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1.发明申请公开(公告)号：US20070295982A1
公开(公告)日：2007-12-27
申请号：US11580495
申请日：2006-10-13
申请人： Ki Tae Ryu , Nam Young Cho , Yong An Kwon , Hee Bong Lee
发明人： Ki Tae Ryu , Nam Young Cho , Yong An Kwon , Hee Bong Lee
CPC分类号： H01L24/83 , G06K19/07732 , G06K19/07743 , H01L23/544 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/97 , H01L25/075 , H01L25/16 , H01L25/18 , H01L2223/54486 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/274 , H01L2224/29111 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48499 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/49113 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2224/85013 , H01L2224/85051 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2224/85986 , H01L2224/97 , H01L2225/0651 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2224/85186 , H01L2224/92247 , H01L2224/85 , H01L2224/83 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： The present invention relates to a micro USB memory package and a method for manufacturing the same. The object of the present invention is to provide a micro USB memory package and a method for manufacturing the same, which can meet the USB standard specification, can have light, thin, short and small configuration, can have various applications, and can simply expand the memory capacity thereof.In order to accomplish the object of the present invention, there is disclosed a micro USB memory package, which comprises a substrate with a plurality of circuit patterns formed on the top surface thereof, at least one of passive elements connected with the circuit patterns of the substrate, at least one of controllers connected with the circuit patterns of the substrate, at least one of flash memories connected with the circuit patterns of the substrate, and an encapsulation part encapsulating the passive elements, the controllers and the flash memories on the substrate, and at least one of USB lands connected with the circuit patterns by a conducting via are formed on the under surface of one side of the substrate.
摘要翻译： 本发明涉及微型USB存储器封装及其制造方法。 本发明的目的是提供一种微型USB存储器封装及其制造方法，其可以满足USB标准规范，可以具有轻，薄，短和小配置，可以具有各种应用，并且可以简单地扩展 其存储容量。 为了实现本发明的目的，公开了一种微型USB存储器封装，其包括在其顶表面上形成有多个电路图案的基板，至少一个无源元件与电路图案 衬底，与衬底的电路图案连接的至少一个控制器，与衬底的电路图案连接的闪存中的至少一个以及封装在衬底上的无源元件，控制器和闪存的封装部分， 并且在基板的一侧的下表面上形成通过导电通孔与电路图案连接的USB焊盘中的至少一个。
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公开(公告)号：US6060778A
公开(公告)日：2000-05-09
申请号：US60981
申请日：1998-04-15
申请人： Tae Sung Jeong , Ki Tae Ryu , Tae Keun Lee , Keun Hyoung Choi , Han Shin Youn , Jum Sook Park
发明人： Tae Sung Jeong , Ki Tae Ryu , Tae Keun Lee , Keun Hyoung Choi , Han Shin Youn , Jum Sook Park
CPC分类号： H01L23/3128 , H01L23/13 , H01L23/36 , H01L2224/32225 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/49109 , H01L2224/73265 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L2924/01004 , H01L2924/01013 , H01L2924/01019 , H01L2924/01028 , H01L2924/01039 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/12041 , H01L2924/14 , H01L2924/15151 , H01L2924/15153 , H01L2924/15156 , H01L2924/1517 , H01L2924/15311 , H01L2924/1532 , H01L2924/181 , H01L2924/18165 , H01L2924/20753 , H01L2924/3025
摘要： Disclosed is a packaged integrated circuit device with high heat dissipation performance and low weight. The packaged integrated circuit device includes an interconnection substrate having at least one layer of conductive trace material and at least one layer of insulating material and also having a first surface and a second surface disposed opposite to the first surface and having a plurality of electrical contacts formed on the second surface. At least one metal thermal conductive layer having a first surface is attached on the first surface of the interconnection substrate and having a second surface exposed to an exterior. A through hole region is formed in the interconnection substrate and the thermal conductive layer. An integrated circuit chip having a first surface exposed to an exterior and having also a second surface with a plurality of bond pads, opposite to the first surface of the integrated circuit chip, is placed within the through hole region. A plurality of bond wires make an electrical connection of the bond pads with the conductive trace layers. The bond wires and the integrated circuit chip are enclosed with an insulating encapsulant material. The through hole region is also filled with the insulating encapsulant material.
