramics formed on the alumina board. Adhesion of the interconnection pattern to the alumina board is improved by an addition of Ti or Si coupling agent to a paste for forming the interconnection pattern. The use of copper powder in place of copper oxide powder as an ingredient forming a superconducting ceramics in the paste is advantageous for printing and obtaining a uniform superconducting ceramic pattern.

摘要翻译： 提供了一种超导电路板，其包括含有超过99重量％的氧化铝的烧结氧化铝板和形成在氧化铝板上的超导陶瓷的互连图案。 通过在用于形成互连图案的糊料中添加Ti或Si偶联剂来改善互连图案与氧化铝板的粘合性。 使用铜粉代替氧化铜粉末作为糊料中形成超导陶瓷的成分有利于印刷和获得均匀的超导陶瓷图案。

公开(公告)号：US5049541A

公开(公告)日：1991-09-17

申请号：US382180

申请日：1989-07-19

申请人： Takuya Uzumaki ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Takuya Uzumaki ,  Kazunori Yamanaka ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： C04B35/45 ,  H01L39/24

CPC分类号： C04B35/4517 ,  C04B35/4525 ,  H01L39/2477 ,  Y10S505/782

摘要： Superconductors of the Bi-Pb-Sr-Ca-Cu-O system and Tl-Pb-Ba-Ca-Cu-O system having a high Tc phase (about 110K and about 125K, respectively, or more) at a high proportion are obtained by adding a calcium compound which forms CaO and a liquid phase at a temperature for firing the superconductors, e.g., Ca.sub.2 PbO.sub.x (x=3 or 4); or by starting form a composition represented by the formula: Bi.sub.2 Pb.sub.(n-1)/2 Sr.sub.2 Ca.sub.n Cu.sub.n+1 O.sub.b, or Tl.sub.2 Pb.sub.(n-1)/2 Ba.sub.2 Ca.sub.n Cu.sub.n+1 Ob where 2.ltoreq.n.ltoreq.10, 5.ltoreq.b.ltoreq.40.5, i.e., at a ratio of Ca:Pb=2:1.

公开(公告)号：US4761325A

公开(公告)日：1988-08-02

申请号：US762310

申请日：1985-08-02

申请人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

发明人： Kazuaki Kurihara ,  Nobuo Kamehara ,  Hiromitsu Yokoyama ,  Hiromi Ogawa ,  Kishio Yokouchi ,  Yoshihiko Imanaka ,  Koichi Niwa

IPC分类号： C03C10/00 ,  C04B35/14 ,  C04B35/16 ,  C04B35/18 ,  C04B35/632 ,  H01L21/48 ,  H01L23/15 ,  H05K1/03 ,  H05K1/09 ,  H05K3/46 ,  B32B3/00

CPC分类号： H05K3/4667 ,  C03C10/0009 ,  H01L21/4857 ,  H01L21/4867 ,  H01L23/15 ,  H05K1/0306 ,  H05K3/46 ,  H05K3/4629 ,  C03C2214/04 ,  C03C2214/20 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/3011 ,  H05K1/092 ,  H05K2203/086 ,  H05K2203/088 ,  H05K2203/1126 ,  H05K3/1291 ,  H05K3/4611 ,  Y10S428/901 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/252

摘要： A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

公开(公告)号：US5458709A

公开(公告)日：1995-10-17

申请号：US867513

申请日：1992-04-13

申请人： Hiroshi Kamezaki ,  Masato Wakamura ,  Kishio Yokouchi ,  Nobuo Kamehara

发明人： Hiroshi Kamezaki ,  Masato Wakamura ,  Kishio Yokouchi ,  Nobuo Kamehara

IPC分类号： H05K1/03 ,  H01L21/48 ,  H01L23/15 ,  H05K3/46 ,  B32B18/00

CPC分类号： H01L23/15 ,  H01L21/4807 ,  H01L2924/0002 ,  H01L2924/09701

摘要： A process for manufacturing a multi-layer glass ceramic substrate which includes the steps of forming green sheets containing ceramic powders and glass powders as main ingredients, laminating the green sheets, and firing the laminated green sheets to form a multi-layer glass ceramic substrate, wherein at least one green sheet containing porous glass powders as a part of the glass powders, is provided to control the shrinkage of the green sheets and prevent cracks or delamination. The preferred process includes the steps of forming a single layer by i) forming first green sheets containing ceramic powders, glass powders, hollow glass spheres and porous glass powders as main ingredients, ii) forming an interconnection layer on each of the first green sheets, and iii) laminating the first green sheets with the interconnection layer; sandwiching the signal layer between upper and lower green sheets containing ceramic powders and glass powders as main ingredients; and firing the sandwiched signal layer to form the multi-layer glass ceramic substrate.

摘要翻译： 一种多层玻璃陶瓷基板的制造方法，其特征在于，包括以下工序：形成含有陶瓷粉末和玻璃粉末的生片，作为主要成分，层叠生片，烧成层叠的生片以形成多层玻璃陶瓷基板， 其中提供至少一个含有多孔玻璃粉末作为玻璃粉末的一部分的生片，以控制生片的收缩并防止裂纹或分层。 优选的方法包括以下步骤：i）形成包含陶瓷粉末，玻璃粉末，中空玻璃球和多孔玻璃粉末的第一生坯作为主要成分，ii）在每个第一生坯上形成互连层， 以及iii）将所述第一生片与所述互连层层叠; 将信号层夹在含有陶瓷粉末和玻璃粉末的上下生片之间作为主要成分; 并且对夹层信号层进行烧成以形成多层玻璃陶瓷基板。

公开(公告)号：US5306702A

公开(公告)日：1994-04-26

申请号：US860505

申请日：1992-06-17

申请人： Atsushi Tanaka ,  Nobuo Kamehara ,  Koichi Niwa

发明人： Atsushi Tanaka ,  Nobuo Kamehara ,  Koichi Niwa

IPC分类号： C04B35/00 ,  C01G1/00 ,  C01G29/00 ,  C04B35/45 ,  C23C14/08 ,  C23C14/35 ,  C23C14/58 ,  H01L39/24 ,  B05D5/12 ,  C23C14/00

CPC分类号： C23C14/5806 ,  C23C14/087 ,  C23C14/58 ,  C23C14/5853 ,  H01L39/2451 ,  Y10S505/728 ,  Y10S505/73 ,  Y10S505/731 ,  Y10S505/742

摘要： A process for producing a Bi-based perovskite superconducting film, comprising the steps of forming on a substrate a Pb-film, containing Bi-base material film comprising Bi, Pb, Sr, Ca and Cu in a Bi:Pb:Sr:Ca:Cu molar ratio of (1.9 to 2.1):(1.2 to 2.2, preferably 1.5 to 1.8):2:(1.9 to 2.2):(3 to 3.5) and sintering the Pb-containing Bi-base material film in an oxygen-containing atmosphere. The sintering step includes a main sintering period of 20 to 120 minutes, in which the temperature is raised from a first temperature to a second temperature, with the second temperature being in a range of 850.degree. to 860.degree. C., and the temperature rise in the main sintering period of 20 to 120 minutes being from 3.degree. to 10.degree. C.

摘要翻译： PCT No.PCT / JP91 / 01423 Sec。 371日期：1992年6月17日 102（e）日期1992年6月17日PCT 1991年10月17日PCT公布。 出版物WO92 / 06923 日本1992年04月30日。一种Bi系钙钛矿超导膜的制造方法，其特征在于，在基板上形成含有Bi，Pb，Sr，Ca，Cu的Bi基材料膜的Pb膜， Bi：Pb：Sr：Ca：Cu的摩尔比为（1.9〜2.1）：1.2〜2.2，优选为1.5〜1.8）：2：（1.9〜2.2）:( 3〜3.5） 在含氧气氛中的基材膜。 烧结步骤包括20〜120分钟的主烧结期间，其中温度从第一温度升至第二温度，第二温度在850℃至860℃的范围内，温度升高 在20〜120分钟的主烧结时间为3〜10℃。

公开(公告)号：US5287620A

公开(公告)日：1994-02-22

申请号：US894984

申请日：1992-06-08

申请人： Hitoshi Suzuki ,  Wataru Yamagishi ,  Koichi Niwa ,  Kaoru Hashimoto ,  Nobuo Kamehara

发明人： Hitoshi Suzuki ,  Wataru Yamagishi ,  Koichi Niwa ,  Kaoru Hashimoto ,  Nobuo Kamehara

IPC分类号： H01L23/15 ,  H01L21/48 ,  H05K1/03 ,  H05K1/09 ,  H05K3/40 ,  H05K3/46 ,  H01K3/10

CPC分类号： H01L21/486 ,  H01L21/4867 ,  H05K3/4061 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0266 ,  H05K2203/1126 ,  H05K2203/1476 ,  H05K3/1291 ,  H05K3/4611 ,  H05K3/4629 ,  Y10T29/49165

摘要： A process of producing a multiple-layer glass-ceramic circuit board having a copper conductor, comprising the steps of: forming throughholes in a glass-ceramic green sheet at sites where via-contacts will be formed; filling the throughholes with a powder mixture of a copper powder blended with a ceramic powder, the copper powder and the ceramic powder having a powder particle size providing a packing density comparable with or greater than that of the glass-ceramic green sheet when filled in the throughholes; printing a conductor paste on the green sheet having the throughholes filled with the powder mixture, to form a circuit conductor pattern on the green sheet; laminating a plurality of the green sheets having the conductor pattern formed thereon, to form a laminate body; heating the laminate body to thereby remove a binder therefrom and preliminary-fire the laminate body; and firing the preliminary-fired body.

摘要翻译： 一种制造具有铜导体的多层玻璃 - 陶瓷电路板的方法，包括以下步骤：在玻璃 - 陶瓷生片中形成通孔，该通孔将形成通孔接触点; 用与陶瓷粉末混合的铜粉末的粉末混合物填充通孔，所述铜粉末和陶瓷粉末具有提供与玻璃 - 陶瓷生片相当或更大的填充密度的粉末粒度，当填充在 通孔 在具有填充有粉末混合物的通孔的生片上印刷导体膏，以在生片上形成电路导体图案; 层叠形成有导体图案的多个生片，以形成层压体; 加热层压体，从而除去粘合剂，预热层压体; 并开火初烧机构。