摘要翻译： 公开了一种具有高散热性能和低重量的封装集成电路器件。 封装的集成电路器件包括互连衬底，其具有至少一层导电迹线材料和至少一层绝缘材料，并且还具有与第一表面相对设置的第一表面和第二表面，并且具有形成的多个电触头 在第二个表面。 具有第一表面的至少一个金属导热层附着在互连基板的第一表面上并具有暴露于外部的第二表面。 在互连基板和导热层中形成通孔区域。 集成电路芯片具有暴露于外部的第一表面，并且具有与集成电路芯片的第一表面相对的多个接合焊盘的第二表面放置在通孔区域内。 多个接合线使接合焊盘与导电迹线层电连接。 接合线和集成电路芯片用绝缘密封材料封装。 通孔区域也填充有绝缘密封剂材料。
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公开(公告)号：US07709946B2
公开(公告)日：2010-05-04
申请号：US11580495
申请日：2006-10-13
申请人： Ki Tae Ryu , Nam Young Cho , Yong An Kwon , Hee Bong Lee
发明人： Ki Tae Ryu , Nam Young Cho , Yong An Kwon , Hee Bong Lee
CPC分类号： H01L24/83 , G06K19/07732 , G06K19/07743 , H01L23/544 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/85 , H01L24/97 , H01L25/075 , H01L25/16 , H01L25/18 , H01L2223/54486 , H01L2224/131 , H01L2224/13144 , H01L2224/16225 , H01L2224/274 , H01L2224/29111 , H01L2224/2919 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/48499 , H01L2224/48639 , H01L2224/48644 , H01L2224/48647 , H01L2224/48655 , H01L2224/48664 , H01L2224/48739 , H01L2224/48744 , H01L2224/48747 , H01L2224/48755 , H01L2224/48764 , H01L2224/48839 , H01L2224/48844 , H01L2224/48847 , H01L2224/48855 , H01L2224/48864 , H01L2224/49113 , H01L2224/73265 , H01L2224/83101 , H01L2224/83191 , H01L2224/8385 , H01L2224/85013 , H01L2224/85051 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85455 , H01L2224/85464 , H01L2224/85986 , H01L2224/97 , H01L2225/0651 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/09701 , H01L2924/12041 , H01L2924/14 , H01L2924/1579 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/19105 , H01L2224/85186 , H01L2224/92247 , H01L2224/85 , H01L2224/83 , H01L2224/78 , H01L2924/00 , H01L2924/00012 , H01L2224/4554
摘要： A micro USB memory package and method for manufacturing the same, which can meet the USB standard specification, can have a light, thin, short and small configuration, can have various applications, and can simply expand the memory capacity thereof. The micro USB memory package comprises a substrate with a plurality of circuit patterns formed on the top surface thereof, at least one of passive elements connected with the circuit patterns of the substrate, at least one of controllers connected with the circuit patterns of the substrate, at least one of flash memories connected with the circuit patterns of the substrate, and an encapsulation part encapsulating the passive elements, the controllers and the flash memories on the substrate, and at least one of USB lands connected with the circuit patterns by a conducting via are formed on the under surface of one side of the substrate.
摘要翻译： 可以满足USB标准规格的微型USB存储器封装及其制造方法可以具有轻，薄，短和小配置，可以具有各种应用，并且可以简单地扩展其存储器容量。 该微型USB存储器包括：一个具有形成在其顶表面上的多个电路图案的衬底，与衬底的电路图形连接的至少一个无源元件，与衬底的电路图案相连的至少一个控制器， 与衬底的电路图案连接的闪存中的至少一个以及封装在衬底上的无源元件，控制器和闪速存储器的封装部分以及通过导电通孔连接到电路图案的USB焊盘中的至少一个 形成在基板的一侧的下表面上。
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